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PN5321A3HN/C106,51

NXP Semiconductors

PN5321A3HN/C106,51 by NXP Semiconductors

PN5321A3HN/C106,51 by NXP Semiconductors is a telecom IC with 40 terminals in a square chip carrier package. Operating b/w -30 to 85°C, it has a nominal voltage of 5V and terminal pitch of 0.5mm. Ideal for telecom circuits, this IC is surface mountable and has a low profile design.

Median Price

$10.702

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 52 parts In-Stock

1+ parts

$6.615

100+ parts

-

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52

$6.615

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Verical

USA . 2,717 parts In-Stock

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$8.262

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2,717

$8.262

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Chip1Stop

Japan . 2,717 parts In-Stock

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$9.100

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2,717

$9.100

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Rochester

USA . 1,355 parts In-Stock

1+ parts

$10.610

100+ parts

$9.980

1k+ parts

$9.020

10k+ parts

-

1,355

$10.610

$9.980

$9.020

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Farnell

UK . 654 parts In-Stock

1+ parts

$11.870

100+ parts

$8.530

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654

$11.870

$8.530

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Newark

USA . 168 parts In-Stock

1+ parts

$16.830

100+ parts

$12.120

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$11.120

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168

$16.830

$12.120

$11.120

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Mouser Electronics

USA . 3,544 parts In-Stock

1+ parts

$16.910

100+ parts

$12.070

1k+ parts

$11.020

10k+ parts

$9.640

3,544

$16.910

$12.070

$11.020

$9.640

Element14

Singapore . 1,671 parts In-Stock

1+ parts

$25.880

100+ parts

$18.460

1k+ parts

$18.280

10k+ parts

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1,671

$25.880

$18.460

$18.280

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Future Electronics

Canada . 4,000 parts In-Stock

1+ parts

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$9.100

4,000

-

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$9.100

DigiKey

USA . 2,762 parts In-Stock

1+ parts

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$10.795

2,762

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$10.795

Distributors (In-Stock)

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Digiode

USA . 635 parts In-Stock

1+ parts

$6.308

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635

$6.308

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Nova Conductors

Japan . 450 parts In-Stock

1+ parts

$11.267

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450

$11.267

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IBS Electronics

USA . 8,000 parts In-Stock

1+ parts

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$12.763

8,000

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$12.763

NAC Semi

USA . 8,000 parts In-Stock

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$11.980

8,000

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$11.980

Vyrian

USA . 1,587 parts In-Stock

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1,587

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Anansix

USA . 723 parts In-Stock

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723

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Distributors (Availability)

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Corphita

USA . 3,044 parts In-Stock

1+ parts

$5.976

100+ parts

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3,044

$5.976

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Semicontronic

India . 1,929 parts In-Stock

1+ parts

$6.260

100+ parts

$6.104

1k+ parts

$6.072

10k+ parts

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1,929

$6.260

$6.104

$6.072

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Ampacity Inc.

Singapore . 1,880 parts In-Stock

1+ parts

$6.260

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1,880

$6.260

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Component Stockers USA

USA . 3,398 parts In-Stock

1+ parts

$9.960

100+ parts

$8.160

1k+ parts

$7.990

10k+ parts

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3,398

$9.960

$8.160

$7.990

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Aranea Global

USA . 2,000 parts In-Stock

1+ parts

$11.041

100+ parts

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1k+ parts

$10.600

10k+ parts

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2,000

$11.041

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$10.600

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Advanced Electronics

New Zealand . 350 parts In-Stock

1+ parts

$11.464

100+ parts

$10.891

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$10.891

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350

$11.464

$10.891

$10.891

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Corohmni

South Africa . 1,041 parts In-Stock

1+ parts

$13.633

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1,041

$13.633

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Aztec Data Supply Inc.

USA . 979 parts In-Stock

1+ parts

$17.620

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979

$17.620

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Lixinc

USA . 15,317 parts In-Stock

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Robosynatics

Brazil . 4,343 parts In-Stock

1+ parts

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$11.919

1k+ parts

$11.676

10k+ parts

$11.676

4,343

-

$11.919

$11.676

$11.676

Lucentia Tech

USA . 4,343 parts In-Stock

1+ parts

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100+ parts

$11.919

1k+ parts

$11.676

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$11.676

4,343

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$11.919

$11.676

$11.676

QUARKTWIN TECHNOLOGY LTD

USA . 3,712 parts In-Stock

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S.R.D Solutions

India . 3,200 parts In-Stock

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iodParts Technologies Inc.

India . 3,000 parts In-Stock

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$8.420

10k+ parts

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3,000

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$8.420

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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UNI Independent Distributors

Spain . 2,389 parts In-Stock

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2,389

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Continental Prestige Electronics

USA . 2,136 parts In-Stock

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$8.700

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2,136

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$8.700

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Argo Parts USA

USA . 111 parts In-Stock

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111

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Perfect Parts

USA . 17 parts In-Stock

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17

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Overview

Elevate your telecom experience with the PN5321A3HN/C106,51 by NXP Semiconductors. This cutting-edge IC boasts top-tier quality and reliability, backed by the renowned reputation of its manufacturer. Designed for various telecom applications, this product offers unparalleled value with its advanced features and benefits. Say goodbye to connectivity issues and embrace seamless communication with this superior solution at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for a variety of applications.

Surface Mount: YES

Being surface mountable makes the product easier to install and saves space on the PCB.

Package Shape: SQUARE

The square shape allows for efficient use of board space and easy alignment on the PCB.

No. of Terminals: 40

With a high number of terminals, this product can support complex telecom interfaces with multiple connections.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style provides effective heat dissipation and a compact design.

Maximum Operating Temperature: 85 °C

The high operating temperature range ensures the product can withstand harsh environmental conditions.

Minimum Operating Temperature: -30 °C

The low operating temperature range makes the product suitable for use in various climates.

Terminal Position: QUAD

The quad terminal position simplifies the connection process and improves signal integrity.

Maximum Seated Height: 1 mm

The low seated height allows for a compact overall design and easy integration into tight spaces.

Width: 6 mm

The narrow width saves space on the PCB and facilitates a more efficient layout.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature, this product can endure the soldering process without damage.

Length: 6 mm

The short length ensures a small footprint on the PCB and enables compact system designs.

Terminal Form: NO LEAD

The lead-free terminal form complies with industry regulations and is environmentally friendly.

Telecom IC Type: TELECOM CIRCUIT

This type of IC is specifically designed for telecom applications, ensuring reliable performance in communication systems.

Nominal Supply Voltage: 5 V

The 5V supply voltage is a common standard in many electronic systems, making this product compatible with various devices.

Terminal Pitch: 0.5 mm

With a fine terminal pitch, this product allows for high-density packing of components on the PCB.

Moisture Sensitivity Level (MSL): 2

The MSL 2 rating indicates the product is moderately sensitive to moisture, allowing for safe handling and storage.

Technical Specifications

Other Function Telecom Interface ICs PN5321A3HN/C106,51 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PQCC-N40

Length:

6 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

40

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

6 mm

Trade Compliance

PN5321A3HN/C106,51 Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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