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EQCO30R5.D

Microchip Technology

EQCO30R5.D by Microchip Technology

Microchip Technology's EQCO30R5.D is a telecom IC with 16 terminals in a square chip carrier package. It operates b/w -40 to 85°C, suitable for industrial use. With a nominal voltage of 3.3V, it features nickel palladium gold terminal finish and very thin profile design for telecom circuit applications.

Median Price

$5.700

Lifecycle Status

Suppliers In-Stock

18

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 917 parts In-Stock

1+ parts

$5.252

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-

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917

$5.252

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Chip1Stop

Japan . 917 parts In-Stock

1+ parts

$5.680

100+ parts

$5.020

1k+ parts

$4.920

10k+ parts

-

917

$5.680

$5.020

$4.920

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DigiKey

USA . 489 parts In-Stock

1+ parts

$5.700

100+ parts

$5.525

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-

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489

$5.700

$5.525

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Mouser Electronics

USA . 309 parts In-Stock

1+ parts

$5.700

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309

$5.700

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Microchip Technology

USA . 177 parts In-Stock

1+ parts

$5.700

100+ parts

$5.160

1k+ parts

$4.880

10k+ parts

$4.640

177

$5.700

$5.160

$4.880

$4.640

Arrow

USA . 34 parts In-Stock

1+ parts

$5.800

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-

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34

$5.800

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Newark

USA . 11 parts In-Stock

1+ parts

$5.870

100+ parts

$5.690

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11

$5.870

$5.690

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Element14

Singapore . 186 parts In-Stock

1+ parts

$6.071

100+ parts

$5.989

1k+ parts

-

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186

$6.071

$5.989

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Farnell

UK . 186 parts In-Stock

1+ parts

$9.338

100+ parts

$6.770

1k+ parts

$6.070

10k+ parts

-

186

$9.338

$6.770

$6.070

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Master Electronics

USA . 403 parts In-Stock

1+ parts

-

100+ parts

$5.390

1k+ parts

$5.360

10k+ parts

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403

-

$5.390

$5.360

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 150 parts In-Stock

1+ parts

$6.510

100+ parts

-

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150

$6.510

-

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NAC Semi

USA . 57 parts In-Stock

1+ parts

$6.720

100+ parts

$6.090

1k+ parts

$5.570

10k+ parts

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57

$6.720

$6.090

$5.570

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Chip Stock

USA . 7,194 parts In-Stock

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7,194

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Semtec, LLC

USA . 4,500 parts In-Stock

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4,500

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Vyrian

USA . 877 parts In-Stock

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877

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Electro Sonic

Canada . 710 parts In-Stock

1+ parts

-

100+ parts

$5.850

1k+ parts

$5.430

10k+ parts

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710

-

$5.850

$5.430

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IBS Electronics

USA . 403 parts In-Stock

1+ parts

-

100+ parts

$7.559

1k+ parts

$7.447

10k+ parts

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403

-

$7.559

$7.447

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Sunrise Surplus Inc.

USA . 10 parts In-Stock

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10

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Distributors (Availability)

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Ampacity Inc.

Singapore . 914 parts In-Stock

1+ parts

$3.650

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914

$3.650

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Semicontronic

India . 1,386 parts In-Stock

1+ parts

$3.760

100+ parts

$3.666

1k+ parts

$3.647

10k+ parts

-

1,386

$3.760

$3.666

$3.647

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Continental Prestige Electronics

USA . 236 parts In-Stock

1+ parts

$4.130

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236

$4.130

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Aztec Data Supply Inc.

USA . 4,614 parts In-Stock

1+ parts

$13.610

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4,614

$13.610

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Corohmni

South Africa . 304 parts In-Stock

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$15.851

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304

$15.851

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Lixinc

USA . 19,232 parts In-Stock

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19,232

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A-Z Elektronik GmbH

Germany . 7,301 parts In-Stock

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7,301

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RC Electronics

USA . 6,750 parts In-Stock

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6,750

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Alle Elektronik GmbH

Germany . 4,867 parts In-Stock

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4,867

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Marpe Global Electronics

Taiwan . 4,782 parts In-Stock

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4,782

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XL Components Corporation

Australia . 4,574 parts In-Stock

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4,574

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QualityLine Systems

Poland . 2,871 parts In-Stock

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2,871

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Argo Parts USA

USA . 1,072 parts In-Stock

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1,072

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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Perfect Parts

USA . 306 parts In-Stock

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306

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Overview

Discover the cutting-edge EQCO30R5.D by Microchip Technology, a top-tier manufacturer known for quality and innovation. This telecom interface IC offers unmatched reliability and performance in a compact square package. Ideal for a variety of applications, this product provides exceptional value with its advanced features and industrial-grade design. Experience seamless operation and superior connectivity with the EQCO30R5.D - the perfect solution for your telecom circuit needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and cost-effective.

Surface Mount: YES

Surface mount feature allows for easy and efficient assembly onto PCBs.

Package Shape: SQUARE

The square shape helps in optimizing space on PCBs efficiently.

No. of Terminals: 16

Having 16 terminals provides ample connectivity options for various functions.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style offers thermal management benefits and a compact profile for space-constrained applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable performance even in extreme cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold finish enhances conductivity and corrosion resistance for long-term reliability.

Terminal Position: QUAD

Quad terminal position provides balanced electrical connections for improved stability.

Maximum Seated Height: 1 mm

The low seated height helps in reducing overall height profile of the product for compact designs.

Width: 4 mm

With a width of 4mm, the product can fit into tight spaces without compromising on performance.

Maximum Time At Peak Reflow Temperature (s): 30

The short time at peak reflow temperature ensures safe soldering of the component during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature allows for reliable solder joints during assembly processes.

Length: 4 mm

The compact length of 4mm contributes to a smaller footprint on the PCB.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in various industrial environments.

Terminal Form: NO LEAD

Lead-free terminal form is environmentally friendly and compliant with RoHS regulations.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom applications, ensuring optimized performance in this domain.

Nominal Supply Voltage: 3.3 V

Stable 3.3V supply voltage ensures consistent and reliable operation of the product.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65mm allows for high-density mounting and efficient use of PCB space.

Technical Specifications

Other Function Telecom Interface ICs EQCO30R5.D attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Microchip Technology

Specs

JESD-30 Code:

S-PQCC-N16

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Trade Compliance

EQCO30R5.D Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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