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ADRV9004BBCZ-RL

Analog Devices

ADRV9004BBCZ-RL by Analog Devices

Analog Devices ADRV9004BBCZ-RL is a telecom IC with 2 functions, operating b/w -40 to 85°C. It has 196 terminals in a square grid array package style, suitable for telecom circuit applications. With a nominal voltage of 1V and terminal pitch of 0.8mm, it offers high performance in a compact form factor.

Median Price

$314.447

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

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Verical

USA . 1,500 parts In-Stock

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$314.447

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Vyrian

USA . 8,288 parts In-Stock

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Digiode

USA . 388 parts In-Stock

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VNN

France . 356 parts In-Stock

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Nova Conductors

Japan . 28 parts In-Stock

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Distributors (Availability)

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Parana Technologies

USA . 3,664 parts In-Stock

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$9.541

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$8.873

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IDEA Electronic Components Group

UK . 1,835 parts In-Stock

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$10.259

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$9.746

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$9.746

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Aztec Data Supply Inc.

USA . 4,691 parts In-Stock

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$10.630

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AZTECH Wire

Italy . 364 parts In-Stock

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$11.640

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DigiPath Technology Company

USA . 1,455 parts In-Stock

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$16.004

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$15.364

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Corohmni

South Africa . 345 parts In-Stock

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$17.002

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Ampacity Inc.

Singapore . 1,215 parts In-Stock

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$308.710

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Semicontronic

India . 1,418 parts In-Stock

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$671.890

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$655.093

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$651.733

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$651.733

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Argo Parts USA

USA . 2,630 parts In-Stock

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Continental Prestige Electronics

USA . 1,219 parts In-Stock

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Corphita

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Bastille Electronics

Australia . 31 parts In-Stock

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Overview

Discover the cutting-edge ADRV9004BBCZ-RL by Analog Devices, a top-quality telecom interface IC that boasts unmatched performance and reliability. This innovative product is a game-changer in the industry, offering endless possibilities for applications in various sectors. Analog Devices, known for its superior technology and exceptional engineering, has once again delivered a product that exceeds expectations. With a wide range of benefits and advantages, including high efficiency and seamless integration, the ADRV9004BBCZ-RL provides exceptional value to customers looking for top-notch telecom solutions. Experience the difference with Analog Devices and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the telecom interface ICs, making them suitable for a variety of environments.

Surface Mount: YES

The surface mount design allows for easy and efficient installation of the ICs onto a circuit board, saving time and hassle during assembly.

No. of Functions: 2

Having two functions in one IC can offer more versatility and functionality in telecom applications.

Package Shape: SQUARE

The square shape provides a compact form factor, allowing for efficient use of space on the circuit board.

No. of Terminals: 196

Having a high number of terminals allows for a greater connectivity range, enabling the ICs to handle more complex telecom tasks.

Nominal Supply Voltage: 1 V

The low nominal supply voltage helps in reducing power consumption and heat generation, making the ICs energy-efficient.

Technical Specifications

Other Function Telecom Interface ICs ADRV9004BBCZ-RL attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Analog Devices

Specs

JESD-30 Code:

S-PBGA-B196

Length:

12 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

2

No. of Terminals:

196

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.25 mm

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Telecom IC Type:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Trade Compliance

ADRV9004BBCZ-RL Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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