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CLRC66301HN1/TRAYBM

NXP Semiconductors

CLRC66301HN1/TRAYBM by NXP Semiconductors

CLRC66301HN1/TRAYBM by NXP Semiconductors is a versatile telecom interface IC designed for surface mount applications. It operates within -25 °C to 85 °C, features a compact 5mm x 5mm square package with 32 terminals, and requires a nominal voltage of 5V. Ideal for advanced telecom circuits, it ensures efficient performance in various environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,177 parts In-Stock

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3,177

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Digiode

USA . 1,737 parts In-Stock

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1,737

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Anansix

USA . 1,650 parts In-Stock

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1,650

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Distributors (Availability)

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Native Components

USA . 756 parts In-Stock

1+ parts

$294.800

100+ parts

$288.904

1k+ parts

$285.956

10k+ parts

$283.008

756

$294.800

$288.904

$285.956

$283.008

Northwest PG Solutions

USA . 795 parts In-Stock

1+ parts

$324.280

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795

$324.280

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One Stop Electronics

USA . 189 parts In-Stock

1+ parts

$986.000

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189

$986.000

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UNI Independent Distributors

Spain . 6,694 parts In-Stock

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6,694

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Corphita

USA . 1,554 parts In-Stock

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1,554

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Overview

Elevate your telecom solutions with the CLRC66301HN1/TRAYBM from NXP Semiconductors, a leader in innovative technology. Designed for optimal performance and reliability, this compact IC excels in diverse applications—from smart meters to contactless payment systems. With exceptional durability across a wide temperature range and seamless integration capabilities, it empowers customers to build cutting-edge products that stand out in today’s competitive market. Choose quality, choose NXP!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy enhances the product's resistance to environmental factors while ensuring long-term reliability.

Surface Mount: YES

Surface mount technology allows for efficient use of space on PCBs and enables automated assembly, making it suitable for high-density applications.

Package Shape: SQUARE

The square shape can improve thermal management and facilitate even distribution of heat, increasing operational stability.

No. of Terminals: 32

With 32 terminals available, this IC can support complex functionalities and versatile connectivity options for advanced applications.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This style enhances cooling options and minimizes space usage, making it ideal for compact telecom devices.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures robust performance in challenging environments, suitable for diverse telecom applications.

Minimum Operating Temperature: -25 °C

The ability to operate at low temperatures makes this IC reliable in outdoor and industrial environments.

Terminal Position: QUAD

Quad terminal positioning provides flexibility in design and ease of integration into various circuit configurations.

Maximum Seated Height: 1 mm

The low profile reduces the overall height of the assembly, aiding in the design of slimmer devices.

Width: 5 mm

A compact width allows for easier integration into tight spaces within telecom equipment.

Length: 5 mm

The equal length offers balanced dimensions, making it easy to layout on boards without complicated routing.

Terminal Form: NO LEAD

No lead configuration improves reliability and reduces the risk of solder defects during assembly, contributing to higher yield rates.

Telecom IC Type: TELECOM CIRCUIT

Designed specifically for telecom applications, ensuring optimal performance in communication systems.

Nominal Supply Voltage: 5 V

Operating at a standard 5V supply allows for easy integration with other components and systems, ensuring compatibility.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch accommodates high-density connections, making it suitable for advanced telecom circuit designs.

Technical Specifications

Other Function Telecom Interface ICs CLRC66301HN1/TRAYBM attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PQCC-N32

Length:

5 mm

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Trade Compliance

CLRC66301HN1/TRAYBM Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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