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XCC3235MODSF12MOBR

Texas Instruments

XCC3235MODSF12MOBR by Texas Instruments

XCC3235MODSF12MOBR by Texas Instruments is a telecom IC with 63 terminals, operating at -40 to 85°C. It has a supply voltage of 3.3V and comes in a rectangular chip carrier package. Ideal for industrial applications requiring telecom circuit interfaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,450 parts In-Stock

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Digiode

USA . 4,430 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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50

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AZTECH Wire

Italy . 435 parts In-Stock

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$7.297

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435

$7.297

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Corohmni

South Africa . 696 parts In-Stock

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$10.066

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696

$10.066

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Parana Technologies

USA . 305 parts In-Stock

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$14.568

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$15.006

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305

$14.568

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$15.006

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DigiPath Technology Company

USA . 1,332 parts In-Stock

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$16.041

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$14.757

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$16.041

$14.757

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ChromeModa Solutions

Germany . 6,061 parts In-Stock

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$16.368

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$13.422

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$16.368

$13.422

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IDEA Electronic Components Group

UK . 600 parts In-Stock

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$16.368

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$15.550

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$14.731

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600

$16.368

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$14.731

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One Stop Electronics

USA . 229 parts In-Stock

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$51.000

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Ampacity Inc.

Singapore . 577 parts In-Stock

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$331.000

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Semicontronic

India . 293 parts In-Stock

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$878.000

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$856.050

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$851.660

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Corphita

USA . 4,540 parts In-Stock

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Argo Parts USA

USA . 3,798 parts In-Stock

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Continental Prestige Electronics

USA . 1,959 parts In-Stock

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Advanced Electronics

New Zealand . 550 parts In-Stock

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550

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Bastille Electronics

Australia . 450 parts In-Stock

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450

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Overview

Elevate your projects to the next level with the XCC3235MODSF12MOBR by Texas Instruments. Known for their top-quality products, Texas Instruments has crafted this telecom interface IC to exceed expectations in various applications. Whether you're looking to enhance communication systems or streamline data transfer, this chip carrier package offers unmatched value and performance. With a wide temperature range and industrial-grade design, this product ensures reliability in any environment. Trust Texas Instruments to deliver cutting-edge solutions that elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy in the package body ensures durability and reliability, making it a suitable choice for telecom applications.

Surface Mount: YES

Being surface mountable allows for easy installation and space-saving on PCBs, making this product efficient for compact designs.

Package Shape: RECTANGULAR

The rectangular package shape offers a practical and space-efficient design for integration into various telecom devices.

No. of Terminals: 63

With a high number of terminals, this IC provides ample connectivity options, making it versatile for different telecom interfaces.

Package Style (Meter): CHIP CARRIER

The chip carrier package style provides protection for the IC while offering a compact form factor, ideal for telecom devices with limited space.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC can withstand elevated temperatures in telecom environments, ensuring reliable performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for operation in various climates, making this IC suitable for telecom applications in diverse settings.

Terminal Position: QUAD

The quad terminal position facilitates easy connections and secure mounting on PCBs, enhancing the reliability of the telecom interface.

Maximum Seated Height: 2.45 mm

The slim maximum seated height enables a low-profile design, ideal for space-constrained telecom equipment.

Width: 17.5 mm

The moderate width of the IC allows for efficient placement on PCBs, optimizing space utilization in telecom devices.

Length: 20.5 mm

The compact length of the IC contributes to a space-saving design, making it a practical choice for telecom applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh environmental conditions, making this IC suitable for telecom deployments in demanding settings.

Terminal Form: NO LEAD

The no-lead terminal form simplifies the assembly process and enhances the reliability of the connections, making this IC a convenient option for telecom applications.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom circuits, this IC offers optimized performance and functionality for telecommunications systems.

Nominal Supply Voltage: 3.3 V

With a standard nominal supply voltage of 3.3V, this IC is compatible with common power sources in telecom applications, ensuring reliable operation.

Terminal Pitch: 1.27 mm

The fine terminal pitch allows for precision connections on PCBs, ensuring secure and stable interfacing for the telecom IC.

Technical Specifications

Other Function Telecom Interface ICs XCC3235MODSF12MOBR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PQCC-N63

Length:

20.5 mm

No. of Functions:

1

No. of Terminals:

63

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Maximum Seated Height:

2.45 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

17.5 mm

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

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