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OPA2380AIDGKTG4

Texas Instruments

OPA2380AIDGKTG4 by Texas Instruments

OPA2380AIDGKTG4 by Texas Instruments is a dual-function telecom interface IC with 2 channels and a nominal voltage of 5V. It comes in a small outline, thin profile package style with a terminal pitch of 0.65mm. Ideal for automotive applications, it operates b/w -40 to 125°C and has low max supply current at 0.016mA.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Chip Stock

USA . 6,040 parts In-Stock

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Vyrian

USA . 3,395 parts In-Stock

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3,395

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Digiode

USA . 2,318 parts In-Stock

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Nova Conductors

Japan . 550 parts In-Stock

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550

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Parana Technologies

USA . 2,063 parts In-Stock

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$9.338

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$9.960

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2,063

$9.338

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$9.960

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ChromeModa Solutions

Germany . 2,395 parts In-Stock

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$10.492

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$8.603

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2,395

$10.492

$8.603

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IDEA Electronic Components Group

UK . 2,181 parts In-Stock

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$10.492

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$9.967

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$9.443

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$10.492

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$9.443

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AZTECH Wire

Italy . 638 parts In-Stock

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$14.078

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$14.078

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Corohmni

South Africa . 16 parts In-Stock

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$14.667

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Ampacity Inc.

Singapore . 868 parts In-Stock

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$93.000

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$93.000

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Semicontronic

India . 176 parts In-Stock

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$606.000

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$590.850

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$587.820

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$587.820

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One Stop Electronics

USA . 463 parts In-Stock

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$790.000

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Argo Parts USA

USA . 4,233 parts In-Stock

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Continental Prestige Electronics

USA . 3,739 parts In-Stock

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Microchip USA

USA . 2,761 parts In-Stock

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Robosynatics

Brazil . 2,437 parts In-Stock

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Lucentia Tech

USA . 2,437 parts In-Stock

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$85.479

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$85.479

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$85.479

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$85.479

$85.479

DigiPath Technology Company

USA . 1,147 parts In-Stock

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$9.460

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Corphita

USA . 419 parts In-Stock

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Bastille Electronics

Australia . 300 parts In-Stock

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Advanced Electronics

New Zealand . 88 parts In-Stock

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Overview

Unlock a world of possibilities with the OPA2380AIDGKTG4 by Texas Instruments, a top-of-the-line Telecom Interface IC. Crafted with precision and expertise, this versatile component offers unparalleled quality and reliability. From automotive applications to telecommunications circuits, this product delivers optimal performance and efficiency. Experience seamless integration and superior functionality with the OPA2380AIDGKTG4, providing unmatched value and benefits to customers looking for cutting-edge solutions. Trust in Texas Instruments to elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the IC, making it suitable for various environments.

Surface Mount: YES

Allows for easy installation on circuit boards, saving time and effort during manufacturing.

No. of Functions: 2

Provides multiple functions in a single IC, increasing efficiency and saving space on the board.

Power Supplies (V): 3/5

Compatible with both 3V and 5V power supplies, offering flexibility in system design.

Maximum Operating Temperature: 125 °C

Can operate at high temperatures, making it suitable for industrial and automotive applications.

Terminal Finish: NICKEL PALLADIUM GOLD SILVER

Provides excellent conductivity and corrosion resistance, ensuring long-term reliability.

Maximum Seated Height: 1.1 mm

Low profile design saves space on the board and enables compact product designs.

Temperature Grade: AUTOMOTIVE

Meets automotive industry standards for reliability and performance in harsh environments.

No. of Channels: 2

Features multiple channels for enhanced communication capabilities.

Nominal Supply Voltage: 5 V

Designed to operate efficiently at a standard 5V supply voltage.

Technical Specifications

Other Function Telecom Interface ICs OPA2380AIDGKTG4 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

2

No. of Functions:

2

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.016 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

OPA2380AIDGKTG4 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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