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HMC124

Analog Devices

HMC124 by Analog Devices

Analog Devices' HMC124 is a GaAs technology IC with 16 terminals in a square chip carrier package. Operating at 5V, it's surface-mountable and ideal for telecom applications requiring other function interface ICs. The ceramic package ensures durability and reliability in various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,148 parts In-Stock

1+ parts

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8,148

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Digiode

USA . 860 parts In-Stock

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860

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 3,437 parts In-Stock

1+ parts

$13.376

100+ parts

-

1k+ parts

$12.440

10k+ parts

-

3,437

$13.376

-

$12.440

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IDEA Electronic Components Group

UK . 1,677 parts In-Stock

1+ parts

$14.383

100+ parts

$13.664

1k+ parts

$13.664

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1,677

$14.383

$13.664

$13.664

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AZTECH Wire

Italy . 409 parts In-Stock

1+ parts

$18.421

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409

$18.421

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DigiPath Technology Company

USA . 3,437 parts In-Stock

1+ parts

$22.437

100+ parts

$21.540

1k+ parts

-

10k+ parts

$21.540

3,437

$22.437

$21.540

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$21.540

Ampacity Inc.

Singapore . 181 parts In-Stock

1+ parts

$383.000

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181

$383.000

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One Stop Electronics

USA . 1,559 parts In-Stock

1+ parts

$409.000

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1,559

$409.000

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Semicontronic

India . 376 parts In-Stock

1+ parts

$871.000

100+ parts

$849.225

1k+ parts

$844.870

10k+ parts

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376

$871.000

$849.225

$844.870

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Corphita

USA . 77 parts In-Stock

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77

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Overview

Enhance your telecommunications systems with the HMC124 from Analog Devices. Known for their exceptional quality and reliability, Analog Devices delivers cutting-edge solutions for a variety of applications in the telecom industry. The HMC124 offers unparalleled performance and efficiency, making it the perfect choice for your next project. Upgrade your technology with Analog Devices and experience the difference in value and innovation that our products provide.

Feature Benefit Bullets

Package Body Material: CERAMIC

The ceramic package body material provides excellent thermal conductivity and stability, making it ideal for high-performance applications.

Surface Mount: YES

Being surface mountable makes this IC easy to install and reduces the overall size of the final product, saving space on the PCB.

Package Shape: SQUARE

The square package shape allows for efficient use of space on the PCB, enabling compact designs without compromising functionality.

Power Supplies (V): 5

With a 5V power supply, this IC is compatible with standard power sources, making it versatile for a wide range of applications.

No. of Terminals: 16

Having 16 terminals provides ample connectivity options, allowing for versatile connections and integration with other components.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers enhanced thermal performance and reliable electrical connections, ensuring stable operation in various conditions.

Terminal Position: QUAD

The quad terminal position allows for easy routing of connections on the PCB, simplifying the assembly process and reducing the risk of signal interference.

Technology: GAAS

Utilizing Gallium Arsenide (GaAs) technology, this IC offers high-speed performance and low noise characteristics, making it suitable for telecom interface applications.

Terminal Form: NO LEAD

The absence of leads ensures reliable electrical connections and reduces the risk of solder joint failures, improving the overall durability of the product.

Nominal Supply Voltage: 5 V

Having a nominal supply voltage of 5V allows for compatibility with standard power sources, simplifying the design and integration process.

Terminal Pitch: 1.27 mm

The terminal pitch of 1.27mm enables high-density mounting on the PCB, maximizing connectivity in a limited space and improving overall system performance.

Technical Specifications

Other Function Telecom Interface ICs HMC124 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N16

No. of Terminals:

16

Package Body Material:

CERAMIC

Package Code:

Package Equivalence Code:

LCC16,.3SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

GAAS

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Trade Compliance

HMC124 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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