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ADRV9004BBCZ

Analog Devices

ADRV9004BBCZ by Analog Devices

Analog Devices ADRV9004BBCZ is a telecom IC with 2 functions, operating b/w -40 to 85°C. It features a grid array package with 196 terminals and 0.8mm pitch, suitable for telecom interface applications. The PLASTIC/EPOXY body material and bottom terminal position make it ideal for surface mount assembly.

Median Price

$407.926

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 51,531 parts In-Stock

1+ parts

$314.447

100+ parts

-

1k+ parts

-

10k+ parts

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51,531

$314.447

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-

Analog Devices Inc

USA . 41,564 parts In-Stock

1+ parts

$378.580

100+ parts

$321.528

1k+ parts

$277.750

10k+ parts

-

41,564

$378.580

$321.528

$277.750

-

Farnell

UK . 64 parts In-Stock

1+ parts

$398.724

100+ parts

-

1k+ parts

-

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64

$398.724

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-

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Element14

Singapore . 64 parts In-Stock

1+ parts

$417.128

100+ parts

-

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64

$417.128

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Mouser Electronics

USA . 96 parts In-Stock

1+ parts

$430.430

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-

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-

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96

$430.430

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Newark

USA . 1 parts In-Stock

1+ parts

$443.340

100+ parts

$377.010

1k+ parts

-

10k+ parts

-

1

$443.340

$377.010

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 830 parts In-Stock

1+ parts

$328.462

100+ parts

-

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-

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830

$328.462

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Vyrian

USA . 5,573 parts In-Stock

1+ parts

-

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5,573

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VNN

France . 619 parts In-Stock

1+ parts

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619

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Nova Conductors

Japan . 500 parts In-Stock

1+ parts

-

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500

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Cyclops Electronics Ltd

UK . 16 parts In-Stock

1+ parts

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-

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16

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Semtec, LLC

USA . 2 parts In-Stock

1+ parts

-

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2

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 1,894 parts In-Stock

1+ parts

$10.249

100+ parts

$10.249

1k+ parts

$10.249

10k+ parts

-

1,894

$10.249

$10.249

$10.249

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Parana Technologies

USA . 508 parts In-Stock

1+ parts

$11.512

100+ parts

-

1k+ parts

$10.707

10k+ parts

-

508

$11.512

-

$10.707

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IDEA Electronic Components Group

UK . 960 parts In-Stock

1+ parts

$12.379

100+ parts

$11.760

1k+ parts

$11.760

10k+ parts

-

960

$12.379

$11.760

$11.760

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Aztec Data Supply Inc.

USA . 2,952 parts In-Stock

1+ parts

$15.240

100+ parts

-

1k+ parts

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2,952

$15.240

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Corohmni

South Africa . 247 parts In-Stock

1+ parts

$17.509

100+ parts

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247

$17.509

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DigiPath Technology Company

USA . 539 parts In-Stock

1+ parts

$19.311

100+ parts

$18.539

1k+ parts

-

10k+ parts

$18.539

539

$19.311

$18.539

-

$18.539

Ampacity Inc.

Singapore . 8,544 parts In-Stock

1+ parts

$308.710

100+ parts

-

1k+ parts

-

10k+ parts

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8,544

$308.710

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Semicontronic

India . 8,207 parts In-Stock

1+ parts

$308.710

100+ parts

$300.992

1k+ parts

$299.449

10k+ parts

-

8,207

$308.710

$300.992

$299.449

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Corphita

USA . 468 parts In-Stock

1+ parts

$311.175

100+ parts

-

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468

$311.175

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Continental Prestige Electronics

USA . 66 parts In-Stock

1+ parts

$325.760

100+ parts

-

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66

$325.760

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Bastille Electronics

Australia . 450 parts In-Stock

1+ parts

-

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450

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Argo Parts USA

USA . 173 parts In-Stock

1+ parts

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173

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Overview

Unlock the power of seamless connectivity with the ADRV9004BBCZ by Analog Devices. Manufactured to the highest quality standards, this telecom interface IC offers unparalleled performance and reliability. With a wide range of applications in telecommunications and beyond, this versatile product is designed to meet your unique needs. Experience the value of cutting-edge technology and maximize efficiency with the ADRV9004BBCZ. Elevate your projects with ease and precision - choose Analog Devices for superior solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the integrated circuits, ensuring longevity and reliable performance.

Surface Mount: YES

Enables easy and efficient mounting on PCBs, reducing assembly time and effort.

No. of Functions: 2

Offers multiple functions in a single component, saving space and simplifying circuit design.

Package Shape: SQUARE

Facilitates uniform placement on the circuit board, enhancing overall aesthetics and organization.

No. of Terminals: 196

Provides a high number of connection points for versatile integration and compatibility with various systems.

Maximum Operating Temperature: 85 °C

Ensures stable performance even under high temperature conditions, making it suitable for diverse environments.

Minimum Operating Temperature: -40 °C

Operates efficiently in low-temperature environments, enhancing its versatility and reliability.

Terminal Position: BOTTOM

Facilitates easy installation and connectivity, ensuring a secure and stable connection.

Maximum Seated Height: 1.25 mm

Offers a low-profile design, ideal for space-constrained applications and compact electronic devices.

Width: 12 mm

Compact width dimension that allows for efficient PCB layout and integration in various electronic systems.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering and reflow process, contributing to the reliability and performance of the product.

Peak Reflow Temperature °C: 260

Can withstand high-temperature reflow process for soldering, ensuring durability and long-term functionality.

Length: 12 mm

Compact length dimension that fits well within electronic assemblies or systems, optimizing space usage.

Terminal Form: BALL

Provides reliable connection points with good conductivity, enhancing overall performance and signal transmission.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom applications, ensuring compatibility and optimal performance in telecommunications systems.

Nominal Supply Voltage: 1 V

Operates efficiently at a low supply voltage, ideal for energy-efficient and low-power consumption applications.

Terminal Pitch: 0.8 mm

Provides a tight pitch for compact layout and integration, enhancing efficiency and space savings in PCB designs.

Moisture Sensitivity Level (MSL): 3

Designed to withstand moderate moisture exposure, ensuring reliability and performance in various environmental conditions.

Technical Specifications

Other Function Telecom Interface ICs ADRV9004BBCZ attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Analog Devices

Specs

JESD-30 Code:

S-PBGA-B196

Length:

12 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

2

No. of Terminals:

196

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.25 mm

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Telecom IC Type:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Trade Compliance

ADRV9004BBCZ Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

Category top products 20

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