Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
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Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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U2270B-MFPY by Atmel is a telecom interface IC with 1 function. It has a small outline, low profile package style and operates in temperatures ranging from -40 to 105 °C. It is commonly used in telecom circuits for various applications.
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Plastic material provides durability and protection for the IC, making it suitable for various environmental conditions.
Allows for easy and efficient installation on circuit boards, saving time and effort during manufacturing.
Rectangular shape aids in space-saving design and efficient placement on a PCB.
Provides enough terminals for multiple connections, enhancing the functionality of the IC.
Compact design with low profile saves space on the PCB and ensures efficient use of board real estate.
The high maximum operating temperature ensures the IC can perform reliably in various industrial settings.
Wide temperature range allows for operation in both extreme cold and hot environments.
Matte tin finish provides good conductivity and solderability for reliable connections.
Dual terminal positions offer flexibility in circuit design and allow for versatile connectivity options.
Low seated height enables a slim profile and efficient use of space on the PCB.
Narrow width facilitates compact design and efficient placement of the IC on the circuit board.
High peak reflow temperature ensures reliable soldering during manufacturing processes.
Optimal length for accommodating the necessary circuitry while maintaining a compact overall size.
Industrial-grade temperature rating allows the IC to operate in harsh industrial environments with stability and reliability.
Gull-wing terminals offer secure connections and easy soldering, enhancing the reliability of the IC.
Specifically designed for telecom applications, ensuring compatibility and optimized performance in telecommunications systems.
Fine terminal pitch allows for high-density connections and efficient use of space on the PCB.
Other Function Telecom Interface ICs U2270B-MFPY attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Atmel
JESD-30 Code:
JESD-609 Code:
Length:
Moisture Sensitivity Level (MSL):
No. of Functions:
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Peak Reflow Temperature (C):
Qualification:
Maximum Seated Height:
Surface Mount:
Telecom IC Type:
Temperature Grade:
Terminal Finish:
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Width:
U2270B-MFPY Telecommunications trade compliance attributes, and parameters.
ECCN
5A991.B
ECCN Governance
EAR
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Packaging - Transfer to Microchip/Label/Pkg 5/Sep/2016
Atmel Corporation was a creator and manufacturer of semiconductors before being subsumed by Microchip Technology in 2016. Atmel was founded in 1984. The company focused on embedded systems built around microcontrollers
2N2222A
Semiconductor Technology
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
LM358AN
Fairchild Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
FDLL4148
National Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
2N7002
Lite-on Semiconductor
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Qualification: Not Qualified; Additional Features: LOW THRESHOLD; Minimum DS Breakdown Voltage: 60 V;
1N4148
General Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
SMBJ18CA
Hy Electronic
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Asi Semiconductor
Boca Semiconductor
Promax-johnton
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Terminal Form: GULL WING; Maximum Drain-Source On Resistance: 7.5 ohm; Minimum DS Breakdown Voltage: 60 V;
Gec Plessey Semiconductors
1N4148WS
Meritek Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Package Style (Meter): SMALL OUTLINE; Terminal Position: DUAL;
Iskra Semic Capacitors Industry
RECTIFIER DIODE; Surface Mount: NO; No. of Phases: 1; Maximum Operating Temperature: 200 Cel; JESD-609 Code: e0; Maximum Non Repetitive Peak Forward Current: 2 A;
LM358ADR
Texas Instruments
LM358ADR by Texas Instruments is an operational amplifier with 2 functions, featuring a max input offset voltage of 5000 uV and nominal voltage of 5V. Widely used in applications requiring high voltage gain, it operates within a temperature range of 0-70°C and offers frequency compensation for stability.
BSS138
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Maximum Feedback Capacitance (Crss): 10 pF; JEDEC-95 Code: TO-236AB;
M39029/58-360
Tri-star Electronics International
CONNECTOR ACCESSORY; Material: COPPER ALLOY; MIL Conformity: YES; Associated Military - Specifications: MIL-C-55302/69, MIL-C-38999; MIL-Connector Accessory Name: CONTACT; Terminal Type: CRIMP;
BAV99
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Pro-an Electronic
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Maximum Clamping Voltage: 29.2 V; Polarity: BIDIRECTIONAL; Nominal Breakdown Voltage: 21.05 V; Maximum Repetitive Peak Reverse Voltage: 18 V;
RN4870-I/RM130
Microchip Technology
RN4870-I/RM130 by Microchip Technology is a telecom IC with 33 terminals, operating at -40 to 85°C. It has a data rate of 0.01 Mbps and nominal voltage of 3.3V, suitable for industrial applications requiring low-power communication solutions. This surface-mount IC in a rectangular package style is TS 16949 compliant, ideal for compact designs with limited space constraints.
EC21AFA-512-STD
Quectel Wireless Solutions
Quectel Wireless Solutions EC21AFA-512-STD is a RECTANGULAR MICROELECTRONIC ASSEMBLY with -40 to 85 °C operating temp range. It features QUAD terminals, 29mm width, and 3.8V supply voltage. Ideal for INDUSTRIAL telecom applications due to its compact size and high temperature tolerance.
PD69208T4ILQ-TR
Microchip Technology's PD69208T4ILQ-TR is a 56-terminal telecom IC with a max operating temp of 85°C. It features a no-lead terminal form, quad terminal position, and industrial temperature grade. Ideal for telecom circuits, this chip carrier package has a square shape and very thin profile for surface mount applications.
SX8651ICSTRT
Semtech
Semtech's SX8651ICSTRT is a 12-terminal IC with nickel palladium gold finish. It operates b/w -40 to 85°C, ideal for industrial telecom circuits at 1.8V supply voltage. The package style is grid array, very thin profile, fine pitch, suitable for surface mount applications.
NEO-M8U-06B
U-blox Ag
NEO-M8U-06B by U-blox Ag is a telecom IC with 24 terminals, operating at -40 to 85°C. It has a supply voltage of 3V and MSL level of 4, suitable for industrial applications requiring precise positioning and timing. The compact rectangular package measures 12.2mm x 16mm with a low seated height of 2.6mm, making it ideal for surface mount designs in automotive or IoT devices.
CC1175RHMT
CC1175RHMT by Texas Instruments is a telecom IC with 32 terminals, operating at -40 to 85°C. It has a supply voltage of 3V and terminal pitch of 0.5mm, suitable for industrial applications requiring a compact chip carrier package with surface mount capability. With nickel palladium gold finish, it offers reliable performance in telecom circuits at peak reflow temperature of 260°C.
RN42-I/RM615
RN42-I/RM615 by Microchip Technology is a telecom IC with 32 terminals, operating at -40 to 85°C. It has a data rate of 3 Mbps, operates at 3.3V, and is ideal for industrial applications requiring a surface-mount rectangular package with gold over nickel terminal finish.
SIM7600G
Simcom Wireless Solutions
SIM7600G by Simcom Wireless Solutions is a telecom IC with 135 terminals, operating from -40 to 85°C. It supports data rates up to 42 Mbps at a supply voltage of 3.8V. Ideal for industrial applications requiring high-speed cellular connectivity in a compact square package.
BM70BLES1FC2-0B05BA
BM70BLES1FC2-0B05BA by Microchip Technology is a telecom interface IC with surface mount capability. It operates in an industrial temperature range of -40 to 85 °C and has a data rate of 0.0086 Mbps. This IC is commonly used in telecom circuits for various applications.
ODIN-W260-00B
TELECOM CIRCUIT;
AS3933-BQFT
Ams Ag
AS3933-BQFT by Ams Ag is a telecom IC with 16 terminals in a square chip carrier package. Operating temperature ranges from -40 to 85 °C, suitable for industrial use. It has a nominal voltage of 3V and terminal pitch of 0.65mm, ideal for telecom circuit applications.
ISL32179EFRZ
Intersil
TELECOM CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE;
AS3933-BTST
Sciosense Bv
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR;
CAM-M8Q-0
TELECOM CIRCUIT; Peak Reflow Temperature (C): NOT SPECIFIED; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
BM71BLES1FC2-0002AA
BM71BLES1FC2-0002AA by Microchip Technology is a surface mount telecom interface IC with 16 terminals. It operates at temperatures ranging from -20 to 70 °C and has a data rate of 0.0086 Mbps. This IC is commonly used in telecom circuits for various applications.
453-00059C
Laird Technologies
TELECOM CIRCUIT; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 260;
AP22804AW5-7
Diodes Incorporated
Diodes Inc.'s AP22804AW5-7 is a telecom IC with 5 terminals, operating from -40 to 85°C. Its small outline package is ideal for telecom circuits, featuring matte tin finish and gull wing terminals. With a nominal 5V supply voltage, it's suitable for industrial applications requiring compact design and high temperature tolerance.
BGM240SA22VNA2
Silicon Labs
SN65DSI86ZQER
SN65DSI86ZQER by Texas Instruments is a 64-terminal, telecom interface IC with a data rate of 5400 Mbps. It operates b/w -40 to 85°C and has a supply voltage of 1.2V, making it suitable for industrial applications requiring high-speed data transmission in compact spaces. The package style is grid array with very thin profile and fine pitch, ideal for surface mount assembly processes.
CYBLE-416045-02
Cypress Semiconductor
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 43; Package Shape: RECTANGULAR; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
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U2270B-MFPG3Y
Atmel
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: LSOP; Package Shape: RECTANGULAR;
U2270B-FP
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;
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