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SA639DH/01,118

NXP Semiconductors

SA639DH/01,118 by NXP Semiconductors

SA639DH/01,118 by NXP Semiconductors is a telecom interface IC with 24 terminals in a small outline package. Operating b/w -40 to 85 °C, it has a nominal voltage of 3V and terminal pitch of 0.65mm. Ideal for industrial applications requiring telecom circuit functionality.

Median Price

$6.949

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,343 parts In-Stock

1+ parts

$6.868

100+ parts

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4,343

$6.868

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Nova Conductors

Japan . 750 parts In-Stock

1+ parts

$7.029

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750

$7.029

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Flip Electronics

USA . 2,492 parts In-Stock

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2,492

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Vyrian

USA . 1,616 parts In-Stock

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1,616

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Anansix

USA . 543 parts In-Stock

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543

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,881 parts In-Stock

1+ parts

$6.150

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1,881

$6.150

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Semicontronic

India . 1,750 parts In-Stock

1+ parts

$6.150

100+ parts

$5.996

1k+ parts

$5.966

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1,750

$6.150

$5.996

$5.966

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Corphita

USA . 4,943 parts In-Stock

1+ parts

$6.507

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4,943

$6.507

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Continental Prestige Electronics

USA . 4,760 parts In-Stock

1+ parts

$7.029

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10k+ parts

$6.888

4,760

$7.029

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$6.888

Corohmni

South Africa . 425 parts In-Stock

1+ parts

$7.296

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425

$7.296

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Advanced Electronics

New Zealand . 100 parts In-Stock

1+ parts

$9.193

100+ parts

$8.366

1k+ parts

$7.538

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100

$9.193

$8.366

$7.538

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Aztec Data Supply Inc.

USA . 4,124 parts In-Stock

1+ parts

$15.980

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4,124

$15.980

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UNI Independent Distributors

Spain . 2,764 parts In-Stock

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2,764

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Argo Parts USA

USA . 2,580 parts In-Stock

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2,580

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Perfect Parts

USA . 71 parts In-Stock

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71

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Overview

Discover the cutting-edge SA639DH/01,118 by NXP Semiconductors, a leading provider in innovative semiconductor solutions. This telecom interface IC boasts unparalleled quality and reliability, making it ideal for a wide range of applications. With a compact design and advanced features, this product offers exceptional value and performance to customers looking for top-notch telecom circuit solutions. Trust NXP Semiconductors to deliver excellence in every aspect of your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the IC, making it suitable for various operating conditions.

Surface Mount: YES

Being surface mountable allows for easy and efficient integration onto circuit boards, saving space and simplifying assembly processes.

Package Shape: RECTANGULAR

The rectangular shape helps in setting up the IC within a system in a more organized and space-efficient manner.

No. of Terminals: 24

Having a sufficient number of terminals allows for versatile connectivity options and compatibility with different systems.

Package Style: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This design feature enables the IC to be compact, lightweight, and suitable for applications where space is limited.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC can function reliably even in demanding environmental conditions.

Minimum Operating Temperature: -40 °C

The ability to operate at low temperatures ensures the IC's performance in a wide range of settings, including industrial environments.

Terminal Finish: NICKEL PALLADIUM GOLD

This finish offers enhanced conductivity, corrosion resistance, and longevity to the terminals, ensuring reliable connections.

Terminal Position: DUAL

Dual terminal position provides flexibility in circuit design and facilitates efficient routing of connections for optimal performance.

Maximum Seated Height: 1.1 mm

The low seated height makes the IC suitable for compact designs and helps in maintaining a sleek profile within electronic devices.

Width: 4.4 mm

The narrow width of the IC contributes to space-saving benefits and allows for dense packaging of components on a circuit board.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature, this IC can withstand the soldering process during assembly without compromising its functionality.

Length: 7.8 mm

The moderate length of the IC enables it to be conveniently accommodated within different electronic systems without occupying excess space.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this IC meets the rigorous temperature and performance requirements of industrial settings.

Terminal Form: GULL WING

The gull-wing terminal form facilitates easy soldering and inspection processes, ensuring reliable connections for optimal signal transmission.

Telecom IC Type: TELECOM CIRCUIT

Being specifically designed for telecom applications, this IC offers features and performance capabilities tailored to meet the requirements of telecom systems.

Nominal Supply Voltage: 3 V

With a 3V nominal supply voltage, this IC is compatible with standard power sources and ensures efficient power consumption in telecom applications.

Terminal Pitch: 0.65 mm

The small terminal pitch allows for high-density mounting and precise connections, making it ideal for modern telecom interface designs.

Technical Specifications

Other Function Telecom Interface ICs SA639DH/01,118 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

7.8 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

SA639DH/01,118 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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