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EQCO62T20.3-TRAY

Microchip Technology

EQCO62T20.3-TRAY by Microchip Technology

EQCO62T20.3-TRAY by Microchip Technology is a telecom IC with 16 terminals in a square chip carrier package. It operates b/w -40 to 85°C, with a nominal voltage of 1.2V. Ideal for telecom circuit applications, it features a very thin profile and no-lead terminal form for industrial use.

Median Price

$33.775

Lifecycle Status

EOL

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$33.775

100+ parts

-

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300

$33.775

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Vyrian

USA . 1,946 parts In-Stock

1+ parts

-

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1,946

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ACDS - Activité Composants Distribution Service

France . 83 parts In-Stock

1+ parts

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83

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 1,142 parts In-Stock

1+ parts

$10.140

100+ parts

-

1k+ parts

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1,142

$10.140

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Corohmni

South Africa . 19 parts In-Stock

1+ parts

$10.155

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19

$10.155

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Ampacity Inc.

Singapore . 1,861 parts In-Stock

1+ parts

$31.300

100+ parts

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1,861

$31.300

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Semicontronic

India . 1,766 parts In-Stock

1+ parts

$31.300

100+ parts

$30.518

1k+ parts

$30.361

10k+ parts

-

1,766

$31.300

$30.518

$30.361

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Continental Prestige Electronics

USA . 1,390 parts In-Stock

1+ parts

$33.600

100+ parts

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1k+ parts

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10k+ parts

$32.928

1,390

$33.600

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$32.928

Argo Parts USA

USA . 3,487 parts In-Stock

1+ parts

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3,487

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Microchip USA

USA . 2,817 parts In-Stock

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2,817

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Fulton Briggs Corp.

USA . 1,075 parts In-Stock

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1,075

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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Netroflash

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$33.100

1k+ parts

$32.086

10k+ parts

$31.411

500

-

$33.100

$32.086

$31.411

Robosynatics

Brazil . 200 parts In-Stock

1+ parts

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100+ parts

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200

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Lucentia Tech

USA . 200 parts In-Stock

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200

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Overview

Discover the EQCO62T20.3-TRAY by Microchip Technology, a high-quality product that brings unparalleled value to your telecom interface applications. With a focus on excellence in manufacturing and cutting-edge technology, Microchip Technology delivers reliability and innovation with every product they create. The EQCO62T20.3-TRAY offers customers a seamless experience, making it easier than ever to enhance their telecom systems. Upgrade your projects with this top-of-the-line solution and see the difference for yourself. Elevate your telecom interface ICs with Microchip Technology's superior products.

Feature Benefit Bullets

Package Body Material : PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package of this product durable and resistant to environmental factors, ensuring reliable performance.

Surface Mount : YES

Surface mount capability makes the installation of this product easier and more efficient, saving time and effort during assembly.

No. of Terminals : 16

Having 16 terminals allows for multiple connections and functionalities, making this product versatile in its application.

Maximum Operating Temperature : 85 °C

With a maximum operating temperature of 85°C, this product can withstand high temperatures, making it suitable for a variety of operating environments.

Minimum Operating Temperature : -40 °C

The ability to operate at a minimum temperature of -40°C ensures that this product can function in extremely cold conditions without any issues.

Nominal Supply Voltage : 1.2 V

The nominal supply voltage of 1.2V ensures efficient power consumption, making this product energy-efficient and cost-effective in the long run.

Technical Specifications

Other Function Telecom Interface ICs EQCO62T20.3-TRAY attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Microchip Technology

Specs

JESD-30 Code:

S-XQCC-N16

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Trade Compliance

EQCO62T20.3-TRAY Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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