Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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CLRC66301HN1/TRAYB by NXP Semiconductors is a telecom interface IC designed for efficient communication. It features a compact 5mm x 5mm size, operates b/w -25 °C to 85 °C, and supports a nominal voltage of 5V. Ideal for applications requiring reliable connectivity in space-constrained environments.
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$990.000
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Corphita
The use of PLASTIC/EPOXY provides durability and reliability, ensuring the IC can withstand various environmental conditions.
Surface mount technology allows for easier assembly and compact design, saving space on the PCB.
The square package shape facilitates efficient placement on PCB, optimizing board layout and thermal management.
Having 32 terminals enables more connection options, allowing for complex functionalities while maintaining a compact design.
The very thin profile enhances space efficiency, while the heat sink aspect improves thermal performance during operation.
A maximum operating temperature of 85 °C ensures reliable performance in various operating environments without overheating.
The ability to operate down to -25 °C makes this IC suitable for use in cold environments, broadening its application range.
Quad terminal positioning allows for versatile layout options, improving design flexibility and PCB routing efficiency.
With a maximum seated height of only 1 mm, this IC is ideal for applications where low profile components are necessary.
A width of 5 mm promotes compact designs, making it easier to fit into tight spaces on a PCB.
The small length also contributes to a compact form factor, an important factor in modern electronic design.
No-lead terminals reduce the overall size and weight of the package, assisting in a sleeker electronic design.
Being designed as a telecom circuit guarantees it meets the specific requirements for telecommunications applications.
A nominal supply voltage of 5 V is standard for many digital applications, ensuring compatibility with a wide range of systems.
A terminal pitch of 0.5 mm allows for high-density interconnections, maximizing the number of connections in a compact space.
Other Function Telecom Interface ICs CLRC66301HN1/TRAYB attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors
JESD-30 Code:
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CLRC66301HN1/TRAYB Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
SMBJ18CA
Yangzhou Yangjie Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Maximum Clamping Voltage: 29.2 V; Nominal Breakdown Voltage: 21.05 V; Maximum Repetitive Peak Reverse Voltage: 18 V; Polarity: BIDIRECTIONAL;
2N7002
Unisonic Technologies
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Package Body Material: PLASTIC/EPOXY; Package Shape: RECTANGULAR;
M24308/2-1F
Air Electro
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Mating Info.: MULTIPLE MATING PARTS AVAILABLE; MIL Conformity: YES; Additional Features: STANDARD: MIL-DTL-24308;
SS14
General Instrument
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148WT
Bytesonic Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
IRLML6401TRPBF
International Rectifier
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.3 W; Minimum Operating Temperature: -55 Cel; Avalanche Energy Rating (EAS): 33 mJ;
LM358M
Fairchild Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
1554216004
Molex
WIRE AND CABLE;
BSS138
NXP Semiconductors
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; No. of Terminals: 3; Maximum Drain Current (ID): .2 A; Operating Mode: ENHANCEMENT MODE;
2N2222A
Loras Industries
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
LM555CM
Harris Semiconductor
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
LM107H/883
National Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Technology: BIPOLAR;
1N4148WT-7
Diodes Incorporated
1N4148WT-7 by Diodes Inc. is a fast recovery rectifier diode with a max reverse recovery time of 0.004 us and a max forward voltage of 1.25 V. It has a package style of small outline, making it suitable for surface mount applications where high-speed switching is required at temperatures ranging from -65 to 150 °C.
LL4148
Onsemi
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Surge Components
AB26TRB-32.768KHZ--T
Abracon
AB26TRB-32.768KHZ--T by Abracon is a crystal oscillator with 20 ppm frequency tolerance, 126% stability, and 35000 ohm series resistance. Ideal for applications requiring 0.032768 MHz nominal frequency in surface mount configurations.
CRCW04020000Z0ED
Vishay Intertechnology
Vishay Intertechnology's CRCW04020000Z0ED is a 0 ohm jumper resistor with METAL GLAZE/THICK FILM tech. Operating b/w -55 to 155 °C, it suits SMT applications in automotive electronics due to AEC-Q200 compliance and 0.063 W power dissipation.
BAV99WT1G
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LM317T
STMicroelectronics
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; JESD-30 Code: R-XSFM-T3; Minimum Input-Output Voltage Differential: 3 V;
1N4148
International Components
RECTIFIER DIODE; Surface Mount: NO; No. of Elements: 1; Terminal Finish: Tin/Lead (Sn/Pb); JESD-609 Code: e0; Maximum Reverse Recovery Time: .004 us;
DA14531MOD-00F0100C
Dialog Semiconductor
TELECOM CIRCUIT; Peak Reflow Temperature (C): 250; Moisture Sensitivity Level (MSL): 3;
BM70BLES1FC2-0002AA
Microchip Technology
BM70BLES1FC2-0002AA by Microchip Tech is a 33-terminal IC with temp range -20 to 70°C. It operates at 3V, data rate of 0.0086 Mbps, ideal for telecom applications due to its nickel/gold finish and no-lead terminal form.
A1101R04C00GM
Ttm Technologies
TELECOM CIRCUIT;
CC2640R2FRGZR
Texas Instruments
CC2640R2FRGZR by Texas Instruments is a telecom IC with 48 terminals in a square chip carrier package. It operates b/w -40 to 85°C, with a supply voltage of 3V. Ideal for telecom circuits, it features nickel palladium gold terminal finish and no-lead terminal form.
CYBLE-214015-01
Infineon Technologies
CYBLE-214015-01 by Infineon Technologies is a surface mount telecom IC with 1 function and 32 terminals. It has a square package shape, measuring 11mm in width and length, with a max seated height of 1.8mm. With an operating temperature range of -40 to 85°C, it is suitable for industrial applications.
PCM3060PWR
PCM3060PWR by Texas Instruments is a 2-channel Telecom IC with CMOS technology. It operates b/w -25°C to 85°C, with a supply voltage of 3.3V. The package style is small outline, thin profile, and shrink pitch, making it suitable for telecom circuit applications.
CYW43439KUBGT
TELECOM CIRCUIT; Moisture Sensitivity Level (MSL): 1;
LXMS33HCNG-134
Murata Manufacturing
Murata's LXMS33HCNG-134 is a telecom IC with small outline, very thin profile package. Operating temp range -40 to 85°C. Dual terminal position, no lead form for industrial applications in telecom interfaces.
NRF24L01P-R
Nordic Semiconductor Asa
NRF24L01P-R by Nordic Semiconductor Asa is a 20-terminal telecom IC with 3V supply voltage, operating from -40 to 85°C. It comes in a square chip carrier package and is surface-mountable. Ideal for industrial applications requiring wireless communication at peak reflow temp of 260°C.
EFR32BG22C224F512GM32-C
Silicon Labs
TELECOM CIRCUIT; JESD-609 Code: e3; Moisture Sensitivity Level (MSL): 2; Peak Reflow Temperature (C): 260; Terminal Finish: MATTE TIN; Maximum Time At Peak Reflow Temperature (s): 40;
WL1837MODGIMOCR
Texas Instruments' WL1837MODGIMOCR is a telecom IC with 100 terminals, operating at -40 to 85°C. It has a supply voltage of 3.7V and supports data rates up to 100Mbps. This rectangular package with grid array style is ideal for industrial telecom applications.
DC-ME4-01T-S-UPW
Digi International
DC-ME4-01T-S-UPW by Digi Int. is a SERIAL DEVICE SERVER with 100 Mbps Data Rate, operating at -40 to 85°C. Its MICROELECTRONIC ASSEMBLY package measures 19.05mm x 36.7mm x 18.67mm, ideal for telecom interfaces in various applications.
AD9874ABST
Analog Devices
AD9874ABST by Analog Devices is a telecom interface IC with 48 terminals in a square package. It operates at -40 to 85°C, with power supplies of 3/3.3V and 3/5V. This BICMOS technology IC is ideal for telecom circuits requiring low profile, fine pitch components.
ISP1507-AX-ST
Insight Sip
ISP1507-AX-ST by Insight Sip is a telecom IC with 2 Mbps data rate, operating at -40 to 85°C. It features a square package, 62 terminals, and is surface mountable. Ideal for industrial applications requiring a 3V supply voltage in microelectronic assemblies.
CY7B933-JXC
Infineon Technologies' CY7B933-JXC is a BICMOS technology telecom IC with 28 terminals in a square chip carrier package. Operating at 5V, it supports data rates up to 400 Mbps and draws a max supply current of 155mA. Ideal for telecom circuits, this IC has a temperature range of 0-70°C and is surface mountable.
BMD-350-A-R
U-blox Ag
The U-blox Ag BMD-350-A-R is a telecom IC with 2 Mbps data rate, suitable for industrial applications. It operates b/w -40°C to 85°C, with peak reflow temperature of 250°C. This surface mount rectangular package has MSL level of 3 and is ideal for telecom circuit designs.
ST60-2230C-P
Laird Technologies
NEO-M8J-0
XB3-24Z8UT
The Digi International XB3-24Z8UT is an industrial-grade telecom circuit with 20 terminals in a through-hole package. It operates b/w -40°C to 85°C, making it suitable for various telecom interface applications. This MICROELECTRONIC ASSEMBLY offers reliable performance in harsh environments.
NINA-B112-05B
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
CLRC66303HNE
TELECOM CIRCUIT; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 2; Terminal Finish: NICKEL PALLADIUM GOLD SILVER; Maximum Time At Peak Reflow Temperature (s): 30; JESD-609 Code: e4;
CLRC66303HNY
TELECOM CIRCUIT; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 2; Terminal Finish: NICKEL PALLADIUM GOLD SILVER; JESD-609 Code: e4;
CLRC66301HN,551
TELECOM CIRCUIT; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 30; Moisture Sensitivity Level (MSL): 2;
CLRC66302HN,151
CLRC66302HN,151 by NXP Semiconductors is a telecom interface IC with 1 function. It has a square package shape with 32 terminals and a max seated height of 1mm. This IC operates at temperatures ranging from -25 to 85 °C and is suitable for telecom circuit applications.
CLRC63201T/0FE,112
NXP Semiconductors' CLRC63201T/0FE,112 is a telecom IC with 32 terminals in a small outline package. Operating b/w -25°C to 85°C, it has a nominal voltage of 3.3V and peak reflow temperature of 250°C. Ideal for telecom circuits, this IC is surface mountable and features nickel palladium gold terminal finish.
CLRC66301HN,557
TELECOM CIRCUIT; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 2; Maximum Time At Peak Reflow Temperature (s): 30;
CLRC66302HN,118
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;
CLRC66302HN,157
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;
CLRC66301HN
CLRC63201T/0FE,118
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: SOP; Package Shape: RECTANGULAR;
CLRC632
TELECOM CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: SOP; Package Shape: RECTANGULAR; JESD-30 Code: R-PDSO-G32;
CLRC63201T/0FE
NXP Semiconductors' CLRC63201T/0FE is a telecom IC with 32 terminals, operating b/w -25°C to 85°C. It has a small outline package style, gull wing terminal form, and nickel palladium gold finish. Ideal for telecom circuits, it requires a nominal voltage of 5V and measures 20.5mm x 7.5mm x 2.65mm in size.
CLRC66302HN/T/R
CLRC66301HN1/TRAYBM
CLRC66302HN/TRAYB
CLRC66103HN/T/R
CLRC66302HN/TRAYBM
CLRC66301HN/TRAYB
CLRC66103HN/TRAYB
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