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ADRV9008BBCZ-1REEL

Analog Devices

ADRV9008BBCZ-1REEL by Analog Devices

Analog Devices ADRV9008BBCZ-1REEL is a telecom IC with 196 terminals in a low profile grid array package. It operates b/w -40 to 85°C, with a nominal voltage of 1.3V. Ideal for telecom circuit applications requiring fine pitch and bottom terminal position.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Vyrian

USA . 4,032 parts In-Stock

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Digiode

USA . 911 parts In-Stock

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VNN

France . 622 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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AZTECH Wire

Italy . 333 parts In-Stock

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$5.241

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$5.241

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Aztec Data Supply Inc.

USA . 566 parts In-Stock

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$6.420

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Parana Technologies

USA . 3,727 parts In-Stock

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$7.508

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$6.982

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IDEA Electronic Components Group

UK . 1,687 parts In-Stock

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$8.073

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$7.669

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DigiPath Technology Company

USA . 1,921 parts In-Stock

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$12.594

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$12.090

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$12.090

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Corohmni

South Africa . 382 parts In-Stock

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$17.826

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Andel Nordic

Denmark . 3,579 parts In-Stock

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$21.230

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$14.860

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$14.860

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One Stop Electronics

USA . 383 parts In-Stock

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$413.000

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Semicontronic

India . 304 parts In-Stock

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$558.000

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$544.050

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$541.260

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Ampacity Inc.

Singapore . 1,036 parts In-Stock

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$748.000

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Argo Parts USA

USA . 4,867 parts In-Stock

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Continental Prestige Electronics

USA . 2,060 parts In-Stock

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Robosynatics

Brazil . 500 parts In-Stock

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Lucentia Tech

USA . 500 parts In-Stock

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$15.715

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$14.552

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$14.552

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Corphita

USA . 330 parts In-Stock

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Bastille Electronics

Australia . 200 parts In-Stock

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Overview

Elevate your telecom systems with the ADRV9008BBCZ-1REEL by Analog Devices, a cutting-edge Telecom Interface IC that promises top-notch quality and reliability from a trusted manufacturer. This versatile component boasts a wide range of applications in the telecommunications industry, offering seamless integration and exceptional performance. With its innovative design and advanced features, customers can expect unparalleled value, benefits, and advantages that will take their projects to the next level. Trust Analog Devices to deliver excellence with the ADRV9008BBCZ-1REEL.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good insulation and protection for the internal components, ensuring reliable performance and longevity.

Surface Mount: YES

Surface mount design allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Package Shape: SQUARE

Square shape helps in efficient use of space on the circuit board, making it suitable for compact designs.

No. of Terminals: 196

High number of terminals allow for multiple connections, enabling complex telecom functionalities.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Grid array, low profile, and fine pitch package style offers high density integration and improved signal performance.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures stable performance even under demanding conditions.

Minimum Operating Temperature: -40 °C

Wide range of operating temperature allows the product to function in various environments.

Terminal Position: BOTTOM

Bottom terminal position enhances PCB layout flexibility and ease of connection.

Maximum Seated Height: 1.27 mm

Low seated height helps in achieving slim and compact designs for space-constrained applications.

Width: 12 mm

Compact width enables the product to fit into tight spaces on the PCB.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures reliable soldering during manufacturing processes.

Length: 12 mm

Compact length contributes to the overall space-saving design of the product.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures the product can withstand harsh environmental conditions.

Terminal Form: BALL

Ball terminal form facilitates secure and reliable connections on the PCB.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom circuit applications, ensuring optimized performance in telecommunications systems.

Nominal Supply Voltage: 1.3 V

Low nominal supply voltage helps in reducing power consumption and enhancing energy efficiency.

Terminal Pitch: 0.8 mm

Fine terminal pitch allows for high-density integration and ensures precise signal routing.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates moderate sensitivity to moisture, making the product suitable for standard assembly and handling practices.

Technical Specifications

Other Function Telecom Interface ICs ADRV9008BBCZ-1REEL attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Analog Devices

Specs

JESD-30 Code:

S-PBGA-B196

Length:

12 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

196

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.27 mm

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

12 mm

Trade Compliance

ADRV9008BBCZ-1REEL Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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