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OPA2381AIDGKR

Texas Instruments

OPA2381AIDGKR by Texas Instruments

TELECOM CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: TSSOP; Package Shape: SQUARE;

Median Price

$1.810

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 143,287 parts In-Stock

1+ parts

$2.150

100+ parts

$1.776

1k+ parts

$0.960

10k+ parts

-

143,287

$2.150

$1.776

$0.960

-

Mouser Electronics

USA . 3,593 parts In-Stock

1+ parts

$2.870

100+ parts

$1.770

1k+ parts

$1.570

10k+ parts

$1.480

3,593

$2.870

$1.770

$1.570

$1.480

Rochester

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

$1.380

1k+ parts

$1.230

10k+ parts

$1.160

5,000

-

$1.380

$1.230

$1.160

DigiKey

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.810

10k+ parts

-

5,000

-

-

$1.810

-

Verical

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.538

10k+ parts

$1.450

5,000

-

-

$1.538

$1.450

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,218 parts In-Stock

1+ parts

$1.264

100+ parts

-

1k+ parts

-

10k+ parts

-

4,218

$1.264

-

-

-

Vyrian

USA . 1,883 parts In-Stock

1+ parts

$1.330

100+ parts

-

1k+ parts

-

10k+ parts

-

1,883

$1.330

-

-

-

Chip Stock

USA . 14,700 parts In-Stock

1+ parts

-

100+ parts

-

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-

10k+ parts

-

14,700

-

-

-

-

DigiKey Marketplace

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

$1.390

1k+ parts

-

10k+ parts

-

5,000

-

$1.390

-

-

Cyclops Electronics Ltd

UK . 1 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,764 parts In-Stock

1+ parts

$1.197

100+ parts

-

1k+ parts

-

10k+ parts

-

2,764

$1.197

-

-

-

Parana Technologies

USA . 668 parts In-Stock

1+ parts

$11.713

100+ parts

-

1k+ parts

$12.104

10k+ parts

-

668

$11.713

-

$12.104

-

DigiPath Technology Company

USA . 2,347 parts In-Stock

1+ parts

$12.898

100+ parts

$11.866

1k+ parts

-

10k+ parts

-

2,347

$12.898

$11.866

-

-

IDEA Electronic Components Group

UK . 1,943 parts In-Stock

1+ parts

$13.161

100+ parts

$12.503

1k+ parts

$11.845

10k+ parts

-

1,943

$13.161

$12.503

$11.845

-

ChromeModa Solutions

Germany . 1,583 parts In-Stock

1+ parts

$13.161

100+ parts

$10.792

1k+ parts

-

10k+ parts

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1,583

$13.161

$10.792

-

-

Kepictronics

USA . 9,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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9,000

-

-

-

-

Perfect Parts

USA . 5,600 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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5,600

-

-

-

-

A-Z Elektronik GmbH

Germany . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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5,000

-

-

-

-

Technical Specifications

Other Function Telecom Interface ICs OPA2381AIDGKR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

OPA2381AIDGKR Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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