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CC430F5137IRGZ

Texas Instruments

CC430F5137IRGZ by Texas Instruments

CC430F5137IRGZ by Texas Instruments is a telecom IC with a data rate of 0.5 Mbps and operates at a nominal voltage of 2.2V. This industrial-grade chip carrier has 48 terminals, is surface mountable, and suitable for telecom circuit applications. With a temperature range from -40 to 85°C, it features nickel palladium gold terminal finish and very thin profile package style.

Median Price

$9.348

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 844 parts In-Stock

1+ parts

$6.926

100+ parts

$5.646

1k+ parts

$3.764

10k+ parts

-

844

$6.926

$5.646

$3.764

-

Mouser Electronics

USA . 1,158 parts In-Stock

1+ parts

$11.770

100+ parts

$7.930

1k+ parts

$7.150

10k+ parts

$6.900

1,158

$11.770

$7.930

$7.150

$6.900

DigiKey

USA . 758 parts In-Stock

1+ parts

$11.770

100+ parts

$9.291

1k+ parts

$8.185

10k+ parts

$7.894

758

$11.770

$9.291

$8.185

$7.894

Chip1Stop

Japan . 208 parts In-Stock

1+ parts

-

100+ parts

$6.550

1k+ parts

$6.148

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208

-

$6.550

$6.148

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 43 parts In-Stock

1+ parts

$5.646

100+ parts

-

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-

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43

$5.646

-

-

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Digiode

USA . 1,078 parts In-Stock

1+ parts

$6.580

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-

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1,078

$6.580

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Chip Stock

USA . 23,500 parts In-Stock

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23,500

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Bristol Electronics

USA . 1,600 parts In-Stock

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-

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1,600

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Vyrian

USA . 926 parts In-Stock

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926

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aranea Global

USA . 500 parts In-Stock

1+ parts

$5.533

100+ parts

-

1k+ parts

$5.312

10k+ parts

-

500

$5.533

-

$5.312

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Semicontronic

India . 1,051 parts In-Stock

1+ parts

$5.570

100+ parts

$5.431

1k+ parts

$5.403

10k+ parts

-

1,051

$5.570

$5.431

$5.403

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Ampacity Inc.

Singapore . 795 parts In-Stock

1+ parts

$5.570

100+ parts

-

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-

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795

$5.570

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-

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Continental Prestige Electronics

USA . 5,444 parts In-Stock

1+ parts

$5.646

100+ parts

-

1k+ parts

-

10k+ parts

$5.533

5,444

$5.646

-

-

$5.533

Corphita

USA . 3,904 parts In-Stock

1+ parts

$6.233

100+ parts

-

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3,904

$6.233

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Modulus Dynamics

Lithuania . 67 parts In-Stock

1+ parts

$6.267

100+ parts

$6.204

1k+ parts

$6.016

10k+ parts

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67

$6.267

$6.204

$6.016

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Corohmni

South Africa . 353 parts In-Stock

1+ parts

$7.334

100+ parts

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353

$7.334

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$11.217

100+ parts

$10.207

1k+ parts

$9.198

10k+ parts

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1,000

$11.217

$10.207

$9.198

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Parana Technologies

USA . 1,573 parts In-Stock

1+ parts

$15.889

100+ parts

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$16.243

10k+ parts

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1,573

$15.889

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$16.243

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DigiPath Technology Company

USA . 915 parts In-Stock

1+ parts

$17.496

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915

$17.496

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ChromeModa Solutions

Germany . 3,137 parts In-Stock

1+ parts

$17.853

100+ parts

$14.639

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3,137

$17.853

$14.639

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IDEA Electronic Components Group

UK . 1,622 parts In-Stock

1+ parts

$17.853

100+ parts

$16.960

1k+ parts

$16.068

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1,622

$17.853

$16.960

$16.068

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Perfect Parts

USA . 23,171 parts In-Stock

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Lixinc

USA . 12,196 parts In-Stock

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Argo Parts USA

USA . 3,345 parts In-Stock

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Robosynatics

Brazil . 200 parts In-Stock

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Lucentia Tech

USA . 200 parts In-Stock

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$21.091

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$21.091

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$21.091

200

-

$21.091

$21.091

$21.091

Kepictronics

USA . 52 parts In-Stock

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52

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Overview

Unleash the power of cutting-edge technology with the CC430F5137IRGZ by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality products that redefine excellence. This telecom interface IC boasts a range of applications, offering customers unmatched value and benefits. From its reliable performance to its innovative design, the CC430F5137IRGZ is the ultimate solution for all your telecommunications needs. Experience the difference with Texas Instruments and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package material provides durability and protection for the IC, making it suitable for various telecom applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and cost in production.

Package Shape: SQUARE

The square package shape helps in efficient use of space on the PCB, making it ideal for compact designs.

No. of Terminals: 48

Having 48 terminals allows for versatile connectivity options, enabling the IC to interface with multiple components.

Package Style: CHIP CARRIER, VERY THIN PROFILE

The chip carrier style with a very thin profile enhances thermal performance and minimizes signal interference, promoting reliable operation.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this IC can withstand challenging environmental conditions without compromising performance.

Nominal Supply Voltage: 2.2 V

The nominal supply voltage of 2.2V ensures efficient power consumption, making the IC energy-efficient for telecom applications.

Data Rate: 0.5 Mbps

The data rate of 0.5 Mbps allows for fast and reliable data transmission, making it suitable for telecom interfaces requiring high-speed communication.

Technical Specifications

Other Function Telecom Interface ICs CC430F5137IRGZ attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

Data Rate:

.5 Mbps

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

2.2 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

CC430F5137IRGZ Telecommunications trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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