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TDA5150

Infineon Technologies

TDA5150 by Infineon Technologies

TDA5150 by Infineon Technologies is a telecom interface IC with 10 terminals, operating at temperatures from -40 to 85°C. It has a supply voltage of 2/3.3V and is designed for telecom circuits, featuring a small outline package suitable for surface mounting applications. The package material is plastic/epoxy with a square shape and gull wing terminal form, making it ideal for industrial temperature grade environments.

Median Price

$1.386

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$1.249

5,000

-

-

-

$1.249

Arrow

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$1.361

5,000

-

-

-

$1.361

Master Electronics

USA . 20 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.410

10k+ parts

-

20

-

-

$1.410

-

RS (Exports)

UK . 1 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$2.150

1

-

-

-

$2.150

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$1.960

100+ parts

-

1k+ parts

-

10k+ parts

-

10

$1.960

-

-

-

Pegasus Components GmbH

Germany . 2,716 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,716

-

-

-

-

Vyrian

USA . 2,101 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,101

-

-

-

-

Digiode

USA . 513 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

513

-

-

-

-

Zilex Electronics Inc.

Canada . 191 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

191

-

-

-

-

LittleDiode

UK . 101 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

101

-

-

-

-

Holdelec - ElecDif-Pro

France . 28 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

28

-

-

-

-

ACDS - Activité Composants Distribution Service

France . 28 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

28

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 2,477 parts In-Stock

1+ parts

$1.060

100+ parts

$1.034

1k+ parts

$1.028

10k+ parts

-

2,477

$1.060

$1.034

$1.028

-

Ampacity Inc.

Singapore . 2,219 parts In-Stock

1+ parts

$1.060

100+ parts

-

1k+ parts

-

10k+ parts

-

2,219

$1.060

-

-

-

Continental Prestige Electronics

USA . 2,509 parts In-Stock

1+ parts

$1.960

100+ parts

-

1k+ parts

-

10k+ parts

$1.921

2,509

$1.960

-

-

$1.921

Argo Parts USA

USA . 1,860 parts In-Stock

1+ parts

$1.960

100+ parts

-

1k+ parts

-

10k+ parts

-

1,860

$1.960

-

-

-

Netroflash

USA . 100 parts In-Stock

1+ parts

$1.960

100+ parts

-

1k+ parts

$1.862

10k+ parts

$1.823

100

$1.960

-

$1.862

$1.823

Aztec Data Supply Inc.

USA . 1,406 parts In-Stock

1+ parts

$7.456

100+ parts

-

1k+ parts

-

10k+ parts

-

1,406

$7.456

-

-

-

Corohmni

South Africa . 461 parts In-Stock

1+ parts

$8.149

100+ parts

-

1k+ parts

-

10k+ parts

-

461

$8.149

-

-

-

Modulus Dynamics

Lithuania . 1,445 parts In-Stock

1+ parts

$17.240

100+ parts

$16.550

1k+ parts

$15.861

10k+ parts

-

1,445

$17.240

$16.550

$15.861

-

Component Connect

USA . 533,983 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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533,983

-

-

-

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Lixinc

USA . 18,674 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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18,674

-

-

-

-

Perfect Parts

USA . 6,436 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

-

10k+ parts

-

6,436

-

-

-

-

RC Electronics

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

$7.600

1k+ parts

$7.260

10k+ parts

$7.000

5,000

-

$7.600

$7.260

$7.000

Corphita

USA . 504 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

504

-

-

-

-

Overview

Discover the innovative TDA5150 by Infineon Technologies, a cutting-edge telecom interface IC that delivers exceptional quality and reliability. With its advanced technology and durable plastic/epoxy construction, this small outline, thin profile chip offers unmatched performance in various telecom applications. Experience seamless connectivity and enhanced functionality with the TDA5150, designed to operate efficiently in industrial settings with a supply voltage of 3V. Trust Infineon Technologies for top-of-the-line products that provide value, benefits, and advantages to customers looking for superior telecom solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight, durable, and cost-effective, making the product suitable for a wide range of applications.

Surface Mount: YES

Surface mount capability allows for easy installation and integration into various electronic devices.

Power Supplies (V): 2/3.3

Support for dual power supply voltages (2V and 3.3V) provides flexibility in design and compatibility with different systems.

No. of Terminals: 10

Having 10 terminals offers connectivity options for multiple components, enhancing the functionality of the product.

Package Shape: SQUARE

The square package shape is space-efficient and allows for compact placement within electronic devices.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can perform reliably in various environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures functionality even in cold environments, increasing the product's versatility.

Terminal Position: DUAL

Dual terminal positions provide flexibility in installation and connection options for the product.

Width: 3 mm

The compact width of 3mm allows for easy integration into tight spaces and small electronic devices.

Telecom IC Type: TELECOM CIRCUIT

Designed specifically for telecom circuits, ensuring high performance and reliability in telecommunications applications.

Technical Specifications

Other Function Telecom Interface ICs TDA5150 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Infineon Technologies

Specs

JESD-30 Code:

S-PDSO-G10

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP10,.19,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.05 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

3 mm

Trade Compliance

TDA5150 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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