Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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The NXP Semiconductors MFRC63002HN is a telecom interface IC with 1 function. It has a square package and a terminal position of quad. With a max operating temperature of 85°C and min operating temperature of -25°C, it is suitable for various telecom circuit applications.
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The use of plastic/epoxy as the package body material provides a lightweight and durable solution, making this product suitable for various applications.
With surface mount capability, this product offers convenience in assembly and installation processes, allowing for easier integration within electronic systems.
This product offers a single function, simplifying its usage and ensuring focused performance in telecom applications.
The square package shape enables efficient space utilization, making it ideal for compact designs and maximizing board real estate.
Equipped with 32 terminals, this product provides ample connectivity options, allowing for versatile connectivity requirements in telecom interfaces.
The chip carrier package style, combined with a heat sink/slug and a very thin profile, facilitates heat dissipation and enhances thermal management, ensuring reliable operation even in high-temperature environments.
With a maximum operating temperature of 85 °C, this product exhibits excellent thermal stability, making it suitable for demanding telecom applications.
The minimum operating temperature of -25 °C ensures reliable performance even in cold environments, increasing the product's versatility.
Featuring a quad terminal position, this product provides secure and stable connection points, minimizing the risk of connectivity issues and enhancing overall reliability.
With a maximum seated height of 1 mm, this product offers a low-profile solution, facilitating space-saving designs and enabling integration in compact electronic systems.
The 5 mm width of this product allows for efficient utilization of board space, particularly in applications where size constraints are crucial.
Similarly, the 5 mm length ensures a compact footprint, making this product ideal for use in space-limited environments.
The no lead terminal form offers improved manufacturability, as it eliminates the need for lead forming or trimming processes, resulting in streamlined production.
Designed as a telecom circuit IC, this product is specifically engineered to meet the demanding requirements of telecommunications applications, ensuring reliable and efficient operation.
With a nominal supply voltage of 5 V, this product aligns with common voltage standards, enabling seamless integration within existing telecom systems.
The 0.5 mm terminal pitch allows for fine-pitch connections, granting versatility in connectivity options and facilitating compatibility with a wide range of devices.
Having an MSL level of 1 indicates that this product can withstand standard moisture exposure levels, ensuring product integrity and reliability during handling and storage.
Other Function Telecom Interface ICs MFRC63002HN attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors
JESD-30 Code:
Length:
Moisture Sensitivity Level (MSL):
No. of Functions:
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
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Telecom IC Type:
Temperature Grade:
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MFRC63002HN Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
BAV99
Infineon Technologies
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Philips Semiconductors
RECTIFIER DIODE; Surface Mount: NO; Terminal Finish: MATTE TIN; Maximum Operating Temperature: 200 Cel; Maximum Output Current: .15 A; JESD-609 Code: e3;
SMBJ18CA
Protek Devices
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002
Nte Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Transistor Application: SWITCHING; Maximum Drain Current (ID): .115 A; No. of Terminals: 3;
SS14
Promax-johnton
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Silicon Standard
M39029/56-351
Carlisle Interconnect Technologies
CONNECTOR ACCESSORY; MIL Conformity: YES; Contact Type: CRIMP; Removal Tools: M81969/8-06, M81969/14-02; IEC Conformity: NO; Contact Gender: FEMALE;
2N2222A
Semitronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
Semiconductors
1N4148WS
Surge Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Lite-on Semiconductor
Micro Commercial Components
Small Signal Field-Effect Transistors; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Transistor Application: SWITCHING; Maximum Drain Current (ID): .34 A; Package Style (Meter): SMALL OUTLINE;
Jiangsu Changjiang Electronics Technology
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM358MX
National Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
LM358N
Intersil
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
1554216004
Molex
WIRE AND CABLE;
BSS138BK,215
Nexperia
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Peak Reflow Temperature (C): 260; Additional Features: LOGIC LEVEL COMPATIBLE; Maximum Operating Temperature: 150 Cel;
LM358AN
1N4148WT
Changzhou Galaxy Century Microelectronics
1554216002
BGM220SC22HNA2
Silicon Labs
TELECOM CIRCUIT; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260;
SL3S4011FHK,125
NXP Semiconductors
SL3S4011FHK,125 by NXP Semiconductors is a telecom interface IC with 8 terminals in a square chip carrier package. Operating at -40 to 85°C, it supports power supplies of 1.8/3.6V for industrial applications. This surface-mount IC has a terminal pitch of 0.5mm and is ideal for telecom circuit integration.
ETRX357HR
ETRX357HR by Silicon Labs is a telecom IC with 33 terminals, operating temperature range of -40 to 85°C. It has a supply voltage of 3V and terminal pitch of 1.27mm. Ideal for industrial applications requiring telecom circuit interfaces in compact MICROELECTRONIC ASSEMBLY package style.
TLK2711IRCPG4
Texas Instruments
TLK2711IRCPG4 by Texas Instruments is a telecom IC with 64 terminals, operating at -40 to 85°C. It has a supply voltage of 2.5V and peak reflow temp of 260°C. Ideal for telecom circuits, it features a flatpack package style and gull wing terminal form.
MT9041AP
Mitel Semiconductor
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: J BEND; No. of Terminals: 28; Package Code: QCCJ; Package Shape: SQUARE;
LM2893M
LM2893M by Texas Instruments is a telecom IC with 20 terminals in a small outline package. It operates b/w -40°C to 85°C, suitable for industrial use. With a nominal voltage of 18V, it is designed for telecom circuit applications.
SPBTLE-RFTR
STMicroelectronics
TELECOM CIRCUIT; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED;
ST25R3916-BWLT
TELECOM CIRCUIT; Peak Reflow Temperature (C): NOT SPECIFIED; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
TDK5110FHTMA1
Infineon's TDK5110FHTMA1 is a telecom IC with 10 terminals, operating at -40 to 125°C. It has a supply voltage of 3V and consumes 0.021mA current. This small outline IC in plastic package is ideal for automotive telecom applications.
L76-M33
Quectel Wireless Solutions
Quectel Wireless Solutions' L76-M33 is a surface mount telecom IC with 18 terminals. Operating temperature range from -40 to 85°C, ideal for industrial applications. Compact package size of 10.1mm x 9.7mm x 2.5mm makes it suitable for various telecom interface functions.
WL1805MODGBMOCT
WL1805MODGBMOCT by Texas Instruments is a telecom interface IC with 100 terminals in a rectangular grid array package. Operating at -20 to 70°C, it supports data rates up to 100 Mbps at 3.7V supply voltage. Ideal for commercial applications requiring high-speed telecommunications functionality.
MAX7044AKA+T
Analog Devices
MAX7044AKA+T by Analog Devices is a CMOS telecom IC with 8 terminals, operating at temperatures from -40 to 125°C. It has a supply voltage of 2.7V and low power consumption of 0.0257mA, making it ideal for automotive applications requiring small outline packages and surface mount technology.
FUSB340TMX
Fairchild Semiconductor
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 18; Package Code: HVQCCN; Package Shape: RECTANGULAR;
NEO-M9V-20B
U-blox Ag
NEO-M9V-20B by U-blox Ag is a telecom IC with AEC-Q100 screening, operating from -40 to 85°C. It features 24 terminals in a rectangular package measuring 12.2mm x 16mm. Ideal for applications requiring a 3V supply voltage and surface mount compatibility.
TM1062DVA1
Pulser
TELECOM CIRCUIT; Temperature Grade: MILITARY; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: SSOP; Package Shape: RECTANGULAR;
RN4871-V/RM118
Microchip Technology
RN4871-V/RM118 by Microchip Tech is a TS 16949-certified IC with 16 terminals, operating at -20 to 70°C. It's a telecom circuit with 3V supply voltage, supporting data rates up to 0.01 Mbps. Ideal for applications requiring compact size and surface mount compatibility.
SX1243IULTRT
Semtech
Semtech's SX1243IULTRT is a telecom IC with 8 terminals, operating at 3.3V. It has a temp range of -40 to 85°C and AEC-Q100 screening level. The small outline package makes it suitable for industrial telecom applications.
ZED-F9P-01B-01
Other Telecom ICs;
EVA-M8M-0
EVA-M8M-0 by U-blox Ag is a telecom IC with 43 terminals, operating at -40 to 85°C. It has a square surface mount package measuring 7x7mm and requires a nominal voltage of 3.3V. Ideal for industrial applications requiring precise telecom circuit functionality in compact designs.
XB3-24Z8UT
Digi International
The Digi International XB3-24Z8UT is an industrial-grade telecom circuit with 20 terminals in a through-hole package. It operates b/w -40°C to 85°C, making it suitable for various telecom interface applications. This MICROELECTRONIC ASSEMBLY offers reliable performance in harsh environments.
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MFRC53101T/0FE,112
The NXP Semiconductors MFRC53101T/0FE,112 is a telecom interface IC with 32 terminals in a small outline package. It operates b/w -25°C to 85°C, with a nominal voltage of 3.3V. Ideal for telecom circuits, it has a peak reflow temperature of 250°C and terminal pitch of 1.27mm.
MFRC52302HN1,151
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;
MFRC53001T/0FE,112
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: SOP; Package Shape: RECTANGULAR;
MFRC63003HNE
TELECOM CIRCUIT; JESD-609 Code: e4; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 2; Terminal Finish: NICKEL PALLADIUM GOLD SILVER;
MFRC63002HN,151
NXP Semiconductors' MFRC63002HN,151 is a telecom IC with 32 terminals in a square chip carrier package. Operating b/w -25 to 85°C, it has a nominal voltage of 5V and terminal pitch of 0.5mm. Ideal for telecom circuits, this IC is surface mountable and features a max seated height of 1mm.
MFRC63102HN,151
TELECOM CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES;
MFRC63002HN,118
The NXP Semiconductors MFRC63002HN,118 is a telecom interface IC with 32 terminals in a square chip carrier package. Operating temperature range from -25 to 85°C, with peak reflow temp of 260°C. Ideal for telecom circuits requiring nominal voltage of 5V and terminal pitch of 0.5mm.
MFRC63002HN,157
MFRC53101T/0FE
NXP Semiconductors' MFRC53101T/0FE is a telecom IC with 32 terminals, operating b/w -25°C to 85°C. Its small outline package measures 7.5mm in width and 20.5mm in length, suitable for surface mount applications. With a nominal voltage of 5V, it's ideal for various telecom circuit functions.
MFRC63003HNY
TELECOM CIRCUIT; Peak Reflow Temperature (C): 260; Terminal Finish: NICKEL PALLADIUM GOLD SILVER; JESD-609 Code: e4; Moisture Sensitivity Level (MSL): 2; Maximum Time At Peak Reflow Temperature (s): 30;
MFRC63002HN/T/R
MFRC531
TELECOM CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: SOP; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE;
MFRC63002HN/TRAYBM
MFRC63002HN/TRAYB
MFRC52302HN1,157
TELECOM CIRCUIT; Peak Reflow Temperature (C): 260; JESD-609 Code: e4; Terminal Finish: NICKEL PALLADIUM GOLD; Moisture Sensitivity Level (MSL): 1; Maximum Time At Peak Reflow Temperature (s): 30;
MFRC52301HN1/TRAYBM
MFRC52302HN1/TRAYB
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: VQCCN; Package Shape: SQUARE;
MFRC52301HN1/TRAYB
MFRC52302HN1/TRAYBM
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