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MFRC63002HN,157

NXP Semiconductors

MFRC63002HN,157 by NXP Semiconductors

NXP Semiconductors' MFRC63002HN,157 is a telecom IC with 32 terminals in a square chip carrier package. It operates b/w -25 to 85°C and has a nominal voltage of 5V. Ideal for telecom circuits, it features a surface-mount design with a terminal pitch of 0.5mm.

Median Price

$4.460

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

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Arrow

USA . 850 parts In-Stock

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$2.753

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$2.753

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Chip1Stop

Japan . 850 parts In-Stock

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$4.460

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$4.460

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Mouser Electronics

USA . 1,581 parts In-Stock

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$5.440

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$3.760

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$3.650

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$5.440

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Verical

USA . 850 parts In-Stock

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850

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Digiode

USA . 1,971 parts In-Stock

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$2.401

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Nova Conductors

Japan . 50 parts In-Stock

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Anansix

USA . 1,128 parts In-Stock

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Vyrian

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Semicontronic

India . 865 parts In-Stock

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$1.090

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$1.063

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$1.057

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865

$1.090

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Corphita

USA . 4,494 parts In-Stock

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$2.274

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Continental Prestige Electronics

USA . 5,725 parts In-Stock

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$3.480

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$3.410

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Netroflash

USA . 2,000 parts In-Stock

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$3.480

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$3.306

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$3.236

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Argo Parts USA

USA . 707 parts In-Stock

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Corohmni

South Africa . 265 parts In-Stock

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Aztec Data Supply Inc.

USA . 4,443 parts In-Stock

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$9.650

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Perfect Parts

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UNI Independent Distributors

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Authorized Procurement Solutions

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Overview

Elevate your projects with the MFRC63002HN,157 by NXP Semiconductors. This high-quality telecom interface IC boasts unparalleled reliability and performance, making it a top choice for a wide range of applications. With its innovative design and advanced features, this product offers unmatched value to customers looking for seamless connectivity solutions. Upgrade your devices today with the MFRC63002HN,157 and experience the benefits of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring reliable performance.

Surface Mount: YES

Allows for easy installation and integration into electronic circuit boards.

Maximum Supply Voltage: 3.6 V

Provides flexibility in power supply options and compatibility with various systems.

Package Shape: SQUARE

Optimizes space utilization on the circuit board.

Bit Size: 32

Enables processing of data in 32-bit chunks, improving efficiency and performance.

DAC Channels: YES

Allows the microcontroller to interface with analog devices and provide accurate voltage outputs.

Power Supplies (V): 1.8/3.3

Supports a wide range of power supply voltages for flexibility in system design.

No. of Terminals: 64

Offers multiple connection points for interfacing with external components.

Package Style (Meter): FLATPACK, FINE PITCH

Facilitates compact and efficient PCB layout with fine pitch terminals.

Minimum Supply Voltage: 1.71 V

Ensures reliable operation even at lower supply voltages.

Maximum Operating Temperature: 105 °C

Suitable for industrial applications that require high operating temperatures.

CPU Family: CORTEX-M4

Utilizes a high-performance processor for efficient data processing.

Minimum Operating Temperature: -40 °C

Ideal for applications operating in extreme cold environments.

Terminal Finish: TIN

Provides corrosion resistance and ensures good electrical conductivity.

ADC Channels: YES

Enables the microcontroller to convert analog signals to digital data for processing.

DMA Channels: YES

Allows for direct memory access, improving data transfer speed and efficiency.

Terminal Position: QUAD

Enables easy connectivity and efficient layout on the circuit board.

ROM Words: 131072

Offers ample storage capacity for program code and data.

Width: 10 mm

Compact size for space-constrained applications.

Maximum Clock Frequency: 50 MHz

Supports high-speed processing for demanding applications.

Maximum Time At Peak Reflow Temperature (s): 40

Ensures reliable solder reflow process during manufacturing.

Peak Reflow Temperature °C: 260

Suitable for lead-free soldering processes.

Length: 10 mm

Compact size for efficient PCB layout.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial temperature environments.

Peripheral IC Type: MICROCONTROLLER

Specifically designed for microcontroller applications, ensuring optimal performance.

RAM Bytes: 32768

Provides sufficient memory for data storage and processing requirements.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity.

Terminal Form: GULL WING

Facilitates easy soldering and assembly during manufacturing.

Nominal Supply Voltage: 3.3 V

Standard voltage for compatibility with a wide range of systems.

PWM Channels: YES

Supports pulse width modulation for precise control of analog signals.

ROM Programmability: FLASH

Allows for easy programmability and updating of firmware.

Terminal Pitch: 0.5 mm

Fine pitch terminals for efficient PCB integration.

Moisture Sensitivity Level (MSL): 3

Suitable for reflow soldering processes with moderate sensitivity to moisture.

Speed: 72 rpm

Provides high-speed processing capabilities for efficient performance.

No. of I/O Lines: 40

Offers multiple input/output lines for connectivity and interfacing with external devices.

Technical Specifications

Other Function Telecom Interface ICs MFRC63002HN,157 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PQCC-N32

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

MFRC63002HN,157 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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