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TDA5235XUMA1

Infineon Technologies

TDA5235XUMA1 by Infineon Technologies

TDA5235XUMA1 by Infineon is a telecom IC with 28 terminals, operating b/w -40 to 105°C. It has a supply voltage of 3.3V and terminal finish of NiPdAuAg. This small outline IC is used in telecom circuits for various applications due to its compact size and industrial temperature grade suitability.

Median Price

$2.895

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 2,529 parts In-Stock

1+ parts

$1.060

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-

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2,529

$1.060

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Arrow

USA . 2,977 parts In-Stock

1+ parts

$3.203

100+ parts

$3.055

1k+ parts

$2.907

10k+ parts

-

2,977

$3.203

$3.055

$2.907

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Newark

USA . 2,512 parts In-Stock

1+ parts

$4.610

100+ parts

$3.480

1k+ parts

$3.050

10k+ parts

-

2,512

$4.610

$3.480

$3.050

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DigiKey

USA . 2,500 parts In-Stock

1+ parts

$5.910

100+ parts

$4.455

1k+ parts

$3.913

10k+ parts

-

2,500

$5.910

$4.455

$3.913

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Element14

Singapore . 2,989 parts In-Stock

1+ parts

$6.978

100+ parts

$5.110

1k+ parts

$3.493

10k+ parts

-

2,989

$6.978

$5.110

$3.493

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Farnell

UK . 2,545 parts In-Stock

1+ parts

-

100+ parts

$2.380

1k+ parts

$1.830

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2,545

-

$2.380

$1.830

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Rochester

USA . 1,390 parts In-Stock

1+ parts

-

100+ parts

$2.310

1k+ parts

$2.070

10k+ parts

$1.940

1,390

-

$2.310

$2.070

$1.940

Verical

USA . 1,390 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.587

10k+ parts

$2.425

1,390

-

-

$2.587

$2.425

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 883 parts In-Stock

1+ parts

$1.007

100+ parts

-

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883

$1.007

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Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$3.228

100+ parts

-

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500

$3.228

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ComSIT Distribution GmbH

Germany . 102,000 parts In-Stock

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Chip Stock

USA . 24,500 parts In-Stock

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Vyrian

USA . 2,585 parts In-Stock

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2,585

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Diverse Electronics

Canada . 18 parts In-Stock

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18

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Distributors (Availability)

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Ampacity Inc.

Singapore . 2,274 parts In-Stock

1+ parts

$0.900

100+ parts

-

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2,274

$0.900

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Corphita

USA . 272 parts In-Stock

1+ parts

$0.954

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272

$0.954

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Continental Prestige Electronics

USA . 2,989 parts In-Stock

1+ parts

$1.620

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2,989

$1.620

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Argo Parts USA

USA . 3,326 parts In-Stock

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$3.228

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3,326

$3.228

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Netroflash

USA . 100 parts In-Stock

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$3.228

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100

$3.228

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Aztec Data Supply Inc.

USA . 3,007 parts In-Stock

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$6.544

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3,007

$6.544

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Modulus Dynamics

Lithuania . 2,863 parts In-Stock

1+ parts

$7.232

100+ parts

$6.943

1k+ parts

$6.653

10k+ parts

-

2,863

$7.232

$6.943

$6.653

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Corohmni

South Africa . 178 parts In-Stock

1+ parts

$11.756

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178

$11.756

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Epart123

USA . 21,000 parts In-Stock

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$1.900

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$1.900

RC Electronics

USA . 13,500 parts In-Stock

1+ parts

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$3.420

1k+ parts

$3.230

10k+ parts

$3.160

13,500

-

$3.420

$3.230

$3.160

Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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Perfect Parts

USA . 6,731 parts In-Stock

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Infinite Electronics LLP (Excess)

. 2,307 parts In-Stock

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GreenTree Electronics

Israel . 2,000 parts In-Stock

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S.R.D Solutions

India . 1,625 parts In-Stock

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Lixinc

USA . 1,356 parts In-Stock

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1,356

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Overview

Elevate your communication systems with the cutting-edge TDA5235XUMA1 by Infineon Technologies. Crafted with precision and expertise, this telecom interface IC offers unparalleled quality and reliability. Perfect for a wide range of applications, this product provides seamless connectivity and enhanced performance. Experience the value and benefits of Infineon's superior technology, bringing efficiency and innovation to your projects. Trust in the advantages that the TDA5235XUMA1 has to offer, elevating your communications to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of PLASTIC/EPOXY material provides durability and protection to the component, ensuring a longer lifespan.

Surface Mount: YES

Being surface mountable makes it easier to integrate into circuit designs and saves space on the PCB.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature, this component can withstand harsh environments and ensure reliable performance.

Nominal Supply Voltage: 3.3 V

The low nominal supply voltage makes it energy efficient and suitable for a variety of applications.

Moisture Sensitivity Level (MSL): 3

A MSL of 3 indicates that this component has a moderate level of moisture sensitivity, making it suitable for storage and handling in typical manufacturing environments.

Technical Specifications

Other Function Telecom Interface ICs TDA5235XUMA1 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Infineon Technologies

Specs

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

9.7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

TDA5235XUMA1 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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