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SA616DK

NXP Semiconductors

SA616DK by NXP Semiconductors

SA616DK by NXP Semiconductors is a telecom interface IC with 20 terminals in a small outline package. Operating temperature range from -40 to 85°C, suitable for industrial use. Features include gull wing terminal form, 3V supply voltage, and shrink pitch package style.

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Nova Conductors

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Pegasus Components GmbH

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First Choice Components Inc.

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Speed Components Ltd

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ACDS - Activité Composants Distribution Service

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AZTECH Wire

Italy . 284 parts In-Stock

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One Stop Electronics

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Ampacity Inc.

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Overview

Upgrade your telecom devices with the SA616DK from NXP Semiconductors, a leading manufacturer known for top-quality products. This versatile telecom interface IC is designed to enhance communication systems, offering reliable performance and seamless integration. With its compact design and wide temperature range, the SA616DK is perfect for industrial applications where space is limited and durability is essential. Trust NXP Semiconductors for cutting-edge solutions that deliver value and efficiency to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the IC, ensuring longevity and reliability in various operating environments.

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and effort during the manufacturing process.

Package Shape: RECTANGULAR

Facilitates compact and space-saving design considerations for the end product.

No. of Terminals: 20

Offers flexibility in connecting various components and peripherals to the IC.

Maximum Operating Temperature: 85 °C

Ensures stable performance even in high-temperature environments, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Ideal for use in extreme cold conditions without compromising functionality.

Terminal Position: DUAL

Enhances connectivity options and facilitates efficient signal transmission.

Maximum Seated Height: 1.5 mm

Enables low-profile designs and ensures compatibility with compact electronic devices.

Width: 4.4 mm

Contributes to the overall small form factor of the IC, suitable for space-constrained applications.

Maximum Time At Peak Reflow Temperature (s): 40

Optimizes the manufacturing process by providing a precise reflow profile for soldering.

Peak Reflow Temperature °C: 260

Withstands high reflow temperatures, ensuring robust soldering connections for reliability.

Length: 6.5 mm

Balances between compact design and necessary functionality, suitable for various PCB layouts.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial environments with fluctuating temperatures and harsh conditions.

Terminal Form: GULL WING

Facilitates easy soldering and ensures secure connections for enhanced performance.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom applications, offering specialized functionality and performance.

Nominal Supply Voltage: 3 V

Compatible with common supply voltages, ensuring easy integration into existing systems.

Terminal Pitch: 0.65 mm

Provides precise and reliable connectivity, essential for telecom interface applications.

Technical Specifications

Other Function Telecom Interface ICs SA616DK attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G20

Length:

6.5 mm

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.5 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

4.4 mm

Trade Compliance

SA616DK Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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