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CLRC63201T/0FE,112

NXP Semiconductors

CLRC63201T/0FE,112 by NXP Semiconductors

NXP Semiconductors' CLRC63201T/0FE,112 is a telecom IC with 32 terminals in a small outline package. Operating b/w -25°C to 85°C, it has a nominal voltage of 3.3V and peak reflow temperature of 250°C. Ideal for telecom circuits, this IC is surface mountable and features nickel palladium gold terminal finish.

Median Price

$21.442

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,660 parts In-Stock

1+ parts

$10.620

100+ parts

$10.410

1k+ parts

$10.200

10k+ parts

-

3,660

$10.620

$10.410

$10.200

-

Mouser Electronics

USA . 860 parts In-Stock

1+ parts

$23.260

100+ parts

$19.680

1k+ parts

$16.100

10k+ parts

$15.780

860

$23.260

$19.680

$16.100

$15.780

Element14

Singapore . 306 parts In-Stock

1+ parts

$25.600

100+ parts

$19.510

1k+ parts

$17.070

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-

306

$25.600

$19.510

$17.070

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Chip1Stop

Japan . 507 parts In-Stock

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507

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Verical

USA . 324 parts In-Stock

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$19.625

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324

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$19.625

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Distributors (In-Stock)

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Nova Conductors

Japan . 90 parts In-Stock

1+ parts

$19.215

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-

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90

$19.215

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Digiode

USA . 4,358 parts In-Stock

1+ parts

$20.235

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4,358

$20.235

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Sensible Micro Corp

USA . 11,832 parts In-Stock

1+ parts

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11,832

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Anansix

USA . 2,228 parts In-Stock

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2,228

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Vyrian

USA . 427 parts In-Stock

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427

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Infinite Electronics LLP

India . 86 parts In-Stock

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86

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LIBRA Elektronik GmbH

Germany . 56 parts In-Stock

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56

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 3,015 parts In-Stock

1+ parts

$9.052

100+ parts

-

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3,015

$9.052

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-

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Advanced Electronics

New Zealand . 40 parts In-Stock

1+ parts

$10.960

100+ parts

$10.412

1k+ parts

$10.412

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40

$10.960

$10.412

$10.412

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Semicontronic

India . 308 parts In-Stock

1+ parts

$16.680

100+ parts

$16.263

1k+ parts

$16.180

10k+ parts

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308

$16.680

$16.263

$16.180

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Ampacity Inc.

Singapore . 117 parts In-Stock

1+ parts

$16.680

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-

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117

$16.680

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Modulus Dynamics

Lithuania . 2,394 parts In-Stock

1+ parts

$17.514

100+ parts

$17.514

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$17.514

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2,394

$17.514

$17.514

$17.514

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Continental Prestige Electronics

USA . 5,774 parts In-Stock

1+ parts

$18.720

100+ parts

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$18.346

5,774

$18.720

-

-

$18.346

Corphita

USA . 4,203 parts In-Stock

1+ parts

$19.170

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4,203

$19.170

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Perfect Parts

USA . 41,892 parts In-Stock

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41,892

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Lixinc

USA . 17,359 parts In-Stock

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17,359

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S.R.D Solutions

India . 10,000 parts In-Stock

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GreenTree Electronics

Israel . 7,192 parts In-Stock

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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7,000

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A-Z Elektronik GmbH

Germany . 5,438 parts In-Stock

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5,438

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Robosynatics

Brazil . 2,760 parts In-Stock

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2,760

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Lucentia Tech

USA . 2,760 parts In-Stock

1+ parts

-

100+ parts

$17.430

1k+ parts

$17.075

10k+ parts

$17.075

2,760

-

$17.430

$17.075

$17.075

Argo Parts USA

USA . 2,288 parts In-Stock

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2,288

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

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100+ parts

$18.831

1k+ parts

$18.254

10k+ parts

$17.870

2,000

-

$18.831

$18.254

$17.870

UNI Independent Distributors

Spain . 394 parts In-Stock

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394

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Corohmni

South Africa . 203 parts In-Stock

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203

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Overview

Discover the superior quality and reliability of the CLRC63201T/0FE,112 by NXP Semiconductors. This innovative telecom interface IC offers unmatched performance in various applications. With a compact design and advanced features, this product provides customers with exceptional value and benefits. Trust NXP Semiconductors for cutting-edge technology that exceeds expectations. Elevate your projects with the CLRC63201T/0FE,112 and experience unparalleled advantages in the telecommunications industry.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring longevity of the product.

Surface Mount: YES

Allows for easy installation on PCBs, saving space and reducing assembly time.

No. of Terminals: 32

Provides a sufficient number of connections for various telecom interface functions.

Maximum Operating Temperature: 85 °C

Ensures stable performance even in elevated temperature environments.

Nominal Supply Voltage: 3.3 V

Compatible with common power supply standards, making integration easier.

Technical Specifications

Other Function Telecom Interface ICs CLRC63201T/0FE,112 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G32

JESD-609 Code:

e4

Length:

20.5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

250

Maximum Seated Height:

2.65 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

CLRC63201T/0FE,112 Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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