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MFRC63102HN,151

NXP Semiconductors

MFRC63102HN,151 by NXP Semiconductors

The NXP Semiconductors MFRC63102HN,151 is a telecom interface IC with 32 terminals in a square chip carrier package. Operating temperature range from -25 to 85 °C, with data rate of 0.4 Mbps. Ideal for telecom circuits requiring a nominal voltage of 5V and surface mount compatibility.

Median Price

$6.316

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 433 parts In-Stock

1+ parts

$7.670

100+ parts

$5.000

1k+ parts

$4.710

10k+ parts

-

433

$7.670

$5.000

$4.710

-

DigiKey

USA . 677 parts In-Stock

1+ parts

$8.550

100+ parts

$6.479

1k+ parts

$5.715

10k+ parts

$5.594

677

$8.550

$6.479

$5.715

$5.594

Verical

USA . 6,637 parts In-Stock

1+ parts

-

100+ parts

$4.963

1k+ parts

$4.438

10k+ parts

$4.175

6,637

-

$4.963

$4.438

$4.175

Rochester

USA . 6,637 parts In-Stock

1+ parts

-

100+ parts

$3.970

1k+ parts

$3.550

10k+ parts

$3.340

6,637

-

$3.970

$3.550

$3.340

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 52 parts In-Stock

1+ parts

$5.071

100+ parts

-

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52

$5.071

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-

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Digiode

USA . 720 parts In-Stock

1+ parts

$7.885

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-

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720

$7.885

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Vyrian

USA . 2,981 parts In-Stock

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2,981

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Anansix

USA . 2,680 parts In-Stock

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2,680

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Classic Components Corporation

USA . 266 parts In-Stock

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266

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 3,221 parts In-Stock

1+ parts

$3.630

100+ parts

$3.539

1k+ parts

$3.521

10k+ parts

-

3,221

$3.630

$3.539

$3.521

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Bastille Electronics

Australia . 1,000 parts In-Stock

1+ parts

$5.071

100+ parts

$4.817

1k+ parts

$4.577

10k+ parts

$4.513

1,000

$5.071

$4.817

$4.577

$4.513

Continental Prestige Electronics

USA . 1,803 parts In-Stock

1+ parts

$5.071

100+ parts

-

1k+ parts

-

10k+ parts

$4.970

1,803

$5.071

-

-

$4.970

Corohmni

South Africa . 3,070 parts In-Stock

1+ parts

$6.110

100+ parts

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3,070

$6.110

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Corphita

USA . 549 parts In-Stock

1+ parts

$7.470

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549

$7.470

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Aztec Data Supply Inc.

USA . 1,439 parts In-Stock

1+ parts

$13.910

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1,439

$13.910

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QUARKTWIN TECHNOLOGY LTD

USA . 16,916 parts In-Stock

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16,916

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UNI Independent Distributors

Spain . 6,775 parts In-Stock

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6,775

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Argo Parts USA

USA . 2,114 parts In-Stock

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2,114

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Lixinc

USA . 1,685 parts In-Stock

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1,685

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Overview

Discover the unmatched quality and reliability of the MFRC63102HN,151 by NXP Semiconductors. As a leading manufacturer in the industry, NXP Semiconductors delivers cutting-edge solutions for various applications in the telecom interface ICs category. With a focus on innovation, this product offers customers exceptional value, benefits, and advantages. Experience seamless performance and enhanced functionality with the MFRC63102HN,151, setting new standards in the industry.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the internal components of the IC, ensuring durability and reliability.

Surface Mount: YES

Makes installation and soldering easier, especially in mass production processes.

Package Shape: SQUARE

Efficient use of space and layout design, allowing for a compact and neat circuit design.

No. of Terminals: 32

Provides a wide range of connectivity options and flexibility for integration into different systems.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Optimal package design for heat dissipation and space-saving, making it suitable for telecom applications.

Maximum Operating Temperature: 85 °C

Can operate in a wide range of temperature environments, ensuring reliability in various conditions.

Nominal Supply Voltage: 5 V

Compatible with standard voltage requirements in telecom systems, reducing the need for additional components.

Data Rate: 0.4 Mbps

Suitable for high-speed data transmission in telecom applications, ensuring efficient communication.

Technical Specifications

Other Function Telecom Interface ICs MFRC63102HN,151 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

Data Rate:

.4 Mbps

JESD-30 Code:

S-PQCC-N32

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

MFRC63102HN,151 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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