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HMC1023LP5ETR

Analog Devices

HMC1023LP5ETR by Analog Devices

HMC1023LP5ETR by Analog Devices is a 32-terminal telecom IC with a package style of chip carrier. It operates b/w -40 to 85°C, with a peak reflow temperature of 260°C. Ideal for telecom circuits, it has a nominal voltage of 5V and terminal pitch of 0.5mm.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 4,500 parts In-Stock

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Vyrian

USA . 1,026 parts In-Stock

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Digiode

USA . 874 parts In-Stock

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Nova Conductors

Japan . 68 parts In-Stock

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AZTECH Wire

Italy . 433 parts In-Stock

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$5.725

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$5.725

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Parana Technologies

USA . 4,796 parts In-Stock

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$15.545

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$14.457

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IDEA Electronic Components Group

UK . 868 parts In-Stock

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$16.715

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$15.879

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$15.879

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868

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$15.879

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DigiPath Technology Company

USA . 4,796 parts In-Stock

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$26.075

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$25.032

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$25.032

4,796

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$25.032

One Stop Electronics

USA . 1,612 parts In-Stock

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$208.000

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Semicontronic

India . 1,330 parts In-Stock

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$955.000

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$931.125

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$926.350

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Continental Prestige Electronics

USA . 5,932 parts In-Stock

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Lixinc

USA . 5,637 parts In-Stock

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Argo Parts USA

USA . 3,668 parts In-Stock

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Corphita

USA . 333 parts In-Stock

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333

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Bastille Electronics

Australia . 200 parts In-Stock

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Overview

Discover the cutting-edge HMC1023LP5ETR by Analog Devices, a top-tier manufacturer known for their superior quality. This Telecom Interface IC offers unparalleled performance and reliability in various applications. With a compact design and industrial-grade temperature range, this product is a game-changer in the telecom industry. Experience seamless connectivity and efficiency with the HMC1023LP5ETR, providing value and benefits that exceed expectations. Elevate your projects with this innovative solution today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials offer good durability and heat resistance, ensuring the longevity and reliability of the product.

Surface Mount: YES

Surface mount capability allows for easy and efficient integration into circuit boards, saving space and simplifying assembly.

Package Shape: SQUARE

Square package shape facilitates uniform and compact component placement on the PCB, optimizing board layout and space usage.

No. of Terminals: 32

Having 32 terminals provides ample connectivity options for interfacing with other components and devices in a telecom system.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile design enhances heat dissipation, thermal management, and space-saving potential in the telecom application.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures stable performance even in harsh environmental conditions, making this product suitable for industrial applications.

Nominal Supply Voltage: 5 V

Operating at a standard nominal supply voltage of 5 V simplifies power management and compatibility with common power sources in telecom systems.

Technical Specifications

Other Function Telecom Interface ICs HMC1023LP5ETR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Analog Devices

Specs

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

HMC1023LP5ETR Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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