Loading...

CC2564BYFVR-XI

Texas Instruments

CC2564BYFVR-XI by Texas Instruments

CC2564BYFVR-XI by Texas Instruments is a 54-terminal IC with a package style of GRID ARRAY. It operates at -40 to 85°C, has a data rate of 4 Mbps, and requires a nominal voltage of 3.6 V. Ideal for telecom circuits, this IC is surface mountable and features TIN SILVER COPPER terminal finish.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,130 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,130

-

-

-

-

Vyrian

USA . 2,460 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,460

-

-

-

-

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

500

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 62 parts In-Stock

1+ parts

$9.483

100+ parts

-

1k+ parts

-

10k+ parts

-

62

$9.483

-

-

-

Parana Technologies

USA . 713 parts In-Stock

1+ parts

$15.587

100+ parts

-

1k+ parts

$15.962

10k+ parts

-

713

$15.587

-

$15.962

-

ChromeModa Solutions

Germany . 6,877 parts In-Stock

1+ parts

$17.513

100+ parts

$14.361

1k+ parts

-

10k+ parts

-

6,877

$17.513

$14.361

-

-

IDEA Electronic Components Group

UK . 1,599 parts In-Stock

1+ parts

$17.513

100+ parts

$16.637

1k+ parts

$15.762

10k+ parts

-

1,599

$17.513

$16.637

$15.762

-

AZTECH Wire

Italy . 839 parts In-Stock

1+ parts

$18.444

100+ parts

-

1k+ parts

-

10k+ parts

-

839

$18.444

-

-

-

Ampacity Inc.

Singapore . 1,154 parts In-Stock

1+ parts

$66.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,154

$66.000

-

-

-

Semicontronic

India . 568 parts In-Stock

1+ parts

$484.000

100+ parts

$471.900

1k+ parts

$469.480

10k+ parts

-

568

$484.000

$471.900

$469.480

-

One Stop Electronics

USA . 424 parts In-Stock

1+ parts

$848.000

100+ parts

-

1k+ parts

-

10k+ parts

-

424

$848.000

-

-

-

Continental Prestige Electronics

USA . 3,138 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,138

-

-

-

-

Argo Parts USA

USA . 2,180 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,180

-

-

-

-

Corphita

USA . 2,108 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,108

-

-

-

-

DigiPath Technology Company

USA . 809 parts In-Stock

1+ parts

-

100+ parts

$15.790

1k+ parts

-

10k+ parts

-

809

-

$15.790

-

-

Robosynatics

Brazil . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

500

-

-

-

-

Lucentia Tech

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$0.181

1k+ parts

$0.181

10k+ parts

$0.181

500

-

$0.181

$0.181

$0.181

Bastille Electronics

Australia . 200 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

200

-

-

-

-

Overview

Unlock endless possibilities with the Texas Instruments CC2564BYFVR-XI, a cutting-edge Telecom Interface IC that promises unmatched quality and reliability. Manufactured by industry leader Texas Instruments, this product offers exceptional value with its versatile applications in various industries. Whether you're looking to enhance your communication systems or streamline your telecom infrastructure, the CC2564BYFVR-XI has got you covered. Experience seamless connectivity and optimal performance with this innovative solution that is designed to exceed your expectations. Elevate your projects with Texas Instruments today.

Feature Benefit Bullets

Surface Mount: YES

This feature allows for efficient and compact PCB assembly, saving space and reducing manufacturing costs.

Package Shape: RECTANGULAR

The rectangular shape helps in easy placement and alignment on the PCB, ensuring a secure and reliable connection.

No. of Terminals: 54

With a high number of terminals, this product offers various connectivity options for different applications.

Package Style: GRID ARRAY, VERY THIN PROFILE, FINE PITCH

This design provides high density and reliability, making it suitable for high-performance telecom applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures the product can withstand harsh environmental conditions, increasing its durability.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for reliable performance in extreme cold environments.

Terminal Finish: TIN SILVER COPPER

This finish provides excellent conductivity and corrosion resistance, enhancing the overall performance and lifespan of the product.

Terminal Position: BOTTOM

The bottom terminal position simplifies PCB layout and allows for easy access during troubleshooting and maintenance.

Maximum Seated Height: 0.575 mm

The low height profile of the product allows for compact and slim device designs.

Width: 2.93 mm

The narrow width enables space-saving integration into various electronic devices.

Maximum Time At Peak Reflow Temperature (s): 30

The short reflow time ensures quick and efficient soldering during production, reducing manufacturing time and cost.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures strong and reliable solder joints for optimal performance.

Length: 3.26 mm

The compact length of the product makes it suitable for applications with limited space constraints.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in a wide range of temperature conditions.

Terminal Form: BALL

The ball terminal form provides secure connections and easy soldering, enhancing overall reliability.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom applications, this product offers optimized performance and compatibility in communication systems.

Nominal Supply Voltage: 3.6 V

The standard supply voltage ensures compatibility with a wide range of devices and power sources.

Terminal Pitch: 0.4 mm

The fine terminal pitch allows for high-density packaging and precise connectivity, ideal for complex telecom setups.

Data Rate: 4 Mbps

With a high data rate capability, this product delivers fast and reliable communication performance in telecom applications.

Technical Specifications

Other Function Telecom Interface ICs CC2564BYFVR-XI attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

Data Rate:

4 Mbps

JESD-30 Code:

R-XBGA-B54

JESD-609 Code:

e1

Length:

3.26 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

54

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.575 mm

Nominal Supply Voltage:

3.6 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2.93 mm

Trade Compliance

CC2564BYFVR-XI Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 19