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OPA2381AIDGKTG4

Texas Instruments

OPA2381AIDGKTG4 by Texas Instruments

OPA2381AIDGKTG4 by Texas Instruments is a telecom interface IC with 8 terminals, operating at -40 to 125°C. It has a supply voltage of 5V and low supply current of 0.0011mA, making it ideal for automotive applications. This small outline IC in plastic/epoxy package with gull wing terminals is surface mountable and suitable for telecom circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,213 parts In-Stock

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Digiode

USA . 395 parts In-Stock

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395

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Nova Conductors

Japan . 26 parts In-Stock

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AZTECH Wire

Italy . 357 parts In-Stock

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$7.393

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Parana Technologies

USA . 1,057 parts In-Stock

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$14.961

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$15.385

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Corohmni

South Africa . 272 parts In-Stock

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$15.285

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DigiPath Technology Company

USA . 693 parts In-Stock

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$16.474

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$15.156

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693

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$15.156

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ChromeModa Solutions

Germany . 5,507 parts In-Stock

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$16.810

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$13.784

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$16.810

$13.784

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IDEA Electronic Components Group

UK . 986 parts In-Stock

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$16.810

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$15.970

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$15.129

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986

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One Stop Electronics

USA . 688 parts In-Stock

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$465.000

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Ampacity Inc.

Singapore . 1,467 parts In-Stock

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Corphita

USA . 3,833 parts In-Stock

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Continental Prestige Electronics

USA . 3,020 parts In-Stock

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Argo Parts USA

USA . 876 parts In-Stock

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Perfect Parts

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Aranea Global

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Overview

Enhance your telecom applications with the OPA2381AIDGKTG4 by Texas Instruments. Known for their top-quality manufacturing, Texas Instruments delivers reliable products that exceed industry standards. This versatile IC offers exceptional performance and value, perfect for a wide range of telecom interface applications. Upgrade your designs with the trusted brand that professionals rely on.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a good balance of durability and cost efficiency, making it suitable for a wide range of applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto circuit boards, saving space and simplifying the overall design.

Package Shape: SQUARE

The square shape helps optimize space usage on the PCB and allows for a more compact and efficient layout.

Power Supplies (V): 3/5

This product can be operated with either a 3V or 5V power supply, providing flexibility in design and compatibility with a variety of systems.

No. of Terminals: 8

With 8 terminals, this product allows for the connection of multiple components, enabling a versatile and customizable setup.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliable performance even in demanding conditions, making it suitable for a wide range of environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for reliable performance even in cold conditions, enhancing the product's versatility and durability.

Terminal Finish: NICKEL PALLADIUM GOLD

This finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability and optimal performance.

Terminal Position: DUAL

Having dual terminal positions allows for increased flexibility in circuit design and layout, enabling a more efficient and customized setup.

Maximum Seated Height: 1.1 mm

The low profile design with a maximum seated height of 1.1 mm allows for easy integration into compact devices and ensures efficient use of space.

Width: 3 mm

The narrow width of 3 mm helps in optimizing space on the PCB, allowing for a compact and streamlined design.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature of 260°C, this product can withstand the soldering process without any damage, ensuring reliable assembly.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this product meets the stringent requirements for temperature, reliability, and performance in the automotive industry.

Nominal Supply Voltage: 5 V

Operating at a 5V supply voltage, this product is compatible with standard power sources, making it easy to integrate into existing systems.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65 mm allows for high-density mounting and precise connections, making it suitable for compact electronic devices.

Moisture Sensitivity Level (MSL): 2

With an MSL of 2, this product can withstand moderate exposure to moisture during storage and assembly, ensuring long-term reliability.

Technical Specifications

Other Function Telecom Interface ICs OPA2381AIDGKTG4 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.0011 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

OPA2381AIDGKTG4 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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