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HMC1094LP3ETR

Analog Devices

HMC1094LP3ETR by Analog Devices

Analog Devices' HMC1094LP3ETR is a telecom IC with 16 terminals in a square chip carrier package. Operating temperature ranges from -40 to 85°C, suitable for industrial use. It has a nominal voltage of 3.3V and matte tin terminal finish, ideal for telecom circuit applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

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Vyrian

USA . 6,987 parts In-Stock

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Cyclops Electronics Ltd

UK . 792 parts In-Stock

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Nova Conductors

Japan . 750 parts In-Stock

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Digiode

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Corohmni

South Africa . 151 parts In-Stock

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$8.265

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Parana Technologies

USA . 1,456 parts In-Stock

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$11.918

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$11.084

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IDEA Electronic Components Group

UK . 535 parts In-Stock

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$12.815

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$12.174

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$12.174

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535

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Aztec Data Supply Inc.

USA . 264 parts In-Stock

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$16.530

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DigiPath Technology Company

USA . 1,922 parts In-Stock

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$19.991

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$19.192

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$19.192

Semicontronic

India . 225 parts In-Stock

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$57.000

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$55.575

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$55.290

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Ampacity Inc.

Singapore . 8,224 parts In-Stock

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Lixinc

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A-Z Elektronik GmbH

Germany . 5,000 parts In-Stock

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Argo Parts USA

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Continental Prestige Electronics

USA . 4,083 parts In-Stock

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Perfect Parts

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Kepictronics

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Corphita

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Bastille Electronics

Australia . 65 parts In-Stock

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Overview

Discover the power of innovation with the HMC1094LP3ETR by Analog Devices. As a leader in the industry, Analog Devices delivers top-quality telecom interface ICs that redefine connectivity. With a focus on reliability and performance, this product offers unmatched value to customers seeking seamless communication solutions. From industrial applications to telecom circuits, the HMC1094LP3ETR is designed to meet your needs with precision and efficiency. Trust Analog Devices to elevate your connectivity experience with cutting-edge technology and unparalleled expertise.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body provides durability and protection to the internal components of the IC, making it suitable for long-lasting use in various telecom applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and effort during the manufacturing process.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this IC can handle high temperature environments without compromising performance.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3 V ensures compatibility with a wide range of power sources commonly used in telecom applications.

Temperature Grade: INDUSTRIAL

Having an industrial temperature grade means this IC is designed to operate reliably in harsh industrial environments, making it a dependable choice for telecom applications.

Technical Specifications

Other Function Telecom Interface ICs HMC1094LP3ETR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Analog Devices

Specs

JESD-30 Code:

S-PQCC-N16

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

HMC1094LP3ETR Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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