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CC430F6135IRGCR

Texas Instruments

CC430F6135IRGCR by Texas Instruments

CC430F6135IRGCR by Texas Instruments is a telecom IC with 64 terminals in a square chip carrier package. It operates at temperatures ranging from -40 to 85°C, with a supply voltage of 2.2V and data rate of 0.25 Mbps. Ideal for industrial applications requiring low-profile surface mount components.

Median Price

$2.618

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 42,260 parts In-Stock

1+ parts

$3.165

100+ parts

$2.580

1k+ parts

$1.720

10k+ parts

-

42,260

$3.165

$2.580

$1.720

-

Chip1Stop

Japan . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$2.070

6,000

-

-

-

$2.070

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$1.720

100+ parts

-

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-

10k+ parts

-

50

$1.720

-

-

-

Digiode

USA . 4,734 parts In-Stock

1+ parts

$3.007

100+ parts

-

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4,734

$3.007

-

-

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Vyrian

USA . 7,355 parts In-Stock

1+ parts

-

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7,355

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LittleDiode

UK . 2 parts In-Stock

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-

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2

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-

Distributors (Availability)

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Argo Parts USA

USA . 4,159 parts In-Stock

1+ parts

$1.720

100+ parts

-

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-

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-

4,159

$1.720

-

-

-

Continental Prestige Electronics

USA . 2,942 parts In-Stock

1+ parts

$1.720

100+ parts

-

1k+ parts

-

10k+ parts

$1.686

2,942

$1.720

-

-

$1.686

Netroflash

USA . 50 parts In-Stock

1+ parts

$1.720

100+ parts

-

1k+ parts

-

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50

$1.720

-

-

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Ampacity Inc.

Singapore . 23,866 parts In-Stock

1+ parts

$1.760

100+ parts

-

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23,866

$1.760

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Corphita

USA . 1,544 parts In-Stock

1+ parts

$2.848

100+ parts

-

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1,544

$2.848

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Parana Technologies

USA . 2,314 parts In-Stock

1+ parts

$6.152

100+ parts

-

1k+ parts

$6.921

10k+ parts

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2,314

$6.152

-

$6.921

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DigiPath Technology Company

USA . 2,199 parts In-Stock

1+ parts

$6.774

100+ parts

$6.232

1k+ parts

-

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2,199

$6.774

$6.232

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ChromeModa Solutions

Germany . 5,968 parts In-Stock

1+ parts

$6.912

100+ parts

$5.668

1k+ parts

-

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5,968

$6.912

$5.668

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IDEA Electronic Components Group

UK . 644 parts In-Stock

1+ parts

$6.912

100+ parts

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$6.221

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644

$6.912

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$6.221

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Corohmni

South Africa . 164 parts In-Stock

1+ parts

$14.498

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164

$14.498

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AZTECH Wire

Italy . 275 parts In-Stock

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$19.290

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275

$19.290

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Lixinc

USA . 10,892 parts In-Stock

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10,892

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A-Z Elektronik GmbH

Germany . 5,226 parts In-Stock

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5,226

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Authorized Procurement Solutions

USA . 4,500 parts In-Stock

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4,500

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Alle Elektronik GmbH

Germany . 3,484 parts In-Stock

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3,484

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Kepictronics

USA . 922 parts In-Stock

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922

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Overview

Unlock the power of seamless communication with the Texas Instruments CC430F6135IRGCR. Crafted with precision and expertise, this telecom interface IC offers unparalleled quality and reliability. Ideal for a range of applications, this product provides unmatched value and benefits to customers looking for efficient and high-performance solutions. Experience the advantages of Texas Instruments technology and elevate your projects to new heights with the CC430F6135IRGCR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material offers good durability and protection for the IC, making it suitable for a variety of applications.

Surface Mount: YES

Surface mount capability allows for easy installation and integration into PCBs, saving space and improving efficiency.

No. of Terminals: 64

Having a high number of terminals allows for more connectivity options and functionality in the circuit design.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC can withstand demanding environmental conditions and ensures reliable performance.

Nominal Supply Voltage: 2.2 V

The low nominal supply voltage of 2.2V helps in reducing power consumption and heat generation in the system.

Data Rate: 0.25 Mbps

The data rate of 0.25 Mbps is suitable for telecom applications, providing efficient data transmission capabilities.

Moisture Sensitivity Level (MSL): 3

With a MSL of 3, this IC can withstand moderate moisture exposure during handling and assembly processes.

Technical Specifications

Other Function Telecom Interface ICs CC430F6135IRGCR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

Data Rate:

.25 Mbps

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

2.2 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Trade Compliance

CC430F6135IRGCR Telecommunications trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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