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OPA2380AIDGKRG4

Texas Instruments

OPA2380AIDGKRG4 by Texas Instruments

OPA2380AIDGKRG4 by Texas Instruments is a dual-function telecom interface IC with 8 terminals and a supply voltage of 3/5V. It features a small outline package style, operates in automotive temperature grades (-40 to 125°C), and has low supply current at 0.016mA. Ideal for telecom circuits, this IC is surface mountable and suitable for various applications requiring precise signal processing.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,751 parts In-Stock

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Chip Stock

USA . 6,110 parts In-Stock

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Digiode

USA . 3,146 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Parana Technologies

USA . 781 parts In-Stock

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$6.706

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$7.396

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781

$6.706

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$7.396

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DigiPath Technology Company

USA . 1,849 parts In-Stock

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$7.384

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$6.794

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$7.384

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ChromeModa Solutions

Germany . 6,637 parts In-Stock

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$7.535

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$6.179

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IDEA Electronic Components Group

UK . 1,880 parts In-Stock

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$7.535

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$6.782

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AZTECH Wire

Italy . 278 parts In-Stock

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$15.686

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Corohmni

South Africa . 489 parts In-Stock

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$16.923

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One Stop Electronics

USA . 891 parts In-Stock

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$164.000

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Semicontronic

India . 1,150 parts In-Stock

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$798.000

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$778.050

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$774.060

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$798.000

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Ampacity Inc.

Singapore . 1,204 parts In-Stock

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$815.000

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Kepictronics

USA . 29,061 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,224 parts In-Stock

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Argo Parts USA

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Continental Prestige Electronics

USA . 1,234 parts In-Stock

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Corphita

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Microchip USA

USA . 979 parts In-Stock

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Perfect Parts

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Advanced Electronics

New Zealand . 450 parts In-Stock

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Robosynatics

Brazil . 200 parts In-Stock

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Lucentia Tech

USA . 200 parts In-Stock

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Bastille Electronics

Australia . 10 parts In-Stock

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Overview

Discover the cutting-edge OPA2380AIDGKRG4 by Texas Instruments, a top-tier manufacturer known for quality and innovation. This versatile telecom interface IC offers unmatched reliability and performance in a compact package, making it ideal for a wide range of applications. From automotive to industrial settings, this product delivers superior functionality and precision, ensuring seamless operation. Trust Texas Instruments to provide value and excellence with the OPA2380AIDGKRG4, setting new standards in telecom interface ICs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ideal for telecommunications applications where weight and reliability are important factors.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving space and simplifying the manufacturing process.

No. of Functions: 2

Having 2 functions in one IC enhances the functionality and efficiency of the telecom interface, reducing the need for multiple components.

Power Supplies (V): 3/5

Supporting both 3V and 5V power supplies ensures compatibility with a wide range of systems, making it versatile and adaptable to different requirements.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The compact and slim profile of the package style saves space on the circuit board, enabling higher density integration and improved overall system design.

Temperature Grade: AUTOMOTIVE

With automotive-grade temperature range, this IC can withstand harsh environmental conditions, making it suitable for automotive applications where temperature fluctuations are common.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage provides stable and reliable power for the IC, ensuring consistent performance in telecom applications.

Technical Specifications

Other Function Telecom Interface ICs OPA2380AIDGKRG4 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

2

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.016 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

OPA2380AIDGKRG4 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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