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HMC1094LP3E

Analog Devices

HMC1094LP3E by Analog Devices

Analog Devices' HMC1094LP3E is a telecom IC with 16 terminals in a square chip carrier package. Operating temperature range from -40 to 85°C, suitable for industrial use. Nominal voltage of 3.3V, ideal for telecom circuit applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

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Analog Devices Inc

USA . 15 parts In-Stock

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Vyrian

USA . 11,608 parts In-Stock

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Cyclops Electronics Ltd

UK . 2,034 parts In-Stock

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Digiode

USA . 44 parts In-Stock

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Nova Conductors

Japan . 44 parts In-Stock

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Aztec Data Supply Inc.

USA . 10 parts In-Stock

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$5.940

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$5.940

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Parana Technologies

USA . 1,907 parts In-Stock

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$7.965

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$7.407

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IDEA Electronic Components Group

UK . 1,161 parts In-Stock

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$8.564

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$8.136

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Corohmni

South Africa . 594 parts In-Stock

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$11.405

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DigiPath Technology Company

USA . 1,002 parts In-Stock

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$13.360

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$12.825

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$12.825

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Semicontronic

India . 8,249 parts In-Stock

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$347.000

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$338.325

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$336.590

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Ampacity Inc.

Singapore . 8,508 parts In-Stock

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$855.000

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Authorized Procurement Solutions

USA . 15,000 parts In-Stock

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Lixinc

USA . 3,794 parts In-Stock

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Continental Prestige Electronics

USA . 3,749 parts In-Stock

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Argo Parts USA

USA . 3,738 parts In-Stock

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Bastille Electronics

Australia . 1,000 parts In-Stock

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GreenTree Electronics

Israel . 1,000 parts In-Stock

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Corphita

USA . 516 parts In-Stock

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Overview

Unlock the power of seamless communication with the HMC1094LP3E by Analog Devices. Crafted with precision and expertise, this telecom interface IC offers unparalleled quality and reliability. Designed for various applications in the telecommunications industry, this product provides customers with a competitive edge through its innovative features and advanced technology. Experience the value and benefits of Analog Devices' cutting-edge solutions with the HMC1094LP3E - where excellence meets performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for telecom applications.

Surface Mount: YES

This surface mount design simplifies the assembly process and saves valuable PCB space in telecom systems.

Package Shape: SQUARE

The square package shape allows for efficient layout on the PCB and optimal use of space in telecom devices.

No. of Terminals: 16

With 16 terminals, this product offers a high level of connectivity for various telecom interface functions.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The innovative package style of chip carrier, heat sink/slug, and very thin profile ensures efficient heat dissipation and compact design for telecom applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable performance in demanding telecom environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C makes this product suitable for use in extreme temperature conditions.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides excellent solderability and conductivity for reliable telecom connections.

Terminal Position: QUAD

The quad terminal position simplifies the installation process and ensures stable connections in telecom systems.

Maximum Seated Height: 1 mm

The maximum seated height of 1 mm allows for a low-profile design, making it ideal for space-constrained telecom applications.

Width: 3 mm

With a width of 3 mm, this product is compact and can easily fit into tight spaces in telecom equipment.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures proper soldering and assembly of this telecom IC.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C guarantees secure solder joints and reliable performance in telecom devices.

Length: 3 mm

The length of 3 mm provides a compact form factor for this telecom IC, ideal for space-efficient designs.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh industrial environments where telecom devices may be used.

Terminal Form: NO LEAD

The no lead terminal form is environmentally friendly and compliant with regulations, making it a sustainable choice for telecom applications.

Telecom IC Type: TELECOM CIRCUIT

Designed specifically for telecom circuits, this product offers specialized features and functionality for telecom applications.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3 V is common in telecom systems, making this product compatible with existing infrastructure.

Terminal Pitch: 0.5 mm

The terminal pitch of 0.5 mm allows for high-density packaging and efficient use of space in telecom PCB layouts.

Technical Specifications

Other Function Telecom Interface ICs HMC1094LP3E attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Analog Devices

Specs

JESD-30 Code:

S-PQCC-N16

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

HMC1094LP3E Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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