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CC430F5137IRGZT

Texas Instruments

CC430F5137IRGZT by Texas Instruments

CC430F5137IRGZT by Texas Instruments is a telecom IC with 48 terminals in a square chip carrier package. It operates b/w -40 to 85°C, with a supply voltage of 2.2V and data rate of 0.5 Mbps. Ideal for industrial applications requiring low power consumption and reliable communication.

Median Price

$11.770

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,240 parts In-Stock

1+ parts

$6.926

100+ parts

$5.646

1k+ parts

$3.764

10k+ parts

-

2,240

$6.926

$5.646

$3.764

-

DigiKey

USA . 2,043 parts In-Stock

1+ parts

$11.770

100+ parts

$8.954

1k+ parts

-

10k+ parts

-

2,043

$11.770

$8.954

-

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Mouser Electronics

USA . 1,448 parts In-Stock

1+ parts

$11.770

100+ parts

$8.000

1k+ parts

$7.280

10k+ parts

-

1,448

$11.770

$8.000

$7.280

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 53 parts In-Stock

1+ parts

$5.646

100+ parts

-

1k+ parts

-

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53

$5.646

-

-

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Digiode

USA . 1,979 parts In-Stock

1+ parts

$6.580

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-

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1,979

$6.580

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Chip Stock

USA . 23,506 parts In-Stock

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23,506

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Vyrian

USA . 1,911 parts In-Stock

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1,911

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LIBRA Elektronik GmbH

Germany . 95 parts In-Stock

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95

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,771 parts In-Stock

1+ parts

$5.370

100+ parts

-

1k+ parts

$6.046

10k+ parts

-

1,771

$5.370

-

$6.046

-

Continental Prestige Electronics

USA . 1,114 parts In-Stock

1+ parts

$5.646

100+ parts

-

1k+ parts

-

10k+ parts

$5.533

1,114

$5.646

-

-

$5.533

Netroflash

USA . 100 parts In-Stock

1+ parts

$5.646

100+ parts

$5.533

1k+ parts

-

10k+ parts

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100

$5.646

$5.533

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-

Semicontronic

India . 1,728 parts In-Stock

1+ parts

$5.890

100+ parts

$5.743

1k+ parts

$5.713

10k+ parts

-

1,728

$5.890

$5.743

$5.713

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Ampacity Inc.

Singapore . 1,442 parts In-Stock

1+ parts

$5.890

100+ parts

-

1k+ parts

-

10k+ parts

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1,442

$5.890

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DigiPath Technology Company

USA . 2,376 parts In-Stock

1+ parts

$5.913

100+ parts

$5.440

1k+ parts

-

10k+ parts

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2,376

$5.913

$5.440

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ChromeModa Solutions

Germany . 6,838 parts In-Stock

1+ parts

$6.034

100+ parts

$4.948

1k+ parts

-

10k+ parts

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6,838

$6.034

$4.948

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IDEA Electronic Components Group

UK . 1,570 parts In-Stock

1+ parts

$6.034

100+ parts

-

1k+ parts

$5.431

10k+ parts

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1,570

$6.034

-

$5.431

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Corphita

USA . 978 parts In-Stock

1+ parts

$6.233

100+ parts

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978

$6.233

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Modulus Dynamics

Lithuania . 1,000 parts In-Stock

1+ parts

$6.267

100+ parts

$6.204

1k+ parts

$6.016

10k+ parts

-

1,000

$6.267

$6.204

$6.016

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Advanced Electronics

New Zealand . 200 parts In-Stock

1+ parts

$9.363

100+ parts

$8.520

1k+ parts

$7.678

10k+ parts

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200

$9.363

$8.520

$7.678

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Corohmni

South Africa . 606 parts In-Stock

1+ parts

$16.771

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606

$16.771

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Argo Parts USA

USA . 1,458 parts In-Stock

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1,458

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Perfect Parts

USA . 935 parts In-Stock

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935

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Robosynatics

Brazil . 450 parts In-Stock

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450

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Lucentia Tech

USA . 450 parts In-Stock

1+ parts

-

100+ parts

$0.112

1k+ parts

$0.112

10k+ parts

$0.112

450

-

$0.112

$0.112

$0.112

S.R.D Solutions

India . 110 parts In-Stock

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110

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Overview

Unlock the potential of your telecom applications with the CC430F5137IRGZT by Texas Instruments. This high-quality IC offers unmatched reliability and versatility, making it the go-to choice for a wide range of telecom interfaces. With Texas Instruments' reputation for excellence in manufacturing, you can trust that this product will deliver top-notch performance. From seamless communication to enhanced connectivity, the CC430F5137IRGZT provides unparalleled value and benefits to customers looking to elevate their telecom systems. Experience the difference with Texas Instruments today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body provides good durability and protection for the internal components of the IC.

Surface Mount: YES

Being surface mountable makes it easier to integrate this IC onto circuit boards, saving space and enabling compact designs.

Package Shape: SQUARE

The square package shape allows for efficient use of space on the circuit board and is easy to handle during assembly.

Nominal Supply Voltage: 2.2 V

The low nominal supply voltage of 2.2 V can help in reducing power consumption and increasing efficiency of the telecom interface IC.

Data Rate: 0.5 Mbps

With a data rate of 0.5 Mbps, this IC is suitable for applications requiring moderate speed data transmission in telecom interfaces.

Technical Specifications

Other Function Telecom Interface ICs CC430F5137IRGZT attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

Data Rate:

.5 Mbps

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

2.2 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

CC430F5137IRGZT Telecommunications trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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