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CC3235MODSF12MOBR

Texas Instruments

CC3235MODSF12MOBR by Texas Instruments

CC3235MODSF12MOBR by Texas Instruments is a telecom IC with 63 terminals, operating temperature range of -40 to 85°C, and supply voltage of 3.3V. It is designed for industrial applications requiring a compact MICROELECTRONIC ASSEMBLY package with surface mount capability.

Median Price

$22.978

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Adafruit Industries

USA . 500 parts In-Stock

1+ parts

$20.186

100+ parts

$18.369

1k+ parts

$16.553

10k+ parts

-

500

$20.186

$18.369

$16.553

-

Mouser Electronics

USA . 150 parts In-Stock

1+ parts

$25.770

100+ parts

$19.750

1k+ parts

$18.150

10k+ parts

-

150

$25.770

$19.750

$18.150

-

DigiKey

USA . 742 parts In-Stock

1+ parts

$26.080

100+ parts

$20.030

1k+ parts

$18.048

10k+ parts

-

742

$26.080

$20.030

$18.048

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Chip1Stop

Japan . 750 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$12.950

10k+ parts

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750

-

-

$12.950

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 79 parts In-Stock

1+ parts

$14.775

100+ parts

-

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-

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79

$14.775

-

-

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Digiode

USA . 1,975 parts In-Stock

1+ parts

$19.177

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-

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1,975

$19.177

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Chip Stock

USA . 3,000 parts In-Stock

1+ parts

-

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3,000

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Vyrian

USA . 456 parts In-Stock

1+ parts

-

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456

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 251 parts In-Stock

1+ parts

$10.176

100+ parts

-

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-

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251

$10.176

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-

-

Ampacity Inc.

Singapore . 702 parts In-Stock

1+ parts

$11.010

100+ parts

-

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-

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702

$11.010

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-

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Semicontronic

India . 271 parts In-Stock

1+ parts

$11.010

100+ parts

$10.735

1k+ parts

$10.680

10k+ parts

-

271

$11.010

$10.735

$10.680

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Continental Prestige Electronics

USA . 3,989 parts In-Stock

1+ parts

$14.775

100+ parts

-

1k+ parts

-

10k+ parts

$14.479

3,989

$14.775

-

-

$14.479

Netroflash

USA . 500 parts In-Stock

1+ parts

$14.775

100+ parts

$14.479

1k+ parts

-

10k+ parts

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500

$14.775

$14.479

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-

Parana Technologies

USA . 1,494 parts In-Stock

1+ parts

$15.150

100+ parts

-

1k+ parts

$15.554

10k+ parts

-

1,494

$15.150

-

$15.554

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DigiPath Technology Company

USA . 2,179 parts In-Stock

1+ parts

$16.683

100+ parts

$15.348

1k+ parts

-

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2,179

$16.683

$15.348

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IDEA Electronic Components Group

UK . 600 parts In-Stock

1+ parts

$17.023

100+ parts

$16.172

1k+ parts

$15.321

10k+ parts

-

600

$17.023

$16.172

$15.321

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ChromeModa Solutions

Germany . 397 parts In-Stock

1+ parts

$17.023

100+ parts

$13.959

1k+ parts

-

10k+ parts

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397

$17.023

$13.959

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Corphita

USA . 4,591 parts In-Stock

1+ parts

$18.167

100+ parts

-

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4,591

$18.167

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-

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Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$20.186

100+ parts

$18.369

1k+ parts

$16.553

10k+ parts

-

500

$20.186

$18.369

$16.553

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Lixinc

USA . 7,232 parts In-Stock

1+ parts

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7,232

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Microchip USA

USA . 2,009 parts In-Stock

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2,009

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Argo Parts USA

USA . 1,306 parts In-Stock

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1,306

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Overview

Unlock the power of seamless connectivity with the CC3235MODSF12MOBR by Texas Instruments. Crafted with precision and expertise, this telecom interface IC offers unparalleled quality and reliability. Ideal for a wide range of applications, this product provides customers with superior value and benefits. Experience the advantage of effortless communication and innovative technology with the CC3235MODSF12MOBR.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient automated assembly, saving time and cost in production.

Package Shape: RECTANGULAR

Rectangular package shape is commonly used in electronic components, providing a compact and efficient design for space-constrained applications.

No. of Terminals: 63

High number of terminals allow for enhanced connectivity options, making it versatile for various telecom interface applications.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance in a wide range of environmental conditions.

Terminal Finish: NICKEL GOLD

Nickel gold terminal finish offers excellent conductivity and corrosion resistance, ensuring long-term reliability of the product.

Nominal Supply Voltage: 3.3 V

Nominal supply voltage of 3.3 V is common in many electronic devices, providing compatibility and ease of integration with various systems.

Technical Specifications

Other Function Telecom Interface ICs CC3235MODSF12MOBR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-XQMA-B63

JESD-609 Code:

e4

Length:

20.5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

63

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

XMA

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Peak Reflow Temperature (C):

260

Maximum Seated Height:

2.4 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

17.5 mm

Trade Compliance

CC3235MODSF12MOBR Telecommunications trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

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