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ADRV9008BBCZ-2REEL

Analog Devices

ADRV9008BBCZ-2REEL by Analog Devices

Analog Devices ADRV9008BBCZ-2REEL is a telecom IC with 196 terminals in a grid array package. It operates b/w -40 to 85°C, with a supply voltage of 1.3V. Ideal for telecom circuits, it features low profile and fine pitch design for industrial applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,132 parts In-Stock

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VNN

France . 4,244 parts In-Stock

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Digiode

USA . 437 parts In-Stock

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437

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 608 parts In-Stock

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$11.124

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$10.345

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608

$11.124

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$10.345

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IDEA Electronic Components Group

UK . 1,876 parts In-Stock

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$11.961

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$11.363

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$11.363

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$11.961

$11.363

$11.363

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DigiPath Technology Company

USA . 304 parts In-Stock

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$18.659

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$17.913

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$17.913

304

$18.659

$17.913

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$17.913

AZTECH Wire

Italy . 862 parts In-Stock

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$19.157

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$19.157

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One Stop Electronics

USA . 1,466 parts In-Stock

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$154.000

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Semicontronic

India . 242 parts In-Stock

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$245.000

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$238.875

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$237.650

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242

$245.000

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$237.650

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Ampacity Inc.

Singapore . 132 parts In-Stock

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$501.000

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Corphita

USA . 460 parts In-Stock

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460

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Bastille Electronics

Australia . 67 parts In-Stock

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Overview

Elevate your telecom interface applications with the ADRV9008BBCZ-2REEL by Analog Devices, a top-tier manufacturer known for its quality and reliability in the industry. This cutting-edge IC offers unmatched performance and versatility, making it the ideal choice for a wide range of telecom functions. Experience seamless integration, superior functionality, and exceptional value with this innovative product. Trust Analog Devices to deliver excellence in every aspect of your telecom projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide durability and reliability for long-term use.

Surface Mount: YES

Ease of installation and compatibility with modern PCB assembly processes.

Package Shape: SQUARE

Compact design to save space on the PCB.

No. of Terminals: 196

Sufficient number of terminals for versatile connectivity options.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Efficient use of space on the PCB with a low profile design and fine pitch for high-density applications.

Maximum Operating Temperature: 85 °C

High maximum operating temperature for reliable performance in varying environmental conditions.

Nominal Supply Voltage: 1.3 V

Optimal supply voltage for efficient power consumption.

Terminal Pitch: 0.8 mm

Close terminal pitch for high-density connections and efficient signal transmission.

Technical Specifications

Other Function Telecom Interface ICs ADRV9008BBCZ-2REEL attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Analog Devices

Specs

JESD-30 Code:

S-PBGA-B196

Length:

12 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

196

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.27 mm

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

12 mm

Trade Compliance

ADRV9008BBCZ-2REEL Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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