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CLRC66302HN,118

NXP Semiconductors

CLRC66302HN,118 by NXP Semiconductors

NXP Semiconductors' CLRC66302HN,118 is a 32-terminal IC with CMOS technology. It operates b/w -25 to 85 °C and has a nominal voltage of 5V. Ideal for telecom circuits, it comes in a square chip carrier package style suitable for surface mount applications.

Median Price

$6.816

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 283 parts In-Stock

1+ parts

$6.130

100+ parts

-

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283

$6.130

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Farnell

UK . 447 parts In-Stock

1+ parts

$7.501

100+ parts

$7.083

1k+ parts

$6.982

10k+ parts

-

447

$7.501

$7.083

$6.982

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DigiKey

USA . 9,151 parts In-Stock

1+ parts

$11.940

100+ parts

$9.080

1k+ parts

$8.018

10k+ parts

-

9,151

$11.940

$9.080

$8.018

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Avnet

USA . 6,000 parts In-Stock

1+ parts

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6,000

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Verical

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

$5.388

1k+ parts

$4.825

10k+ parts

$4.537

6,000

-

$5.388

$4.825

$4.537

Rochester

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

$4.310

1k+ parts

$3.860

10k+ parts

$3.630

6,000

-

$4.310

$3.860

$3.630

Element14

Singapore . 305 parts In-Stock

1+ parts

-

100+ parts

$11.980

1k+ parts

$11.380

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305

-

$11.980

$11.380

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,501 parts In-Stock

1+ parts

$6.669

100+ parts

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2,501

$6.669

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Nova Conductors

Japan . 1,000 parts In-Stock

1+ parts

$8.388

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1,000

$8.388

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IBS Electronics

USA . 12,000 parts In-Stock

1+ parts

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$6.059

12,000

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$6.059

NAC Semi

USA . 12,000 parts In-Stock

1+ parts

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$10.530

12,000

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$10.530

Sensible Micro Corp

USA . 6,000 parts In-Stock

1+ parts

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6,000

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Vyrian

USA . 4,459 parts In-Stock

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4,459

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Anansix

USA . 1,900 parts In-Stock

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1,900

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 4,524 parts In-Stock

1+ parts

$5.060

100+ parts

$4.934

1k+ parts

$4.908

10k+ parts

-

4,524

$5.060

$4.934

$4.908

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Ampacity Inc.

Singapore . 4,662 parts In-Stock

1+ parts

$5.970

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4,662

$5.970

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Corphita

USA . 2,473 parts In-Stock

1+ parts

$6.318

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2,473

$6.318

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Aranea Global

USA . 1,000 parts In-Stock

1+ parts

$8.220

100+ parts

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1k+ parts

$7.891

10k+ parts

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1,000

$8.220

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$7.891

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Aztec Data Supply Inc.

USA . 227 parts In-Stock

1+ parts

$8.780

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227

$8.780

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Continental Prestige Electronics

USA . 447 parts In-Stock

1+ parts

$12.190

100+ parts

$7.340

1k+ parts

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447

$12.190

$7.340

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Advanced Electronics

New Zealand . 20 parts In-Stock

1+ parts

$13.231

100+ parts

$12.570

1k+ parts

$12.570

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20

$13.231

$12.570

$12.570

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Corohmni

South Africa . 25 parts In-Stock

1+ parts

$13.859

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25

$13.859

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Perfect Parts

USA . 40,320 parts In-Stock

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40,320

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Infinite Electronics LLP (Excess)

. 36,000 parts In-Stock

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Lixinc

USA . 8,648 parts In-Stock

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Futuretech Components

Singapore . 6,000 parts In-Stock

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Authorized Procurement Solutions

USA . 6,000 parts In-Stock

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6,000

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Glotronic Ltd.

UK . 4,800 parts In-Stock

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4,800

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UNI Independent Distributors

Spain . 2,982 parts In-Stock

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2,982

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iodParts Technologies Inc.

India . 1,388 parts In-Stock

1+ parts

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$3.820

1k+ parts

$3.395

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1,388

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$3.820

$3.395

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Argo Parts USA

USA . 1,041 parts In-Stock

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1,041

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Overview

Experience cutting-edge technology with the CLRC66302HN,118 by NXP Semiconductors. As a leading manufacturer in the industry, NXP Semiconductors delivers top-quality products that exceed expectations. This Telecom Interface IC offers unparalleled performance and reliability for a wide range of applications. Unlock endless possibilities with this innovative product that brings value, benefits, and advantages to customers seeking superior solutions. Choose NXP Semiconductors for excellence in technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability of the product.

Surface Mount: YES

Surface mount capability allows for easier and more efficient integration into electronic designs.

Package Shape: SQUARE

Square package shape provides a compact and space-saving design for the product.

No. of Terminals: 32

With 32 terminals, this product can support complex telecom interface functionality.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The package style offers thermal management features and a slim profile, contributing to better performance and space efficiency.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance in various environmental conditions.

Minimum Operating Temperature: -25 °C

The low minimum operating temperature allows for operation in colder environments without loss of functionality.

Terminal Position: QUAD

Quad terminal position enables efficient connectivity and signal transmission within the product.

Maximum Seated Height: 1 mm

Low seated height contributes to a more compact and streamlined design.

Width: 5 mm

The narrow width makes the product suitable for applications with space constraints.

Maximum Time At Peak Reflow Temperature (s): 30

This specification ensures proper soldering and reliability during the manufacturing process.

Peak Reflow Temperature °C: 260

The peak reflow temperature allows for proper soldering of the product to PCBs.

Length: 5 mm

Compact length enhances the overall space efficiency of the product.

Technology: CMOS

CMOS technology offers low power consumption and high integration capabilities for efficient operation.

Terminal Form: NO LEAD

No lead terminal form complies with environmental regulations and promotes sustainable manufacturing practices.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom applications, ensuring optimal performance in telecommunications systems.

Nominal Supply Voltage: 5 V

Stable 5V supply voltage is commonly used in telecom systems, ensuring compatibility with existing setups.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting and compact PCB design.

Technical Specifications

Other Function Telecom Interface ICs CLRC66302HN,118 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PQCC-N32

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

CLRC66302HN,118 Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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