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CC430F6127IRGC

Texas Instruments

CC430F6127IRGC by Texas Instruments

CC430F6127IRGC by Texas Instruments is a telecom IC with 64 terminals in a square chip carrier package. It operates b/w -40 to 85°C, with a supply voltage of 2.2V. Suitable for industrial applications, it features nickel palladium gold terminal finish and very thin profile design.

Median Price

$3.680

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,680 parts In-Stock

1+ parts

$3.680

100+ parts

$3.610

1k+ parts

$3.530

10k+ parts

-

3,680

$3.680

$3.610

$3.530

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,601 parts In-Stock

1+ parts

$3.496

100+ parts

-

1k+ parts

-

10k+ parts

-

3,601

$3.496

-

-

-

Vyrian

USA . 6,897 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,897

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 985 parts In-Stock

1+ parts

$0.295

100+ parts

-

1k+ parts

-

10k+ parts

$0.283

985

$0.295

-

-

$0.283

Northwest PG Solutions

USA . 292 parts In-Stock

1+ parts

$0.325

100+ parts

-

1k+ parts

-

10k+ parts

$0.286

292

$0.325

-

-

$0.286

Corphita

USA . 518 parts In-Stock

1+ parts

$3.312

100+ parts

-

1k+ parts

-

10k+ parts

-

518

$3.312

-

-

-

Parana Technologies

USA . 1,810 parts In-Stock

1+ parts

$11.744

100+ parts

-

1k+ parts

$12.139

10k+ parts

-

1,810

$11.744

-

$12.139

-

DigiPath Technology Company

USA . 607 parts In-Stock

1+ parts

$12.932

100+ parts

$11.898

1k+ parts

-

10k+ parts

-

607

$12.932

$11.898

-

-

ChromeModa Solutions

Germany . 4,278 parts In-Stock

1+ parts

$13.196

100+ parts

$10.821

1k+ parts

-

10k+ parts

-

4,278

$13.196

$10.821

-

-

IDEA Electronic Components Group

UK . 2,193 parts In-Stock

1+ parts

$13.196

100+ parts

$12.536

1k+ parts

$11.876

10k+ parts

-

2,193

$13.196

$12.536

$11.876

-

AZTECH Wire

Italy . 322 parts In-Stock

1+ parts

$20.660

100+ parts

-

1k+ parts

-

10k+ parts

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322

$20.660

-

-

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QUARKTWIN TECHNOLOGY LTD

USA . 13,086 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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13,086

-

-

-

-

Overview

Elevate your telecom interface systems with the CC430F6127IRGC from Texas Instruments. As a leader in semiconductor manufacturing, Texas Instruments ensures top-notch quality and reliability in every product they produce. The CC430F6127IRGC is designed for a wide range of applications in the telecommunications industry, offering customers unparalleled value and performance. With advanced features and cutting-edge technology, this telecom circuit IC provides the perfect solution for your communication needs. Say goodbye to technical headaches and hello to seamless connectivity with the CC430F6127IRGC.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material offers durability and resistance to impact, making it suitable for telecom applications where the product may be subject to rough handling.

Surface Mount: YES

Surface mount technology allows for easier assembly and reduces the overall size of the product, making it ideal for compact telecom devices.

No. of Terminals: 64

Having a high number of terminals allows for more connectivity options, enhancing the functionality and versatility of the product.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand high levels of heat, ensuring reliable performance in various environmental conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, ensuring stable and efficient signal transmission.

Nominal Supply Voltage: 2.2 V

The nominal supply voltage of 2.2V meets the power requirements of the telecom circuit, providing optimal performance and efficiency.

Technical Specifications

Other Function Telecom Interface ICs CC430F6127IRGC attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

2.2 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Trade Compliance

CC430F6127IRGC Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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