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CC2520RHDTG4

Texas Instruments

CC2520RHDTG4 by Texas Instruments

CC2520RHDTG4 by Texas Instruments is a telecom IC with 28 terminals in a square chip carrier package. It operates b/w -40°C to 125°C, suitable for automotive applications. With a nominal voltage of 3V, it features CMOS technology and terminal finish in nickel palladium gold.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,020 parts In-Stock

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6,020

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Digiode

USA . 1,134 parts In-Stock

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1,134

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

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Parana Technologies

USA . 2,253 parts In-Stock

1+ parts

$7.627

100+ parts

-

1k+ parts

$8.145

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2,253

$7.627

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$8.145

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IDEA Electronic Components Group

UK . 1,729 parts In-Stock

1+ parts

$8.570

100+ parts

$8.142

1k+ parts

$7.713

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-

1,729

$8.570

$8.142

$7.713

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ChromeModa Solutions

Germany . 840 parts In-Stock

1+ parts

$8.570

100+ parts

$7.027

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-

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840

$8.570

$7.027

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Corohmni

South Africa . 39 parts In-Stock

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$15.260

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39

$15.260

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AZTECH Wire

Italy . 316 parts In-Stock

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$15.373

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316

$15.373

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Semicontronic

India . 132 parts In-Stock

1+ parts

$410.000

100+ parts

$399.750

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$397.700

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132

$410.000

$399.750

$397.700

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One Stop Electronics

USA . 1,003 parts In-Stock

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$431.000

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$431.000

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Ampacity Inc.

Singapore . 845 parts In-Stock

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$471.000

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845

$471.000

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Corphita

USA . 4,970 parts In-Stock

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4,970

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Argo Parts USA

USA . 2,836 parts In-Stock

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Continental Prestige Electronics

USA . 2,569 parts In-Stock

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2,569

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DigiPath Technology Company

USA . 761 parts In-Stock

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$7.727

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761

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$7.727

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Bastille Electronics

Australia . 100 parts In-Stock

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100

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Overview

Elevate your projects with the CC2520RHDTG4 by Texas Instruments, a premium quality telecom interface IC that offers unmatched reliability and performance. Manufactured by the industry leader in innovative technology solutions, this versatile chip carrier boasts a wide range of applications in various industries. From automotive to telecommunications, this product delivers exceptional value, efficiency, and precision. Say goodbye to compromise and hello to superior results with the CC2520RHDTG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and protection for the IC, making it suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on circuit boards, saving space and making assembly more efficient.

Package Shape: SQUARE

The square package shape ensures compatibility with standard board layouts and facilitates easy integration into existing designs.

No. of Terminals: 28

With 28 terminals, this IC offers a sufficient number of connections for versatile connectivity options.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile design enhances thermal management and space efficiency in the application.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliable performance even in demanding operating conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the IC to function effectively in a wide range of environments with varying temperatures.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish offers excellent conductivity and corrosion resistance for reliable signal transmission.

Terminal Position: QUAD

The quad terminal position enables secure and stable connections, reducing the risk of signal loss or interference.

Maximum Seated Height: 1 mm

The low maximum seated height allows for compact and space-saving installation within electronic devices.

Width: 5 mm

The narrow width of 5 mm enables the IC to be easily integrated into tight spaces or crowded PCB layouts.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature of 30 seconds ensures proper soldering during assembly, preventing overheating of the IC.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C allows for efficient soldering and bonding of the IC to the circuit board.

Length: 5 mm

The compact length of 5 mm further enhances the IC's space-saving design and compatibility with various electronic devices.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade indicates that the IC is suitable for use in automotive applications, meeting the industry's stringent requirements for reliability and performance under harsh conditions.

Technology: CMOS

The CMOS technology used in the IC ensures low power consumption, high speed, and reliable operation in diverse telecom interface functions.

Terminal Form: NO LEAD

The no-lead terminal form complies with environmental regulations and offers improved solderability and thermal performance.

Telecom IC Type: TELECOM CIRCUIT

As a telecom circuit interface IC, this product is specifically designed to support communication functions in telecommunication systems, ensuring reliable data transmission and signal processing.

Nominal Supply Voltage: 3 V

The nominal supply voltage of 3V is commonly used in telecom applications, ensuring compatibility with existing power systems and circuits.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5 mm allows for high-density mounting and efficient signal routing on the PCB, contributing to space optimization.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, this IC can withstand moderate exposure to moisture during storage and handling, enhancing reliability in humid environments.

Technical Specifications

Other Function Telecom Interface ICs CC2520RHDTG4 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N28

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

CC2520RHDTG4 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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