Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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NXP Semiconductors' MFRC53001T/0FE,112 is a telecom IC with 32 terminals in a small outline package. Operating b/w -25°C to 85°C, it has a nominal voltage of 5V and terminal pitch of 1.27mm. Ideal for telecom circuits, this IC is surface mountable and features gull wing terminals.
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This material provides durability and protection for the IC, ensuring long-lasting performance.
Allows for easy and efficient integration onto circuit boards, saving space and making assembly simpler.
The rectangular shape is commonly used and fits well in standard design layouts.
Offers a sufficient number of terminals for connecting to various components and peripherals.
The small outline package style is space-saving and suitable for compact electronics designs.
Can operate effectively in a wide range of temperatures, making it versatile for different environments.
Ensures functionality even in cold conditions, enhancing the reliability of the product.
The dual terminal position provides flexibility in connection options and enhances compatibility.
Low profile design helps in space-constrained applications and allows for a more compact overall system.
Compact width dimension allows for easy placement on circuit boards and efficient use of space.
Capable of withstanding high temperatures during reflow soldering processes, ensuring reliable solder connections.
Standard length dimension that fits well within typical board layouts and enclosure designs.
Gull wing terminals provide mechanical stability during soldering and assembly, reducing the risk of damage.
Specifically designed for telecom applications, ensuring optimized performance and compatibility in telecommunications systems.
Operates efficiently at standard 5V supply voltage, making it compatible with common power sources.
Fine terminal pitch allows for precise connections and is suitable for high-density PCB designs.
Other Function Telecom Interface ICs MFRC53001T/0FE,112 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors
JESD-30 Code:
Length:
Moisture Sensitivity Level (MSL):
No. of Functions:
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Peak Reflow Temperature (C):
Maximum Seated Height:
Nominal Supply Voltage:
Surface Mount:
Telecom IC Type:
Temperature Grade:
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Width:
MFRC53001T/0FE,112 Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Obsolescence/ EOL - Mult Dev obs 19/Dec/2023
PCN Packaging - All Dev Label Update 15/Dec/2020
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
LL4148
Weitron Technology
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
BSS138
Vishay Semiconductors
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Package Style (Meter): SMALL OUTLINE; Package Shape: RECTANGULAR; Transistor Application: SWITCHING;
M24308/2-1F
Cinch Connectivity Solutions
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Dielectric Withstanding Voltage (V): 1750VAC; No. of Connectors: ONE; Body Depth: .375 inch;
LM358DR2G
Onsemi
LM358DR2G by Onsemi is a dual operational amplifier with 7000uV max input offset voltage and 70dB nominal CMRR. Ideal for applications requiring low bias current such as sensor interfaces, signal conditioning circuits, and audio amplifiers. Package style: Small Outline, Technology: Bipolar, Unity Gain Bandwidth: 1000 kHz.
SMBJ18CA
Rectron
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002
Infineon Technologies
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .5 W; Transistor Element Material: SILICON; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR;
2N2222A
Raytheon Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Minimum DC Current Gain (hFE): 100; Maximum Turn On Time (ton): 35 ns;
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Terminal Finish: TIN LEAD; Maximum Operating Temperature: 150 Cel;
BSS138LT1G
BSS138LT1G by Onsemi is a N-CHANNEL FET with 50V DS Breakdown Voltage, 0.2A Drain Current, and 3.5 ohm On Resistance. Ideal for SWITCHING applications due to its ENHANCEMENT MODE operation and built-in DIODE. Operates b/w -55 to 150 °C with small outline package style for surface mount assembly.
FDD5614P
Fairchild Semiconductor
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 42 W; Terminal Position: SINGLE; Terminal Form: GULL WING;
LM7805CT
Silicon Group
Other Regulators; No. of Terminals: 3; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %; Package Body Material: PLASTIC/EPOXY; Maximum Load Regulation: .05 %;
MBRA340T3G
MBRA340T3G by Onsemi is a Schottky rectifier diode with 40V reverse test voltage and 3A max output current. Ideal for power applications, it operates b/w -55 to 150°C, features matte tin terminal finish, and comes in a small outline package.
Goodwork Semiconductor
ERJ3GEY0R00V
Panasonic
ERJ3GEY0R00V by Panasonic is a SMT fixed resistor with 0 ohm resistance, suitable for jumper applications. It features a metal glaze/thick film technology, rated for temperatures b/w -55 to 155 °C. With a compact rectangular construction and matte tin over nickel terminal finish, it is ideal for surface mount installations in various electronic devices.
Texas Instruments
2N2222A by Texas Instruments is a small signal NPN bipolar junction transistor (BJT) with a max collector-emitter voltage of 40V and a max collector current of 0.8A. It is commonly used for switching applications due to its fast turn on/off times (35ns/285ns) and high transition frequency (300MHz).
DS18B20Z
Dallas Semiconductor
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Shape or Style: RECTANGULAR; Housing: PLASTIC; Maximum Accuracy (Cel): 0.50;
1N4148WS
Daco Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
OHN3140U
Optek Technology
MAGNETIC FIELD SENSOR,HALL EFFECT; Mounting Feature: THROUGH HOLE MOUNT; No. of Terminals: 3; Output Type: ANALOG CURRENT; Package Shape or Style: RECTANGULAR; Output Range: 25mA;
C0603X104K5RACAUTO
KEMET Corporation
C0603X104K5RACAUTO by KEMET Corp is a ceramic capacitor with capacitance of 0.1 uF and rated DC voltage of 50 V. It has a temperature coefficient of 15% and can operate b/w -55 to 125 °C. This SMT package is commonly used in automotive applications due to its AEC-Q200 reference standard.
Taiwan Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
HMC1122LP4METR
Analog Devices
Analog Devices' HMC1122LP4METR is a telecom IC with 24 terminals, operating from -40 to 85°C. It has a nominal voltage of 3.3V and terminal pitch of 0.5mm. This chip carrier package is surface-mountable and suitable for industrial applications in telecom circuits.
453-00039C
Laird Technologies
TELECOM CIRCUIT; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 30;
ATWILC3000-MR110CA
Microchip Technology
ATWILC3000-MR110CA by Microchip Technology is a telecom IC with 65 Mbps data rate, operating at -40 to 85°C. It has 36 terminals in a rectangular package style, suitable for surface mount applications. With a nominal voltage of 3.3V, it is ideal for various telecom interface functions.
BLUENRG-234
STMicroelectronics
TELECOM CIRCUIT; Moisture Sensitivity Level (MSL): 1;
RS9116W-DB00-CC0-B2A
Silicon Labs
TELECOM CIRCUIT;
XB3-24Z8ST
Digi International
The Digi International XB3-24Z8ST is an industrial-grade telecom circuit with 20 terminals in a through-hole package. It operates b/w -40°C to 85°C, making it suitable for various telecom interface applications. Its dual terminal position and microelectronic assembly style enhance its functionality in telecommunications systems.
453-00005C
Laird Technologies' 453-00005C is a surface mount telecom IC with 1 function and 39 terminals. It has a rectangular shape, measures 14mm in length, and operates at temperatures ranging from -40 to 85°C. This IC is commonly used in industrial applications requiring a nominal voltage of 3V.
RN42N-I/RM
RN42N-I/RM by Microchip Technology is a telecom IC with 35 terminals, operating temperature range of -40 to 85°C, and data rate of 3 Mbps. It is a surface mount device suitable for industrial applications requiring a nominal voltage of 3.3V.
ST7580TR
ST7580TR by STMicroelectronics is a telecom IC with 48 terminals, operating at 13V. It features CMOS technology, -40 to 85°C temp range, and nickel palladium gold finish. Ideal for telecom circuits, this chip carrier package has a square shape and measures 7x7mm in size.
XB3-24Z8UT
The Digi International XB3-24Z8UT is an industrial-grade telecom circuit with 20 terminals in a through-hole package. It operates b/w -40°C to 85°C, making it suitable for various telecom interface applications. This MICROELECTRONIC ASSEMBLY offers reliable performance in harsh environments.
MRF24J40MDT-I/RM
Microchip Technology's MRF24J40MDT-I/RM is a telecom IC with 12 terminals, operating at -40 to 85°C. It has a supply voltage of 3.3V and terminal pitch of 2.54mm. Ideal for industrial applications requiring reliable wireless communication in compact spaces.
CC1190RGVR
The Texas Instruments CC1190RGVR is a telecom IC with 16 terminals in a square chip carrier package. It operates at temperatures from -40 to 85°C and has a supply voltage of 3V. With surface mount capability, it is ideal for industrial telecom applications requiring a compact design and high reliability.
EFR32BG13P732F512GM48-B
RS9116W-DB00-CC0-B24
CC2564BRVMT
Texas Instruments CC2564BRVMT is a 76-terminal telecom IC with a 3.6V supply voltage, operating b/w -40 to 85°C. It features matte tin finish, quad terminal position, and chip carrier package style for industrial applications requiring thin profile and surface mount compatibility.
BLUENRG-M2SA
BLUENRG-M2SA by STMicroelectronics is a telecom IC with 23 terminals, operating b/w -40 to 85°C. It has a supply voltage of 3.3V and peak reflow temperature of 240°C. This surface-mount device in rectangular package is ideal for industrial telecom applications.
ODIN-W260-05B
U-blox Ag
ODIN-W260-05B by U-blox Ag is a surface mount telecom IC with 52 terminals, operating at -40 to 85°C. With a compact size of 14.8mm x 22.3mm and terminal pitch of 1.2mm, it's ideal for industrial applications requiring a nominal voltage of 3.3V.
LBWA1UZ1GC-958
Murata Manufacturing
Murata Manufacturing's LBWA1UZ1GC-958 is a telecom IC with 3.3V supply voltage, operating from -30°C to 85°C. It features a plastic/epoxy package in grid array style for surface mount applications. Ideal for telecom circuits, this IC has bottom terminals and square shape.
NINA-B306-00B-00
TELECOM CIRCUIT; Moisture Sensitivity Level (MSL): 4;
TDA7116FHTMA1
TDA7116FHTMA1 by Infineon is a telecom IC with 10 terminals, operating from -40 to 85°C. It has a small outline package style, matte tin finish, and dual terminal position. This IC is suitable for telecom circuits requiring a nominal voltage of 3V in industrial temperature environments.
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MFRC53101T/0FE,112
NXP Semiconductors
The NXP Semiconductors MFRC53101T/0FE,112 is a telecom interface IC with 32 terminals in a small outline package. It operates b/w -25°C to 85°C, with a nominal voltage of 3.3V. Ideal for telecom circuits, it has a peak reflow temperature of 250°C and terminal pitch of 1.27mm.
MFRC52302HN1,151
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;
MFRC63003HNE
TELECOM CIRCUIT; JESD-609 Code: e4; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 2; Terminal Finish: NICKEL PALLADIUM GOLD SILVER;
MFRC63002HN,151
NXP Semiconductors' MFRC63002HN,151 is a telecom IC with 32 terminals in a square chip carrier package. Operating b/w -25 to 85°C, it has a nominal voltage of 5V and terminal pitch of 0.5mm. Ideal for telecom circuits, this IC is surface mountable and features a max seated height of 1mm.
MFRC63102HN,151
TELECOM CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES;
MFRC63002HN,118
The NXP Semiconductors MFRC63002HN,118 is a telecom interface IC with 32 terminals in a square chip carrier package. Operating temperature range from -25 to 85°C, with peak reflow temp of 260°C. Ideal for telecom circuits requiring nominal voltage of 5V and terminal pitch of 0.5mm.
MFRC63002HN
The NXP Semiconductors MFRC63002HN is a telecom interface IC with 1 function. It has a square package and a terminal position of quad. With a max operating temperature of 85°C and min operating temperature of -25°C, it is suitable for various telecom circuit applications.
MFRC63002HN,157
MFRC53101T/0FE
NXP Semiconductors' MFRC53101T/0FE is a telecom IC with 32 terminals, operating b/w -25°C to 85°C. Its small outline package measures 7.5mm in width and 20.5mm in length, suitable for surface mount applications. With a nominal voltage of 5V, it's ideal for various telecom circuit functions.
MFRC63003HNY
TELECOM CIRCUIT; Peak Reflow Temperature (C): 260; Terminal Finish: NICKEL PALLADIUM GOLD SILVER; JESD-609 Code: e4; Moisture Sensitivity Level (MSL): 2; Maximum Time At Peak Reflow Temperature (s): 30;
MFRC63002HN/T/R
MFRC531
TELECOM CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: SOP; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE;
MFRC63002HN/TRAYBM
MFRC63002HN/TRAYB
MFRC52302HN1,157
TELECOM CIRCUIT; Peak Reflow Temperature (C): 260; JESD-609 Code: e4; Terminal Finish: NICKEL PALLADIUM GOLD; Moisture Sensitivity Level (MSL): 1; Maximum Time At Peak Reflow Temperature (s): 30;
MFRC52301HN1/TRAYBM
MFRC52302HN1/TRAYB
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: VQCCN; Package Shape: SQUARE;
MFRC52301HN1/TRAYB
MFRC52302HN1/TRAYBM
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