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MFRC63002HN,118

NXP Semiconductors

MFRC63002HN,118 by NXP Semiconductors

The NXP Semiconductors MFRC63002HN,118 is a telecom interface IC with 32 terminals in a square chip carrier package. Operating temperature range from -25 to 85°C, with peak reflow temp of 260°C. Ideal for telecom circuits requiring nominal voltage of 5V and terminal pitch of 0.5mm.

Median Price

$4.287

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 5,680 parts In-Stock

1+ parts

$1.365

100+ parts

$1.307

1k+ parts

$1.247

10k+ parts

$1.229

5,680

$1.365

$1.307

$1.247

$1.229

Newark

USA . 421 parts In-Stock

1+ parts

$2.640

100+ parts

$2.640

1k+ parts

$2.640

10k+ parts

-

421

$2.640

$2.640

$2.640

-

Element14

Singapore . 2,165 parts In-Stock

1+ parts

$4.316

100+ parts

$3.515

1k+ parts

$3.233

10k+ parts

-

2,165

$4.316

$3.515

$3.233

-

Chip1Stop

Japan . 5,680 parts In-Stock

1+ parts

$4.620

100+ parts

-

1k+ parts

-

10k+ parts

-

5,680

$4.620

-

-

-

Mouser Electronics

USA . 9,950 parts In-Stock

1+ parts

$7.110

100+ parts

$5.080

1k+ parts

$4.210

10k+ parts

$3.900

9,950

$7.110

$5.080

$4.210

$3.900

DigiKey

USA . 7,510 parts In-Stock

1+ parts

$7.110

100+ parts

$5.372

1k+ parts

$4.727

10k+ parts

$4.307

7,510

$7.110

$5.372

$4.727

$4.307

Verical

USA . 36,000 parts In-Stock

1+ parts

-

100+ parts

$4.287

1k+ parts

$3.837

10k+ parts

$3.612

36,000

-

$4.287

$3.837

$3.612

Rochester

USA . 36,000 parts In-Stock

1+ parts

-

100+ parts

$3.430

1k+ parts

$3.070

10k+ parts

$2.890

36,000

-

$3.430

$3.070

$2.890

Farnell

UK . 1,702 parts In-Stock

1+ parts

-

100+ parts

$3.700

1k+ parts

$3.380

10k+ parts

-

1,702

-

$3.700

$3.380

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,409 parts In-Stock

1+ parts

$3.050

100+ parts

-

1k+ parts

-

10k+ parts

-

3,409

$3.050

-

-

-

Nova Conductors

Japan . 65 parts In-Stock

1+ parts

$3.480

100+ parts

-

1k+ parts

-

10k+ parts

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65

$3.480

-

-

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Vyrian

USA . 11,540 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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11,540

-

-

-

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ComSIT Distribution GmbH

Germany . 1,324 parts In-Stock

1+ parts

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100+ parts

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1,324

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Anansix

USA . 194 parts In-Stock

1+ parts

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194

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 11,888 parts In-Stock

1+ parts

$2.330

100+ parts

$2.272

1k+ parts

$2.260

10k+ parts

-

11,888

$2.330

$2.272

$2.260

-

Ampacity Inc.

Singapore . 11,538 parts In-Stock

1+ parts

$2.550

100+ parts

-

1k+ parts

-

10k+ parts

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11,538

$2.550

-

-

-

Corphita

USA . 1,755 parts In-Stock

1+ parts

$2.889

100+ parts

-

1k+ parts

-

10k+ parts

-

1,755

$2.889

-

-

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Argo Parts USA

USA . 947 parts In-Stock

1+ parts

$3.480

100+ parts

-

1k+ parts

-

10k+ parts

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947

$3.480

-

-

-

Netroflash

USA . 50 parts In-Stock

1+ parts

$3.480

100+ parts

$3.410

1k+ parts

-

10k+ parts

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50

$3.480

$3.410

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-

Corohmni

South Africa . 8 parts In-Stock

1+ parts

$4.244

100+ parts

-

1k+ parts

-

10k+ parts

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8

$4.244

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-

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Aztec Data Supply Inc.

USA . 2,980 parts In-Stock

1+ parts

$9.080

100+ parts

-

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-

10k+ parts

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2,980

$9.080

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Infinite Electronics LLP (Excess)

. 198,000 parts In-Stock

1+ parts

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198,000

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Futuretech Components

Singapore . 9,880 parts In-Stock

1+ parts

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100+ parts

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9,880

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UNI Independent Distributors

Spain . 8,037 parts In-Stock

1+ parts

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8,037

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Continental Prestige Electronics

USA . 2,725 parts In-Stock

1+ parts

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100+ parts

$3.850

1k+ parts

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10k+ parts

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2,725

-

$3.850

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iodParts Technologies Inc.

India . 45 parts In-Stock

1+ parts

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45

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Overview

Discover the next level of connectivity with the MFRC63002HN,118 by NXP Semiconductors. This cutting-edge Telecom Interface IC offers unparalleled quality and reliability, perfect for a wide range of applications in the telecommunications industry. With its innovative design and advanced features, this product provides customers with unmatched value, benefits, and advantages. Experience seamless communication like never before with the MFRC63002HN,118.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the telecom interface IC, ensuring a longer lifespan.

Surface Mount: YES

The surface mount capability allows for easy assembly and integration into various electronic devices.

Package Shape: SQUARE

The square shape offers efficient use of space, making it ideal for compact designs.

No. of Terminals: 32

With a high number of terminals, this IC can handle multiple connections and functions simultaneously.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style offers effective heat dissipation and a slim profile for space-saving applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in demanding environments.

Minimum Operating Temperature: -25 °C

The low minimum operating temperature allows for operation in a wide range of temperature conditions.

Terminal Position: QUAD

The quad terminal position provides stable connections and reduces the risk of signal interference.

Maximum Seated Height: 1 mm

The low seated height allows for easy integration into tight spaces or slim designs.

Width: 5 mm

The narrow width of the IC enables flexibility in placement within electronic devices.

Maximum Time At Peak Reflow Temperature (s): 30

The short reflow time ensures quick and efficient soldering during manufacturing processes.

Peak Reflow Temperature °C: 260

The high peak reflow temperature allows for secure solder joints and reliable connections.

Length: 5 mm

The compact length of the IC further enhances its suitability for small electronic devices.

Terminal Form: NO LEAD

The no lead terminal form simplifies the assembly process and reduces the risk of soldering errors.

Telecom IC Type: TELECOM CIRCUIT

Designed specifically for telecom applications, this IC offers reliable performance and compatibility with telecommunication systems.

Nominal Supply Voltage: 5 V

With a standard supply voltage of 5V, this IC can easily integrate into existing electronic systems.

Terminal Pitch: 0.5 mm

The small terminal pitch allows for high-density mounting and efficient use of PCB space.

Technical Specifications

Other Function Telecom Interface ICs MFRC63002HN,118 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PQCC-N32

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

MFRC63002HN,118 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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