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SA639DH

NXP Semiconductors

SA639DH by NXP Semiconductors

SA639DH by NXP Semiconductors is a telecom interface IC with 24 terminals, operating at temperatures from -40 to 85°C. It has a supply voltage of 3V and consumes only 0.01mA. The IC is designed for industrial applications requiring a compact package style and thin profile.

Median Price

$2.974

Lifecycle Status

Suppliers In-Stock

18

In-Stock Inventory

1k+

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Freelance Electronics

USA . 20 parts In-Stock

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$2.974

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$3.123

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$2.945

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PC Components Company LLC

USA . 6,151 parts In-Stock

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Anansix

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Digiode

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Vyrian

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Bristol Electronics

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Extreme Components

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Nova Conductors

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Semi Source

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Connector Distribution Corp

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Right Parts Inc.

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Prism Electronics

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ComSIT Distribution GmbH

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R&J Components

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J2 Sourcing AB

Sweden . 26 parts In-Stock

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Cogito LLC

Ukraine . 3 parts In-Stock

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Classic Components Corporation

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Distributors (Availability)

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AZTECH Wire

Italy . 581 parts In-Stock

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$9.893

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One Stop Electronics

USA . 1,211 parts In-Stock

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Ampacity Inc.

Singapore . 734 parts In-Stock

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Corphita

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UNI Independent Distributors

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Bastille Electronics

Australia . 2,043 parts In-Stock

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Epart123

USA . 1,665 parts In-Stock

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Perfect Parts

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Kepictronics

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Cyclops Electronics Ltd (Excess)

UK . 53 parts In-Stock

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Assy Fe

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Overview

Elevate your telecom interface experience with the SA639DH by NXP Semiconductors. This top-of-the-line product combines quality manufacturing with cutting-edge technology to deliver seamless connectivity for a variety of applications. With its small outline package and industrial-grade temperature range, this telecom circuit IC offers unbeatable performance and reliability. Say goodbye to connectivity issues and hello to a smoother, more efficient operation with the SA639DH. Upgrade your telecom interface today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable and long-lasting applications.

Surface Mount: YES

The surface mount capability allows for easy and efficient assembly onto circuit boards, saving time and space.

Power Supplies (V): 3/5

The dual power supply options of 3V and 5V provide flexibility in different system requirements and voltage levels.

No. of Terminals: 24

With 24 terminals, this product offers ample connection points for various functions and interfaces.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable performance even in demanding industrial environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows for operation in a wide range of temperature conditions.

Maximum Seated Height: 1.1 mm

The low maximum seated height of 1.1mm enables a compact and space-saving design for the product.

Terminal Position: DUAL

The dual terminal position offers flexibility in circuit board layout and integration.

Technology: BIPOLAR

The use of bipolar technology ensures high performance and reliability in telecom interface applications.

Technical Specifications

Other Function Telecom Interface ICs SA639DH attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G24

Length:

7.8 mm

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.01 mA

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

BIPOLAR

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

4.4 mm

Trade Compliance

SA639DH Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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