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CLRC66301HN1/TRAYB

NXP Semiconductors

CLRC66301HN1/TRAYB by NXP Semiconductors

CLRC66301HN1/TRAYB by NXP Semiconductors is a telecom interface IC designed for efficient communication. It features a compact 5mm x 5mm size, operates b/w -25 °C to 85 °C, and supports a nominal voltage of 5V. Ideal for applications requiring reliable connectivity in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,425 parts In-Stock

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Vyrian

USA . 2,363 parts In-Stock

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2,363

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Digiode

USA . 535 parts In-Stock

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535

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Native Components

USA . 312 parts In-Stock

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$0.927

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312

$0.927

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Northwest PG Solutions

USA . 922 parts In-Stock

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$1.019

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922

$1.019

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One Stop Electronics

USA . 598 parts In-Stock

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$990.000

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598

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UNI Independent Distributors

Spain . 3,669 parts In-Stock

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Corphita

USA . 3,125 parts In-Stock

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Overview

Unlock unparalleled performance with the CLRC66301HN1/TRAYB from NXP Semiconductors. Renowned for their innovation and reliability, NXP delivers a telecom interface solution that excels in diverse applications, ensuring seamless connectivity and efficiency. This compact, surface-mount IC is designed to thrive in varying environments, making it an ideal choice for modern telecom demands. Enhance your projects with quality and dependability that only NXP can offer!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of PLASTIC/EPOXY provides durability and reliability, ensuring the IC can withstand various environmental conditions.

Surface Mount: YES

Surface mount technology allows for easier assembly and compact design, saving space on the PCB.

Package Shape: SQUARE

The square package shape facilitates efficient placement on PCB, optimizing board layout and thermal management.

No. of Terminals: 32

Having 32 terminals enables more connection options, allowing for complex functionalities while maintaining a compact design.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The very thin profile enhances space efficiency, while the heat sink aspect improves thermal performance during operation.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C ensures reliable performance in various operating environments without overheating.

Minimum Operating Temperature: -25 °C

The ability to operate down to -25 °C makes this IC suitable for use in cold environments, broadening its application range.

Terminal Position: QUAD

Quad terminal positioning allows for versatile layout options, improving design flexibility and PCB routing efficiency.

Maximum Seated Height: 1 mm

With a maximum seated height of only 1 mm, this IC is ideal for applications where low profile components are necessary.

Width: 5 mm

A width of 5 mm promotes compact designs, making it easier to fit into tight spaces on a PCB.

Length: 5 mm

The small length also contributes to a compact form factor, an important factor in modern electronic design.

Terminal Form: NO LEAD

No-lead terminals reduce the overall size and weight of the package, assisting in a sleeker electronic design.

Telecom IC Type: TELECOM CIRCUIT

Being designed as a telecom circuit guarantees it meets the specific requirements for telecommunications applications.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5 V is standard for many digital applications, ensuring compatibility with a wide range of systems.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for high-density interconnections, maximizing the number of connections in a compact space.

Technical Specifications

Other Function Telecom Interface ICs CLRC66301HN1/TRAYB attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PQCC-N32

Length:

5 mm

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Trade Compliance

CLRC66301HN1/TRAYB Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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