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CLRC632

NXP Semiconductors

CLRC632 by NXP Semiconductors

NXP Semiconductors' CLRC632 is a telecom IC with 32 terminals, operating at a nominal voltage of 5V. It features a small outline package style and gull wing terminal form, suitable for surface mount applications in telecom circuits. The package body material is plastic/epoxy, making it durable for various industrial uses.

Median Price

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Lifecycle Status

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6

In-Stock Inventory

1k+

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Digiode

USA . 2,632 parts In-Stock

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Anansix

USA . 1,617 parts In-Stock

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Vyrian

USA . 986 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 27 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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EMSNET

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Aztec Data Supply Inc.

USA . 1,810 parts In-Stock

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$6.129

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$6.129

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AZTECH Wire

Italy . 547 parts In-Stock

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$6.815

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Corohmni

South Africa . 979 parts In-Stock

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One Stop Electronics

USA . 1,072 parts In-Stock

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$497.000

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Ampacity Inc.

Singapore . 363 parts In-Stock

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$683.000

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Lixinc

USA . 9,684 parts In-Stock

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Metaverse IC Inc.

Canada . 8,000 parts In-Stock

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Continental Prestige Electronics

USA . 5,175 parts In-Stock

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Argo Parts USA

USA . 4,381 parts In-Stock

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UNI Independent Distributors

Spain . 3,568 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,400 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,600 parts In-Stock

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GreenTree Electronics

Israel . 359 parts In-Stock

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Corphita

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294

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Aranea Global

USA . 50 parts In-Stock

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Overview

Unlock the power of seamless communication with the CLRC632 by NXP Semiconductors. This top-quality telecom interface IC offers unparalleled reliability and performance, making it the perfect choice for a wide range of applications. From secure access control systems to cutting-edge telecommunications devices, this versatile product delivers value and benefits that exceed expectations. Trust in the expertise of NXP Semiconductors and elevate your projects to new heights with the CLRC632.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the IC, ensuring a longer lifespan and better performance.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving time and effort during manufacturing.

Package Shape: RECTANGULAR

The rectangular shape makes it easy to design and integrate into various electronic devices and systems.

No. of Terminals: 32

Having a sufficient number of terminals allows for more connections and functionalities, making it versatile for different applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the circuit board, making it suitable for compact electronic devices.

Terminal Position: DUAL

Dual terminal positions provide redundancy and flexibility in circuit design, enhancing reliability and ease of use.

Terminal Form: GULL WING

The gull wing terminal form offers better mechanical strength and heat dissipation, improving overall performance and reliability.

Telecom IC Type: TELECOM CIRCUIT

Being specifically designed for telecom applications, this IC ensures optimal functionality and compatibility within communication systems.

Nominal Supply Voltage: 5 V

The 5V supply voltage is a common standard in electronic devices, making this IC compatible with a wide range of systems and components.

Technical Specifications

Other Function Telecom Interface ICs CLRC632 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G32

No. of Functions:

1

No. of Terminals:

32

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Terminal Form:

Terminal Position:

DUAL

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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