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OPA2381AIDRBR

Texas Instruments

OPA2381AIDRBR by Texas Instruments

OPA2381AIDRBR by Texas Instruments is a telecom IC with 8 terminals, operating at -40 to 125 °C. It has a supply voltage of 5V and low current draw of 0.0011 mA. Ideal for automotive applications due to its small size, square package shape, and surface mount capability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,164 parts In-Stock

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Digiode

USA . 2,201 parts In-Stock

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2,201

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Distributors (Availability)

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Parana Technologies

USA . 1,291 parts In-Stock

1+ parts

$8.987

100+ parts

-

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$9.657

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1,291

$8.987

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$9.657

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ChromeModa Solutions

Germany . 6,992 parts In-Stock

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$10.098

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$8.280

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6,992

$10.098

$8.280

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IDEA Electronic Components Group

UK . 1,918 parts In-Stock

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$10.098

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$9.593

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$9.088

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1,918

$10.098

$9.593

$9.088

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AZTECH Wire

Italy . 618 parts In-Stock

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$14.356

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618

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Component Stockers USA

USA . 774 parts In-Stock

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$99.990

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774

$99.990

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One Stop Electronics

USA . 682 parts In-Stock

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$993.000

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682

$993.000

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Corphita

USA . 3,232 parts In-Stock

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Perfect Parts

USA . 504 parts In-Stock

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504

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DigiPath Technology Company

USA . 448 parts In-Stock

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$9.104

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448

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Microchip USA

USA . 284 parts In-Stock

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Overview

Unlock the potential of your telecom interface applications with the OPA2381AIDRBR by Texas Instruments. Crafted with precision and quality, this innovative IC offers unparalleled performance and reliability. From enhanced signal processing to improved connectivity, this product is designed to exceed expectations. Elevate your projects with the cutting-edge technology and advanced features that this telecom circuit delivers. Trust in Texas Instruments to provide you with the tools you need to succeed in today's competitive market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the IC, ensuring a longer lifespan.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation onto a PCB, saving time and effort during assembly.

Power Supplies (V): 3/5

Support for multiple power supply options (3V and 5V) provide flexibility in design and compatibility with different systems.

No. of Terminals: 8

Having 8 terminals allows for versatile connectivity options and interfaces with other components.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliable performance even in harsh environments or under heavy load.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for operation in cold environments without compromising functionality.

Terminal Position: DUAL

Dual terminal positions offer flexibility in circuit design and routing, accommodating different layout requirements.

Maximum Seated Height: 1 mm

Low seated height enables compact and space-saving designs for applications where size constraints are critical.

Temperature Grade: AUTOMOTIVE

Automotive-grade temperature tolerance ensures reliability in automotive applications and harsh conditions commonly found in vehicles.

Nominal Supply Voltage: 5 V

5V nominal supply voltage is a common standard in many electronic systems, making this IC compatible with a wide range of applications.

Technical Specifications

Other Function Telecom Interface ICs OPA2381AIDRBR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PDSO-N8

Length:

3 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.12

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.0011 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3 mm

Trade Compliance

OPA2381AIDRBR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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