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RN41N-I/RM615

Microchip Technology

RN41N-I/RM615 by Microchip Technology

Microchip Technology's RN41N-I/RM615 is a telecom IC with 35 terminals, operating from -40 to 85°C. It has a supply voltage of 3.3V and is surface mountable in industrial applications. The package style is rectangular, measuring 13.2mm in width and 20.1mm in length, making it suitable for various telecom interface functions.

Median Price

$26.680

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 6,888 parts In-Stock

1+ parts

$26.680

100+ parts

$22.960

1k+ parts

-

10k+ parts

-

6,888

$26.680

$22.960

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-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 450 parts In-Stock

1+ parts

$22.960

100+ parts

-

1k+ parts

-

10k+ parts

-

450

$22.960

-

-

-

Vyrian

USA . 6,470 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,470

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 2,387 parts In-Stock

1+ parts

$11.420

100+ parts

-

1k+ parts

-

10k+ parts

-

2,387

$11.420

-

-

-

AZTECH Wire

Italy . 624 parts In-Stock

1+ parts

$12.914

100+ parts

-

1k+ parts

-

10k+ parts

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624

$12.914

-

-

-

Corohmni

South Africa . 697 parts In-Stock

1+ parts

$16.711

100+ parts

-

1k+ parts

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10k+ parts

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697

$16.711

-

-

-

Continental Prestige Electronics

USA . 2,495 parts In-Stock

1+ parts

$22.960

100+ parts

-

1k+ parts

-

10k+ parts

$22.501

2,495

$22.960

-

-

$22.501

Semicontronic

India . 1,467 parts In-Stock

1+ parts

$135.000

100+ parts

$131.625

1k+ parts

$130.950

10k+ parts

-

1,467

$135.000

$131.625

$130.950

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Ampacity Inc.

Singapore . 438 parts In-Stock

1+ parts

$264.000

100+ parts

-

1k+ parts

-

10k+ parts

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438

$264.000

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Authorized Procurement Solutions

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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6,000

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Argo Parts USA

USA . 4,197 parts In-Stock

1+ parts

-

100+ parts

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4,197

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Fulton Briggs Corp.

USA . 2,461 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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2,461

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Overview

Experience seamless connectivity and optimal performance with the RN41N-I/RM615 by Microchip Technology. As a trusted industry leader, Microchip Technology delivers high-quality telecom interface ICs that are built to last. Whether you're in need of reliable communication solutions for industrial applications or IoT devices, this product offers unparalleled value and versatility. Say goodbye to connectivity issues and hello to a world of possibilities with the RN41N-I/RM615.

Feature Benefit Bullets

Surface Mount: YES

Surface mount packaging allows for easy and efficient assembly onto PCBs, saving space and reducing manufacturing costs.

Package Shape: RECTANGULAR

Rectangular package shape provides a standardized form factor for easy integration into existing circuit designs.

No. of Terminals: 35

The high number of terminals allows for complex connectivity and functionality in telecom applications.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance in a variety of environmental conditions.

Minimum Operating Temperature: -40 °C

Wide operating temperature range allows for use in both extreme cold and hot environments.

Terminal Finish: MATTE TIN

Matte tin finish provides excellent solderability and reliability for long-term use.

Width: 13.2 mm

Compact width allows for space-saving integration into densely packed electronic systems.

Length: 20.1 mm

Optimal length for fitting into standard PCB layouts and enclosures.

Nominal Supply Voltage: 3.3 V

Common supply voltage simplifies power management and compatibility with other components in the system.

Technical Specifications

Other Function Telecom Interface ICs RN41N-I/RM615 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Microchip Technology

Specs

JESD-30 Code:

R-XQMA-N35

JESD-609 Code:

e3

Length:

20.1 mm

No. of Functions:

1

No. of Terminals:

35

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Maximum Seated Height:

2.2 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Position:

QUAD

Width:

13.2 mm

Trade Compliance

RN41N-I/RM615 Telecommunications trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8529.90.22.00

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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