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CLRC63201T/0FE

NXP Semiconductors

CLRC63201T/0FE by NXP Semiconductors

NXP Semiconductors' CLRC63201T/0FE is a telecom IC with 32 terminals, operating b/w -25°C to 85°C. It has a small outline package style, gull wing terminal form, and nickel palladium gold finish. Ideal for telecom circuits, it requires a nominal voltage of 5V and measures 20.5mm x 7.5mm x 2.65mm in size.

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LIBRA Elektronik GmbH

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AZTECH Wire

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Aztec Data Supply Inc.

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Corohmni

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Overview

Unlock seamless connectivity and enhance telecommunications systems with the CLRC63201T/0FE by NXP Semiconductors. Crafted with precision and expertise, this telecom interface IC offers reliability and superior performance in a compact package. Ideal for various applications, this product ensures optimal functionality and seamless integration, making it a must-have for your next project. Experience unmatched quality, efficiency, and value with the CLRC63201T/0FE - revolutionize your telecommunications experience today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides durability and protection for the telecom interface IC, making it a reliable choice for long-term use.

Surface Mount: YES

The surface mount capability allows for easy and secure installation of the IC onto a circuit board, ensuring a stable connection and efficient performance.

Package Shape: RECTANGULAR

The rectangular package shape offers a compact design, making it easy to integrate the IC into various telecommunications systems while conserving space.

No. of Terminals: 32

With a high number of terminals, this IC can accommodate a wide range of input and output connections, making it versatile for different telecom applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style enhances the overall efficiency of the IC, as it helps to reduce power consumption and optimize performance.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures that the IC can withstand various environmental conditions, making it suitable for use in diverse settings.

Minimum Operating Temperature: -25 °C

The low minimum operating temperature allows the IC to function effectively even in colder environments, adding to its versatility and reliability.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish on the terminals provides excellent conductivity and resistance to corrosion, ensuring a stable and durable connection.

Terminal Position: DUAL

The dual terminal position allows for flexibility in installation and connection options, making it easier to integrate the IC into different telecom systems.

Maximum Seated Height: 2.65 mm

The low maximum seated height of the IC contributes to its compact design, facilitating easy installation and space-saving integration.

Width: 7.5 mm

The narrow width of the IC enhances its compatibility with different circuit board layouts, making it suitable for a variety of telecom interface applications.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature ensures quick and efficient soldering of the IC onto the circuit board, saving time in the manufacturing process.

Peak Reflow Temperature °C: 250

The high peak reflow temperature tolerance of the IC enables reliable and stable soldering connections, enhancing overall performance and longevity.

Length: 20.5 mm

The moderate length of the IC allows for easy integration into standard circuit board layouts and facilitates efficient connection with other components.

Terminal Form: GULL WING

The gull wing terminal form enhances the mechanical strength and stability of the connections, ensuring a secure and reliable performance of the IC.

Telecom IC Type: TELECOM CIRCUIT

With its specific telecom circuit type, this IC is optimized for telecommunications applications, providing superior performance and functionality for such systems.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage requirement ensures compatibility with common power sources, making it easy to integrate the IC into existing telecom setups.

Terminal Pitch: 1.27 mm

The small terminal pitch allows for a high density of connections on the IC, enabling efficient data transfer and communication in telecom systems.

Technical Specifications

Other Function Telecom Interface ICs CLRC63201T/0FE attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G32

JESD-609 Code:

e4

Length:

20.5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

250

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

CLRC63201T/0FE Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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