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MFRC63002HN

NXP Semiconductors

MFRC63002HN by NXP Semiconductors

The NXP Semiconductors MFRC63002HN is a telecom interface IC with 1 function. It has a square package and a terminal position of quad. With a max operating temperature of 85°C and min operating temperature of -25°C, it is suitable for various telecom circuit applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Chip Stock

USA . 24,834 parts In-Stock

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Anansix

USA . 2,411 parts In-Stock

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Nova Conductors

Japan . 500 parts In-Stock

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500

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Vyrian

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264

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Digiode

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Cyclops Electronics Ltd

UK . 35 parts In-Stock

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35

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Aztec Data Supply Inc.

USA . 4,132 parts In-Stock

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$10.370

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AZTECH Wire

Italy . 491 parts In-Stock

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$12.402

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Corohmni

South Africa . 412 parts In-Stock

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$17.815

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One Stop Electronics

USA . 790 parts In-Stock

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$648.000

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Ampacity Inc.

Singapore . 703 parts In-Stock

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$970.000

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Kepictronics

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A-Z Elektronik GmbH

Germany . 11,947 parts In-Stock

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Lixinc

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Corphita

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Perfect Parts

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Continental Prestige Electronics

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Argo Parts USA

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Bastille Electronics

Australia . 550 parts In-Stock

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Overview

Discover the MFRC63002HN by NXP Semiconductors, a game-changer in the world of telecom interface ICs. With its unbeatable quality and cutting-edge technology, NXP Semiconductors has once again proven why they are leaders in the industry. This versatile chip offers endless possibilities in various applications, providing customers with unmatched value and benefits. Whether it's enhancing security systems or improving contactless payment solutions, the MFRC63002HN is the ultimate solution you've been waiting for. Experience the advantages it brings to the table and take your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides a lightweight and durable solution, making this product suitable for various applications.

Surface Mount: YES

With surface mount capability, this product offers convenience in assembly and installation processes, allowing for easier integration within electronic systems.

No. of Functions: 1

This product offers a single function, simplifying its usage and ensuring focused performance in telecom applications.

Package Shape: SQUARE

The square package shape enables efficient space utilization, making it ideal for compact designs and maximizing board real estate.

No. of Terminals: 32

Equipped with 32 terminals, this product provides ample connectivity options, allowing for versatile connectivity requirements in telecom interfaces.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The chip carrier package style, combined with a heat sink/slug and a very thin profile, facilitates heat dissipation and enhances thermal management, ensuring reliable operation even in high-temperature environments.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this product exhibits excellent thermal stability, making it suitable for demanding telecom applications.

Minimum Operating Temperature: -25 °C

The minimum operating temperature of -25 °C ensures reliable performance even in cold environments, increasing the product's versatility.

Terminal Position: QUAD

Featuring a quad terminal position, this product provides secure and stable connection points, minimizing the risk of connectivity issues and enhancing overall reliability.

Maximum Seated Height: 1 mm

With a maximum seated height of 1 mm, this product offers a low-profile solution, facilitating space-saving designs and enabling integration in compact electronic systems.

Width: 5 mm

The 5 mm width of this product allows for efficient utilization of board space, particularly in applications where size constraints are crucial.

Length: 5 mm

Similarly, the 5 mm length ensures a compact footprint, making this product ideal for use in space-limited environments.

Terminal Form: NO LEAD

The no lead terminal form offers improved manufacturability, as it eliminates the need for lead forming or trimming processes, resulting in streamlined production.

Telecom IC Type: TELECOM CIRCUIT

Designed as a telecom circuit IC, this product is specifically engineered to meet the demanding requirements of telecommunications applications, ensuring reliable and efficient operation.

Nominal Supply Voltage: 5 V

With a nominal supply voltage of 5 V, this product aligns with common voltage standards, enabling seamless integration within existing telecom systems.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch allows for fine-pitch connections, granting versatility in connectivity options and facilitating compatibility with a wide range of devices.

Moisture Sensitivity Level (MSL): 1

Having an MSL level of 1 indicates that this product can withstand standard moisture exposure levels, ensuring product integrity and reliability during handling and storage.

Technical Specifications

Other Function Telecom Interface ICs MFRC63002HN attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PQCC-N32

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Trade Compliance

MFRC63002HN Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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