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EQCO31R20.3

Microchip Technology

EQCO31R20.3 by Microchip Technology

Microchip EQCO31R20.3 is a telecom IC with 16 terminals in a square chip carrier package. Operating temp range -40 to 85°C, peak reflow temp 260°C. Ideal for telecom circuits, it has a nominal voltage of 1.2V and terminal pitch of 0.65mm, suitable for industrial applications.

Median Price

$29.670

Lifecycle Status

EOL

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 13,451 parts In-Stock

1+ parts

$27.720

100+ parts

$25.020

1k+ parts

$23.770

10k+ parts

$22.590

13,451

$27.720

$25.020

$23.770

$22.590

DigiKey

USA . 9 parts In-Stock

1+ parts

$27.720

100+ parts

-

1k+ parts

-

10k+ parts

-

9

$27.720

-

-

-

Master Electronics

USA . 132 parts In-Stock

1+ parts

$31.620

100+ parts

$26.540

1k+ parts

$26.220

10k+ parts

-

132

$31.620

$26.540

$26.220

-

Verical

USA . 132 parts In-Stock

1+ parts

-

100+ parts

$31.788

1k+ parts

-

10k+ parts

-

132

-

$31.788

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$30.326

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$30.326

-

-

-

Electro Sonic

Canada . 182 parts In-Stock

1+ parts

$33.600

100+ parts

$28.710

1k+ parts

$26.900

10k+ parts

-

182

$33.600

$28.710

$26.900

-

IBS Electronics

USA . 132 parts In-Stock

1+ parts

$35.830

100+ parts

$32.867

1k+ parts

-

10k+ parts

-

132

$35.830

$32.867

-

-

Chip Stock

USA . 4,833 parts In-Stock

1+ parts

-

100+ parts

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4,833

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Vyrian

USA . 585 parts In-Stock

1+ parts

-

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585

-

-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 456 parts In-Stock

1+ parts

$7.148

100+ parts

-

1k+ parts

-

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456

$7.148

-

-

-

Ampacity Inc.

Singapore . 681 parts In-Stock

1+ parts

$23.560

100+ parts

-

1k+ parts

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10k+ parts

-

681

$23.560

-

-

-

Continental Prestige Electronics

USA . 5,917 parts In-Stock

1+ parts

$30.326

100+ parts

-

1k+ parts

-

10k+ parts

$29.719

5,917

$30.326

-

-

$29.719

Microchip USA

USA . 159 parts In-Stock

1+ parts

$65.768

100+ parts

-

1k+ parts

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10k+ parts

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159

$65.768

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-

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Lixinc

USA . 17,394 parts In-Stock

1+ parts

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17,394

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-

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Fulton Briggs Corp.

USA . 7,163 parts In-Stock

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7,163

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Argo Parts USA

USA . 3,748 parts In-Stock

1+ parts

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3,748

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Eastek

USA . 1,200 parts In-Stock

1+ parts

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1,200

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-

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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1,000

-

-

-

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Netroflash

USA . 100 parts In-Stock

1+ parts

-

100+ parts

$29.719

1k+ parts

$28.810

10k+ parts

$28.203

100

-

$29.719

$28.810

$28.203

Overview

Enhance your telecom applications with the EQCO31R20.3 by Microchip Technology, a top-quality manufacturer known for its reliable products. This versatile IC offers seamless integration and exceptional performance in various telecom functions. With a compact square package and a nickel palladium gold finish, this chip delivers optimal functionality in industrial environments. Experience the value of efficiency and precision with the EQCO31R20.3, designed to meet your telecom interface needs with ease. Elevate your projects with Microchip Technology's cutting-edge solutions.

Feature Benefit Bullets

Surface Mount: YES

Surface mount allows for easy integration into electronic circuits, saving space and reducing assembly time.

Package Shape: SQUARE

Square shape provides a stable mounting platform and ensures uniform heat dissipation.

No. of Terminals: 16

Having 16 terminals allows for multiple connection points, enabling the IC to efficiently communicate with other components.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile ensures effective heat dissipation and compact design for space-constrained applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC can withstand harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the IC to function reliably in cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance for long-term reliability.

Terminal Position: QUAD

Quad terminal position offers stability and ease of soldering during installation.

Maximum Seated Height: 0.9 mm

The low maximum seated height allows for a compact overall footprint in the circuit design.

Width: 4 mm

The narrow width of 4mm makes this IC suitable for applications where space is limited.

Maximum Time At Peak Reflow Temperature (s): 30

Short reflow time of 30 seconds reduces the risk of thermal damage during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature of 260°C ensures proper soldering and reliability in the assembly process.

Length: 4 mm

Compact length of 4mm contributes to space-saving in the overall design.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures the IC can operate within a wide temperature range, suitable for industrial applications.

Terminal Form: NO LEAD

No lead terminal form is environmentally friendly and compliant with RoHS regulations.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom applications, this IC provides reliable performance in communication systems.

Nominal Supply Voltage: 1.2 V

Low nominal supply voltage of 1.2V contributes to energy efficiency and power savings.

Terminal Pitch: 0.65 mm

Narrow terminal pitch of 0.65mm allows for high-density PCB layouts and enables efficient signal routing.

Technical Specifications

Other Function Telecom Interface ICs EQCO31R20.3 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Microchip Technology

Specs

JESD-30 Code:

S-XQCC-N16

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.9 mm

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Trade Compliance

EQCO31R20.3 Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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