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CLRC63201T/0FE,118

NXP Semiconductors

CLRC63201T/0FE,118 by NXP Semiconductors

NXP Semiconductors' CLRC63201T/0FE,118 is a telecom IC with 32 terminals in a small outline package. Operating b/w -25°C to 85°C, it has a nominal voltage of 5V and terminal pitch of 1.27mm. Ideal for telecom circuits, this GULL WING terminal form IC is surface mountable and measures 20.5mm x 7.5mm x 2.65mm (LxWxH).

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

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Cyclops Electronics Ltd

UK . 2,011 parts In-Stock

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Anansix

USA . 1,798 parts In-Stock

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Digiode

USA . 1,649 parts In-Stock

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Vyrian

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Martec Srl

Italy . 178 parts In-Stock

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ComSIT Distribution GmbH

Germany . 110 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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Corohmni

South Africa . 876 parts In-Stock

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$6.776

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Aztec Data Supply Inc.

USA . 2,954 parts In-Stock

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AZTECH Wire

Italy . 388 parts In-Stock

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Semicontronic

India . 1,408 parts In-Stock

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$53.625

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$53.350

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Ampacity Inc.

Singapore . 1,040 parts In-Stock

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$755.000

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One Stop Electronics

USA . 437 parts In-Stock

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Continental Prestige Electronics

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UNI Independent Distributors

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Argo Parts USA

USA . 2,038 parts In-Stock

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Corphita

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Bastille Electronics

Australia . 120 parts In-Stock

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Overview

Unlock a world of seamless connectivity with the CLRC63201T/0FE,118 by NXP Semiconductors. As a leading manufacturer in the industry, NXP delivers top-quality telecom interface ICs designed to optimize performance and reliability. This versatile product is ideal for a wide range of applications, offering customers unparalleled value and benefits. Experience the advanced features and advantages that the CLRC63201T/0FE,118 brings to your projects today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the IC, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy installation on circuit boards, saving time and effort during assembly.

No. of Terminals: 32

Offers a high level of connectivity options, making it versatile for various telecommunications applications.

Maximum Operating Temperature: 85 °C

Ensures stable performance even under high temperature conditions, increasing reliability.

Nominal Supply Voltage: 5 V

Compatible with standard voltage requirements, making it easy to integrate into existing systems.

Technical Specifications

Other Function Telecom Interface ICs CLRC63201T/0FE,118 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G32

Length:

20.5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

250

Maximum Seated Height:

2.65 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

CLRC63201T/0FE,118 Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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