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SA616DK/01,118

NXP Semiconductors

SA616DK/01,118 by NXP Semiconductors

SA616DK/01,118 by NXP Semiconductors is a telecom interface IC with 1 function. It has a small outline, low profile package style and operates at temperatures ranging from -40 to 85 °C. It is suitable for telecom circuit applications.

Median Price

$4.784

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$4.784

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500

$4.784

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Digiode

USA . 4,679 parts In-Stock

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4,679

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Vyrian

USA . 2,284 parts In-Stock

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2,284

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Anansix

USA . 880 parts In-Stock

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880

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$4.784

100+ parts

$4.688

1k+ parts

-

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1,000

$4.784

$4.688

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Continental Prestige Electronics

USA . 793 parts In-Stock

1+ parts

$4.784

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$4.688

793

$4.784

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$4.688

Modulus Dynamics

Lithuania . 2,895 parts In-Stock

1+ parts

$7.457

100+ parts

$7.457

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$7.457

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2,895

$7.457

$7.457

$7.457

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Andel Nordic

Denmark . 1,894 parts In-Stock

1+ parts

$8.494

100+ parts

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$8.155

10k+ parts

$8.155

1,894

$8.494

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$8.155

$8.155

Aztec Data Supply Inc.

USA . 1,741 parts In-Stock

1+ parts

$10.430

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1,741

$10.430

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Corohmni

South Africa . 556 parts In-Stock

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$11.632

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556

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AZTECH Wire

Italy . 281 parts In-Stock

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$13.174

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281

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One Stop Electronics

USA . 261 parts In-Stock

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$207.000

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261

$207.000

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Semicontronic

India . 587 parts In-Stock

1+ parts

$595.000

100+ parts

$580.125

1k+ parts

$577.150

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587

$595.000

$580.125

$577.150

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Ampacity Inc.

Singapore . 139 parts In-Stock

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$626.000

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139

$626.000

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Lixinc

USA . 15,069 parts In-Stock

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15,069

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UNI Independent Distributors

Spain . 4,757 parts In-Stock

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Argo Parts USA

USA . 2,444 parts In-Stock

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2,444

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Corphita

USA . 496 parts In-Stock

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496

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Perfect Parts

USA . 218 parts In-Stock

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218

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Overview

Experience the next level of telecom interface ICs with the SA616DK/01,118 by NXP Semiconductors. Built with precision and quality, this compact and versatile device is designed to provide seamless connectivity and enhanced performance. As a leader in semiconductor manufacturing, NXP Semiconductors ensures that every product meets the highest standards of reliability and functionality. The SA616DK/01,118 offers a wide range of applications, making it suitable for various industries and projects. With its advanced features and impeccable design, this telecom circuit guarantees exceptional value and benefits for customers. Stay connected and elevate your technology with the SA616DK/01,118 from NXP Semiconductors.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material provides protection and durability to the product, making it able to withstand various external conditions, making it a reliable choice.

Surface Mount:

YES - This feature allows for easy installation and integration onto PCBs, saving time and effort during manufacturing and assembly processes.

No. of Functions:

1 - Having a single function simplifies the product's design and functionality, ensuring it performs its intended task efficiently.

Package Shape:

RECTANGULAR - The rectangular shape enables easier placement and alignment on PCBs, optimizing space utilization and improving overall design aesthetics.

No. of Terminals:

20 - The ample number of terminals provides versatility and compatibility with various circuit configurations, offering flexibility in application.

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH - This compact package style conserves board space, making it suitable for designs with limited area while maintaining a low profile for efficient integration within devices.

Maximum Operating Temperature:

85 °C - With a high maximum operating temperature, the product can withstand demanding operating conditions without performance degradation, ensuring reliability and longevity.

Minimum Operating Temperature:

40 °C - The product's ability to operate at extremely low temperatures makes it suitable for applications in harsh environments, providing consistent performance even during extreme conditions.

Terminal Finish:

NICKEL PALLADIUM GOLD - The use of high-quality terminal finish enhances conductivity, prevents corrosion, and improves signal integrity, resulting in reliable and high-performance connections.

Terminal Position:

DUAL - Dual terminal positions allow for flexible PCB layout options, accommodating different design requirements and facilitating efficient circuit routing.

Maximum Seated Height:

1.5 mm - The low seated height enables the product to be used in compact devices with limited vertical space, ensuring optimal compatibility and integration capabilities.

Width:

4.4 mm - With its compact width, the product can fit into narrow spaces, contributing to efficient board layout and ideal for designs with space constraints.

Peak Reflow Temperature °C:

260 - The high peak reflow temperature ensures proper soldering during the assembly process, resulting in secure and reliable connections.

Length:

6.5 mm - The product's moderate length allows for easy installation and integration, providing flexibility without sacrificing functionality.

Temperature Grade:

INDUSTRIAL - The industrial temperature grade ensures the product's reliable operation in demanding industrial environments where temperature fluctuations can occur.

Terminal Form:

GULL WING - The gull wing terminal form allows for easy soldering and secure connections during assembly, ensuring reliable electrical contact.

Telecom IC Type:

TELECOM CIRCUIT - Being a telecom circuit IC, this product is specifically designed to meet the requirements of telecommunication applications, making it an ideal choice for such purposes.

Nominal Supply Voltage:

3 V - The product's nominal supply voltage of 3V provides compatibility with standard power sources, making it suitable for various electronic devices.

Terminal Pitch:

0.65 mm - The small terminal pitch allows for high-density integration, enabling compact PCB designs and improving overall circuit performance.

Moisture Sensitivity Level (MSL):

1 - With a moisture sensitivity level of 1, the product is capable of withstanding moisture exposure during handling, ensuring its long-term reliability and preventing damage.

Technical Specifications

Other Function Telecom Interface ICs SA616DK/01,118 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.5 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

SA616DK/01,118 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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