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OPA2381AIDRBRG4

Texas Instruments

OPA2381AIDRBRG4 by Texas Instruments

OPA2381AIDRBRG4 by Texas Instruments is a telecom IC with 8 terminals, operating at -40 to 125 °C. It has a supply voltage of 5V and low current draw of 0.0011 mA. This square-shaped IC in small outline package is ideal for automotive telecom applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,926 parts In-Stock

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Digiode

USA . 1,854 parts In-Stock

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Parana Technologies

USA . 1,566 parts In-Stock

1+ parts

$15.066

100+ parts

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$15.479

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1,566

$15.066

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$15.479

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DigiPath Technology Company

USA . 65 parts In-Stock

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$16.589

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$15.262

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65

$16.589

$15.262

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AZTECH Wire

Italy . 399 parts In-Stock

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$16.642

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399

$16.642

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ChromeModa Solutions

Germany . 2,502 parts In-Stock

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$16.928

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$13.881

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2,502

$16.928

$13.881

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IDEA Electronic Components Group

UK . 284 parts In-Stock

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$16.928

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$16.082

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$15.235

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284

$16.928

$16.082

$15.235

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Ampacity Inc.

Singapore . 1,002 parts In-Stock

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$137.000

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$137.000

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One Stop Electronics

USA . 1,414 parts In-Stock

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$332.000

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$332.000

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Semicontronic

India . 1,399 parts In-Stock

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$801.000

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$780.975

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$776.970

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1,399

$801.000

$780.975

$776.970

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Corphita

USA . 4,534 parts In-Stock

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4,534

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Perfect Parts

USA . 504 parts In-Stock

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504

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Microchip USA

USA . 197 parts In-Stock

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Corohmni

South Africa . 118 parts In-Stock

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Overview

Enhance your telecom applications with the OPA2381AIDRBRG4 by Texas Instruments, a top-quality Other Function Telecom Interface IC. With a reputation for excellence, Texas Instruments delivers cutting-edge technology that meets the highest industry standards. This small outline, heat sink package offers customers unparalleled value and benefits, ensuring reliable performance in automotive-grade temperatures. Upgrade your designs with the OPA2381AIDRBRG4 and experience the superior quality and advantages it brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY is a common and durable material for electronic components, ensuring the product is robust and long-lasting.

Surface Mount: YES

Surface mount technology allows for easier assembly and more compact design, making the product suitable for modern electronic devices.

Power Supplies (V): 3/5

Support for multiple power supply voltages makes the product versatile and compatible with various systems.

No. of Terminals: 8

Having 8 terminals provides sufficient connectivity options for interfacing with other components or devices.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures the product can withstand harsh environmental conditions and operate reliably.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the product to function effectively in cold environments or during temperature fluctuations.

Maximum Seated Height: 1 mm

The low profile of the product enables compact and space-saving designs, ideal for applications where size is a critical factor.

Temperature Grade: AUTOMOTIVE

Being automotive-grade means the product meets strict quality and reliability standards required for automotive applications, ensuring dependable performance.

Maximum Supply Current: 0.0011 mA

The low supply current consumption makes the product energy-efficient and suitable for battery-powered devices or applications requiring low power consumption.

Terminal Pitch: 0.65 mm

The tight terminal pitch allows for high-density mounting, enabling more compact and efficient designs.

Technical Specifications

Other Function Telecom Interface ICs OPA2381AIDRBRG4 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PDSO-N8

Length:

3 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.12

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.0011 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3 mm

Trade Compliance

OPA2381AIDRBRG4 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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