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RN41-I/RM615

Microchip Technology

RN41-I/RM615 by Microchip Technology

Microchip Technology's RN41-I/RM615 is a telecom IC with 32 terminals, operating at -40 to 85°C. It has a supply voltage of 3.3V and matte tin finish, suitable for industrial applications. This surface-mount IC in rectangular package measures 13.2mm x 25.8mm with a seated height of 2.2mm, ideal for telecom interface functions.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,394 parts In-Stock

1+ parts

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1,394

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Nova Conductors

Japan . 15 parts In-Stock

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15

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 299 parts In-Stock

1+ parts

$9.770

100+ parts

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299

$9.770

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AZTECH Wire

Italy . 636 parts In-Stock

1+ parts

$15.840

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636

$15.840

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Corohmni

South Africa . 351 parts In-Stock

1+ parts

$16.607

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351

$16.607

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Ampacity Inc.

Singapore . 606 parts In-Stock

1+ parts

$362.000

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606

$362.000

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Semicontronic

India . 1,575 parts In-Stock

1+ parts

$722.000

100+ parts

$703.950

1k+ parts

$700.340

10k+ parts

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1,575

$722.000

$703.950

$700.340

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Continental Prestige Electronics

USA . 5,733 parts In-Stock

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5,733

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West Coast Incorporated

USA . 5,598 parts In-Stock

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5,598

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Argo Parts USA

USA . 2,055 parts In-Stock

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2,055

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Bastille Electronics

Australia . 700 parts In-Stock

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700

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Advanced Electronics

New Zealand . 15 parts In-Stock

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15

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Overview

Experience seamless connectivity with the RN41-I/RM615 by Microchip Technology. Designed for reliability and performance, this telecom interface IC offers a wide range of applications in various industries. With its surface mount design and industrial temperature grade, this product ensures durability and longevity. Trust in the quality and expertise of Microchip Technology to deliver cutting-edge solutions that exceed expectations. Upgrade your systems today and unlock the full potential of your projects with the RN41-I/RM615.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and efficient assembly onto circuit boards, saving time and reducing manufacturing costs.

Package Shape: RECTANGULAR

Provides a compact and space-saving design, ideal for applications where board space is limited.

No. of Terminals: 32

Offers a sufficient number of connections for versatile connectivity options in telecom interfaces.

Maximum Operating Temperature: 85 °C

Ensures reliable performance in various operating environments without the risk of overheating.

Minimum Operating Temperature: -40 °C

Allows for operation in cold temperatures, expanding the product's usability in diverse conditions.

Terminal Finish: MATTE TIN

Provides a durable and corrosion-resistant finish for long-term reliability in telecom applications.

Width: 13.2 mm

Compact width allows for efficient use of board space, especially in small form factor devices.

Length: 25.8 mm

Optimal length for accommodating all 32 terminals while maintaining a compact size.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments, ensuring durability and long-lasting performance.

Nominal Supply Voltage: 3.3 V

Compatible with common voltage requirements in telecom systems, simplifying integration into existing setups.

Technical Specifications

Other Function Telecom Interface ICs RN41-I/RM615 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Microchip Technology

Specs

JESD-30 Code:

R-XXMA-N32

JESD-609 Code:

e3

Length:

25.8 mm

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Maximum Seated Height:

2.2 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Position:

UNSPECIFIED

Width:

13.2 mm

Trade Compliance

RN41-I/RM615 Telecommunications trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8529.90.22.00

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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