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CC3235MODSM2MOBR

Texas Instruments

CC3235MODSM2MOBR by Texas Instruments

CC3235MODSM2MOBR by Texas Instruments is a telecom IC with 63 terminals, operating b/w -40 to 85°C. It has a supply voltage of 3.3V and peak reflow temperature of 260°C. This rectangular package is ideal for industrial applications requiring reliable telecom circuit interfaces.

Median Price

$20.832

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,879 parts In-Stock

1+ parts

$15.503

100+ parts

$13.542

1k+ parts

$9.339

10k+ parts

-

3,879

$15.503

$13.542

$9.339

-

Adafruit Industries

USA . 52 parts In-Stock

1+ parts

$15.925

100+ parts

$15.129

1k+ parts

$15.129

10k+ parts

-

52

$15.925

$15.129

$15.129

-

Mouser Electronics

USA . 556 parts In-Stock

1+ parts

$25.740

100+ parts

$19.800

1k+ parts

$18.690

10k+ parts

-

556

$25.740

$19.800

$18.690

-

DigiKey

USA . 721 parts In-Stock

1+ parts

$26.810

100+ parts

$20.592

1k+ parts

$19.622

10k+ parts

-

721

$26.810

$20.592

$19.622

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$12.735

100+ parts

-

1k+ parts

-

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-

100

$12.735

-

-

-

Digiode

USA . 2,167 parts In-Stock

1+ parts

$14.728

100+ parts

-

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-

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2,167

$14.728

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Vyrian

USA . 1,322 parts In-Stock

1+ parts

-

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1,322

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,658 parts In-Stock

1+ parts

$5.820

100+ parts

-

1k+ parts

$6.609

10k+ parts

-

1,658

$5.820

-

$6.609

-

DigiPath Technology Company

USA . 2,286 parts In-Stock

1+ parts

$6.408

100+ parts

-

1k+ parts

-

10k+ parts

-

2,286

$6.408

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-

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ChromeModa Solutions

Germany . 3,969 parts In-Stock

1+ parts

$6.539

100+ parts

$5.362

1k+ parts

-

10k+ parts

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3,969

$6.539

$5.362

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-

IDEA Electronic Components Group

UK . 1,234 parts In-Stock

1+ parts

$6.539

100+ parts

-

1k+ parts

$5.885

10k+ parts

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1,234

$6.539

-

$5.885

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Component Stockers USA

USA . 1,144 parts In-Stock

1+ parts

$8.640

100+ parts

$13.080

1k+ parts

-

10k+ parts

-

1,144

$8.640

$13.080

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-

Aranea Global

USA . 500 parts In-Stock

1+ parts

$12.480

100+ parts

-

1k+ parts

$11.981

10k+ parts

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500

$12.480

-

$11.981

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Continental Prestige Electronics

USA . 4,200 parts In-Stock

1+ parts

$12.735

100+ parts

-

1k+ parts

-

10k+ parts

$12.480

4,200

$12.735

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-

$12.480

Corohmni

South Africa . 57 parts In-Stock

1+ parts

$12.918

100+ parts

-

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-

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57

$12.918

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-

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Semicontronic

India . 843 parts In-Stock

1+ parts

$13.180

100+ parts

$12.850

1k+ parts

$12.785

10k+ parts

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843

$13.180

$12.850

$12.785

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Corphita

USA . 4,024 parts In-Stock

1+ parts

$13.953

100+ parts

-

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-

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4,024

$13.953

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-

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Advanced Electronics

New Zealand . 52 parts In-Stock

1+ parts

$15.925

100+ parts

$15.129

1k+ parts

$15.129

10k+ parts

-

52

$15.925

$15.129

$15.129

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Ampacity Inc.

Singapore . 1,000 parts In-Stock

1+ parts

$28.680

100+ parts

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1,000

$28.680

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Lixinc

USA . 17,845 parts In-Stock

1+ parts

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17,845

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

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3,000

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Argo Parts USA

USA . 581 parts In-Stock

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581

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Overview

Unlock endless possibilities with the Texas Instruments CC3235MODSM2MOBR, a cutting-edge telecom interface IC that delivers unparalleled quality and reliability. Designed by the industry leader in microelectronics, this product offers seamless integration, high performance, and industrial-grade durability. Perfect for a wide range of applications, this compact marvel boasts a nominal supply voltage of 3.3V, a maximum operating temperature of 85°C, and a nickel gold terminal finish for optimal connectivity. Elevate your projects to new heights with the CC3235MODSM2MOBR and experience innovation like never before.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving time and reducing production costs.

Package Shape: RECTANGULAR

Rectangular package shape allows for efficient use of space on the circuit board, maximizing component density.

No. of Terminals: 63

With a high number of terminals, this product can accommodate complex telecom interface circuits and connectivity requirements.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliability and stability in various operating conditions.

Nominal Supply Voltage: 3.3 V

The 3.3V nominal supply voltage is common in telecom applications, ensuring compatibility and ease of integration.

Technical Specifications

Other Function Telecom Interface ICs CC3235MODSM2MOBR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-XQMA-B63

JESD-609 Code:

e4

Length:

20.5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

63

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

XMA

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Peak Reflow Temperature (C):

260

Maximum Seated Height:

2.4 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

17.5 mm

Trade Compliance

CC3235MODSM2MOBR Telecommunications trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

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