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ISP1507-AC-ST

Insight Sip

ISP1507-AC-ST by Insight Sip

ISP1507-AC-ST by Insight Sip is a telecom IC with 3V supply voltage, 2 Mbps data rate, and -40 to 85°C operating temperature range. Ideal for industrial applications requiring high-speed communication in compact form factor MICROELECTRONIC ASSEMBLY package.

Median Price

$5.730

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 38 parts In-Stock

1+ parts

$5.730

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38

$5.730

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Vyrian

USA . 703 parts In-Stock

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703

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 6,283 parts In-Stock

1+ parts

$5.660

100+ parts

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10k+ parts

$5.547

6,283

$5.660

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$5.547

Netroflash

USA . 100 parts In-Stock

1+ parts

$5.730

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100

$5.730

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Advanced Electronics

New Zealand . 100 parts In-Stock

1+ parts

$11.120

100+ parts

$10.564

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$10.564

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100

$11.120

$10.564

$10.564

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Aztec Data Supply Inc.

USA . 4,225 parts In-Stock

1+ parts

$12.380

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4,225

$12.380

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AZTECH Wire

Italy . 703 parts In-Stock

1+ parts

$14.155

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703

$14.155

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Argo Parts USA

USA . 4,403 parts In-Stock

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4,403

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Robosynatics

Brazil . 300 parts In-Stock

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300

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Lucentia Tech

USA . 300 parts In-Stock

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300

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Authorized Procurement Solutions

USA . 58 parts In-Stock

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Overview

Unlock the power of seamless connectivity with the ISP1507-AC-ST by Insight Sip. With a commitment to quality and innovation, Insight Sip delivers cutting-edge telecom interface ICs that set industry standards. This versatile product is perfect for a wide range of applications, offering customers unrivaled value and reliability. Experience the benefits of superior performance and efficiency with Insight Sip's ISP1507-AC-ST.

Feature Benefit Bullets

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and costs.

Package Shape: SQUARE

The square shape of the package provides a compact footprint, ideal for space-constrained applications.

No. of Terminals: 62

With a high number of terminals, this product offers a wide range of connectivity options for telecom interfaces.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for operation in a wide range of temperature environments.

Width: 8 mm

The compact width of the package enables easy integration into various electronic devices.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature, this product can withstand the reflow soldering process without any issues.

Nominal Supply Voltage: 3 V

The low nominal supply voltage makes this product energy-efficient and suitable for battery-powered applications.

Data Rate: 2 Mbps

The high data rate of 2 Mbps ensures fast and efficient data transmission for telecom applications.

Technical Specifications

Other Function Telecom Interface ICs ISP1507-AC-ST attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Insight Sip

Specs

Data Rate:

2 Mbps

JESD-30 Code:

R-XXMA-N62

Length:

8 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

62

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

XMA

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Peak Reflow Temperature (C):

260

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Position:

UNSPECIFIED

Maximum Time At Peak Reflow Temperature (s):

30

Width:

8 mm

Trade Compliance

ISP1507-AC-ST Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Insight Sip

The increased demand for wireless connectivity in portable electronic devices has driven manufacturers to deliver ever-smaller, more cost effective solutions. This makes the integration of RF into a single product more and more complex and increases technical risk while in the mean time the product development cycle has to be reduced. At Insight-SiP we rapidly solve these challenges. Based on a system-in-package approach we make complex RF systems easy to integrate in any existing or future portable application. We contribute to reduce our customer’s product development cycle and accelerate their product’s release-to-market. It’s all in the package! In less time!

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