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XCC3300ENJARSBR

Texas Instruments

XCC3300ENJARSBR by Texas Instruments

XCC3300ENJARSBR by Texas Instruments is a 40-terminal telecom IC with data rate of 50 Mbps. It operates b/w -40 to 105 °C, in a square chip carrier package style. Ideal for telecom circuit applications due to its small size and surface mount capability.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,891 parts In-Stock

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6,891

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Digiode

USA . 656 parts In-Stock

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656

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 587 parts In-Stock

1+ parts

$5.806

100+ parts

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587

$5.806

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Ampacity Inc.

Singapore . 457 parts In-Stock

1+ parts

$69.000

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457

$69.000

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Semicontronic

India . 137 parts In-Stock

1+ parts

$166.000

100+ parts

$161.850

1k+ parts

$161.020

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137

$166.000

$161.850

$161.020

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One Stop Electronics

USA . 1,052 parts In-Stock

1+ parts

$751.000

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1,052

$751.000

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Corphita

USA . 804 parts In-Stock

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804

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Corohmni

South Africa . 495 parts In-Stock

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495

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Overview

Discover the cutting-edge XCC3300ENJARSBR by Texas Instruments, a high-quality telecom interface IC that offers unparalleled performance and reliability. Designed with precision and expertise, this product is perfect for a wide range of applications in the telecom industry. With advanced features and innovative technology, customers can expect seamless connectivity, fast data rates, and efficient operation. Experience the value and benefits of this exceptional product, trusted by professionals worldwide for its superior quality and unmatched performance. Elevate your projects with the XCC3300ENJARSBR and stay ahead of the competition.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a durable and lightweight housing for the IC, enhancing its portability and longevity.

Surface Mount: YES

Facilitates easy and efficient installation on circuit boards, saving time and effort during assembly.

Package Shape: SQUARE

Square shape allows for efficient use of space on the circuit board, optimizing the layout and design of the overall system.

No. of Terminals: 40

Having 40 terminals allows for a greater number of connections and functionalities, increasing the versatility of the product.

Maximum Operating Temperature: 105°C

Ability to operate at high temperatures ensures reliability and performance in various environmental conditions.

Minimum Operating Temperature: -40°C

Ability to operate at low temperatures ensures reliability and performance in harsh environmental conditions.

Width: 5 mm

Compact width allows for easy integration into tight spaces, making it suitable for applications with limited space constraints.

Terminal Pitch: 0.4 mm

Narrow terminal pitch enables high-density mounting, conserving space on the circuit board and supporting miniaturization efforts.

Data Rate: 50 Mbps

High data rate capability enables fast and efficient data transmission, meeting the demands of modern communication systems.

Technical Specifications

Other Function Telecom Interface ICs XCC3300ENJARSBR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

Data Rate:

50 Mbps

JESD-30 Code:

S-PQCC-N40

Length:

5 mm

No. of Functions:

1

No. of Terminals:

40

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC40,.2SQ,16

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

.8 mm

Surface Mount:

YES

Telecom IC Type:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

5 mm

Trade Compliance

XCC3300ENJARSBR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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